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Proceedings Papers

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021
Paper No: IPACK2021-74060
DOI: https://doi.org/10.1115/IPACK2021-74060
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Topics: Electronics, Reliability, Surface preparation, Stress, Adhesives, Biometry, Diluents, Dust, Finite element model, Flexible electronics
Proceedings Papers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Paper No: IPACK2020-2528
DOI: https://doi.org/10.1115/IPACK2020-2528
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Topics: Computers, Design, Diluents, Glass, Internet, Manufacturing, Packaging, Semiconductor wafers, Semiconductors (Materials), Smart appliances
Proceedings Papers

New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP

Yukio Nakamura, Kenichi Oohashi, Koji Morita, Shuji Nomoto, Takayuki Suzuki, Shin Takanezawa, Shinji Tsuchikawa, Masaaki Takekoshi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A018, July 6–9, 2015
Paper No: IPACK2015-48836
DOI: https://doi.org/10.1115/IPACK2015-48836
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Topics: Density, Diluents, Fillers (Materials), Package on package, Resins, Thermal expansion, Warping
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Paper No: IPACK2015-48447
DOI: https://doi.org/10.1115/IPACK2015-48447
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Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency

Jingshi Meng, Abhijit Dasgupta
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A042, July 6–9, 2015
Paper No: IPACK2015-48669
DOI: https://doi.org/10.1115/IPACK2015-48669
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Topics: Failure mechanisms, Resonance, Reflection, Stress, Circuits, Diluents, Disperse systems, Electrical wires, Impulse (Physics), Microelectromechanical systems
Proceedings Papers

Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment

Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Kazuma Obata, Katsuhiro Koizumi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A044, July 6–9, 2015
Paper No: IPACK2015-48600
DOI: https://doi.org/10.1115/IPACK2015-48600
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Topics: Density, Electronic equipment, Flow (Dynamics), Network analysis, Packaging, Air flow, Computational fluid dynamics, Cooling, Design, Diluents
Proceedings Papers

Optimum Design and Operation of Thermoelectric Heat Pump With Two Temperatures

Kazuaki Yazawa, Ali Shakouri
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A080, July 6–9, 2015
Paper No: IPACK2015-48682
DOI: https://doi.org/10.1115/IPACK2015-48682
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Topics: Design, Heat pumps, Temperature, Cooling, Heat, Heat sinks, Diluents, Energy generation, Reservoirs, Computer cooling
Proceedings Papers

Enhancement and Optimization of Planar Impingement Heat Transfer for Thermoelectric Power Generation

Kazuaki Yazawa, Stephen D. Heister, Timothy S. Fisher
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A081, July 6–9, 2015
Paper No: IPACK2015-48692
DOI: https://doi.org/10.1115/IPACK2015-48692
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Topics: Energy generation, Heat transfer, Optimization, Flow (Dynamics), Fluids, Design, Temperature, Heat exchangers, Generators, Orifices
Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Paper No: IPACK2015-48814
DOI: https://doi.org/10.1115/IPACK2015-48814
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Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities
Proceedings Papers

Effects of Non-Uniform Heating on Two-Phase Flow Through Microchannels

Susan N. Ritchey, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A012, July 16–18, 2013
Paper No: IPACK2013-73058
DOI: https://doi.org/10.1115/IPACK2013-73058
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Topics: Heating, Microchannels, Two-phase flow, Heat sinks, Flow (Dynamics), Heat, Flux (Metallurgy), Heat flux, Boiling, Diluents
Proceedings Papers

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

Ahmad Jalilvand, Masataka Mochizuki, Yuji Saito, Yoji Kawahara, Vijit Wuttijumnong, Thang Nguyen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 367-375, July 6–8, 2011
Paper No: IPACK2011-52267
DOI: https://doi.org/10.1115/IPACK2011-52267
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Topics: Diluents, Heat pipes, Cooling, Laptop computers, Packaging, Acoustics, Condensers (steam plant), Density, Flat heat pipes, Heat
Proceedings Papers

Determination and Verification of Silicon Die Strength Using Ball-Breaker Test

Pei-Chi Chen, Shin-Yueh Yang, Kuo-Ning Chiang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 299-305, July 6–8, 2011
Paper No: IPACK2011-52200
DOI: https://doi.org/10.1115/IPACK2011-52200
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Topics: Silicon, Fracture (Materials), Finite element methods, Semiconductor wafers, Computer software, Diluents, Electronic packaging, Failure, Failure mechanisms, Packaging density (Electronics)
Proceedings Papers

Laminar Cross-Flow Conjugated Forced Convection Heat Transfer From a Cylinder With Fins

Bassam A. K. Abu-Hijleh
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 565-570, July 8–12, 2007
Paper No: IPACK2007-33553
DOI: https://doi.org/10.1115/IPACK2007-33553
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Topics: Cross-flow, Cylinders, Fins, Forced convection, Heat transfer, Diluents, Reynolds number
Proceedings Papers

Engineering New Package Ideal Materials Using Polymer Resins and Nanoparticles

Vijay Sarihan, Steven Xu, Beth Keser
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 965-969, July 8–12, 2007
Paper No: IPACK2007-33312
DOI: https://doi.org/10.1115/IPACK2007-33312
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Topics: Nanoparticles, Polymers, Resins, Reliability, Materials properties, Packaging, Particulate matter, Simulation, Composite materials, Diluents
Proceedings Papers

Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)

Pin-Chuan Chen, Michael W. Mitchell, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 129-135, July 8–12, 2007
Paper No: IPACK2007-33330
DOI: https://doi.org/10.1115/IPACK2