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Proceedings Papers

Evaluation of Warpage Deformation in Semiconductor Device Packaging Process

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Taiju Yagi, Qiang Yu, Haruyuki Shimada, Yuichi Yanaka, Takashi Masuko
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140852
https://doi.org/10.1115/IPACK2024-140852
View Paper titled, Evaluation of Warpage Deformation in Semiconductor Device Packaging Process
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Topics: Deformation, Finite element methods, Resins, Semiconductor device packaging, Semiconductors (Materials), Warping, Packaging, Shrinkage (Materials), Simulation, Anisotropy
Proceedings Papers

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

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Pradeep Lall, Padmanava Choudhury, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74060
https://doi.org/10.1115/IPACK2021-74060
View Paper titled, Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications
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Topics: Electronics, Reliability, Surface preparation, Stress, Adhesives, Biometry, Diluents, Dust, Finite element model, Flexible electronics
Proceedings Papers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

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Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2528
https://doi.org/10.1115/IPACK2020-2528
View Paper titled, Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application
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Topics: Computers, Design, Diluents, Glass, Internet, Manufacturing, Packaging, Semiconductor wafers, Semiconductors (Materials), Smart appliances
Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

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Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48814
https://doi.org/10.1115/IPACK2015-48814
View Paper titled, Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps
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Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities
Proceedings Papers

Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment

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Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Kazuma Obata, Katsuhiro Koizumi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A044, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48600
https://doi.org/10.1115/IPACK2015-48600
View Paper titled, Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment
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Topics: Density, Electronic equipment, Flow (Dynamics), Network analysis, Packaging, Air flow, Computational fluid dynamics, Cooling, Design, Diluents
Proceedings Papers

Optimum Design and Operation of Thermoelectric Heat Pump With Two Temperatures

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Kazuaki Yazawa, Ali Shakouri
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A080, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48682
https://doi.org/10.1115/IPACK2015-48682
View Paper titled, Optimum Design and Operation of Thermoelectric Heat Pump With Two Temperatures
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Topics: Design, Heat pumps, Temperature, Cooling, Heat, Heat sinks, Diluents, Energy generation, Reservoirs, Computer cooling
Proceedings Papers

Enhancement and Optimization of Planar Impingement Heat Transfer for Thermoelectric Power Generation

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Kazuaki Yazawa, Stephen D. Heister, Timothy S. Fisher
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A081, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48692
https://doi.org/10.1115/IPACK2015-48692
View Paper titled, Enhancement and Optimization of Planar Impingement Heat Transfer for Thermoelectric Power Generation
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Topics: Energy generation, Heat transfer, Optimization, Flow (Dynamics), Fluids, Design, Temperature, Heat exchangers, Generators, Orifices
Proceedings Papers

New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP

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Yukio Nakamura, Kenichi Oohashi, Koji Morita, Shuji Nomoto, Takayuki Suzuki, Shin Takanezawa, Shinji Tsuchikawa, Masaaki Takekoshi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48836
https://doi.org/10.1115/IPACK2015-48836
View Paper titled, New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP
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Topics: Density, Diluents, Fillers (Materials), Package on package, Resins, Thermal expansion, Warping
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

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David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48447
https://doi.org/10.1115/IPACK2015-48447
View Paper titled, A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface
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Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency

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Jingshi Meng, Abhijit Dasgupta
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A042, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48669
https://doi.org/10.1115/IPACK2015-48669
View Paper titled, Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency
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Topics: Failure mechanisms, Resonance, Reflection, Stress, Circuits, Diluents, Disperse systems, Electrical wires, Impulse (Physics), Microelectromechanical systems
Proceedings Papers

Effects of Non-Uniform Heating on Two-Phase Flow Through Microchannels

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Susan N. Ritchey, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A012, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73058
https://doi.org/10.1115/IPACK2013-73058
View Paper titled, Effects of Non-Uniform Heating on Two-Phase Flow Through Microchannels
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Topics: Heating, Microchannels, Two-phase flow, Heat sinks, Flow (Dynamics), Heat, Flux (Metallurgy), Heat flux, Boiling, Diluents
Proceedings Papers

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

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Ahmad Jalilvand, Masataka Mochizuki, Yuji Saito, Yoji Kawahara, Vijit Wuttijumnong, Thang Nguyen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 367-375, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52267
https://doi.org/10.1115/IPACK2011-52267
View Paper titled, Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan
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Topics: Diluents, Heat pipes, Cooling, Laptop computers, Packaging, Acoustics, Condensers (steam plant), Density, Flat heat pipes, Heat
Proceedings Papers

Determination and Verification of Silicon Die Strength Using Ball-Breaker Test

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Pei-Chi Chen, Shin-Yueh Yang, Kuo-Ning Chiang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 299-305, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52200
https://doi.org/10.1115/IPACK2011-52200
View Paper titled, Determination and Verification of Silicon Die Strength Using Ball-Breaker Test
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Topics: Silicon, Fracture (Materials), Finite element methods, Semiconductor wafers, Computer software, Diluents, Electronic packaging, Failure, Failure mechanisms, Packaging density (Electronics)
Proceedings Papers

Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)

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Pin-Chuan Chen, Michael W. Mitchell, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 129-135, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33330
https://doi.org/10.1115/IPACK2007-33330
View Paper titled, Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)
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Topics: Chain, Flow (Dynamics), Temperature, Temperature distribution, Biomedical microelectromechanical systems, Liquid crystals, Copper, Thermal management, Thermocouples, Thin films
Proceedings Papers

Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips

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Yuki Sato, Hideo Miura
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 473-479, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33257
https://doi.org/10.1115/IPACK2007-33257
View Paper titled, Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips
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Topics: Failure, Nondestructive evaluation, Deformation, Delamination, Finite element analysis, Surface deformation, Diluents, Epoxy resins, Lasers, Microscopes
Proceedings Papers

Laminar Cross-Flow Conjugated Forced Convection Heat Transfer From a Cylinder With Fins

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Bassam A. K. Abu-Hijleh
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 565-570, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33553
https://doi.org/10.1115/IPACK2007-33553
View Paper titled, Laminar Cross-Flow Conjugated Forced Convection Heat Transfer From a Cylinder With Fins
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Topics: Cross-flow, Cylinders, Fins, Forced convection, Heat transfer, Diluents, Reynolds number
Proceedings Papers

Engineering New Package Ideal Materials Using Polymer Resins and Nanoparticles

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Vijay Sarihan, Steven Xu, Beth Keser
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 965-969, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33312
https://doi.org/10.1115/IPACK2007-33312
View Paper titled, Engineering New Package Ideal Materials Using Polymer Resins and Nanoparticles
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Topics: Nanoparticles, Polymers, Resins, Reliability, Materials properties, Packaging, Particulate matter, Simulation, Composite materials, Diluents
Proceedings Papers

Deformation Analysis of Center-Anchored Square Plate Induced by Residual Gradient Stress

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Pen-Lun Chang, Meng-Ju Lin, Tsung-Li Fan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 783-787, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73430
https://doi.org/10.1115/IPACK2005-73430
View Paper titled, Deformation Analysis of Center-Anchored Square Plate Induced by Residual Gradient Stress
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Topics: Deformation, Stress, Warping, Metals, Mirrors, Shapes, Temperature, Diluents, Finite element methods, Materials properties
Proceedings Papers

A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures

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Hisashi Tanie, Takeshi Terasaki, Yasuhiro Naka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1229-1235, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73331
https://doi.org/10.1115/IPACK2005-73331
View Paper titled, A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures
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Topics: Fatigue life, Semiconductors (Materials), Solders, Crack propagation, Fracture (Materials), Ball-Grid-Array packaging, Solder joints, Surface mount devices, Diluents, Damage
Proceedings Papers

Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures

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Yuhki Sato, Hideo Miura
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1587-1592, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73109
https://doi.org/10.1115/IPACK2005-73109
View Paper titled, Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures
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Topics: Failure, Flip-chip, Flip-chip devices, Nondestructive evaluation, Deformation, Silicon chips, Adhesion, Bonding, Delamination, Diluents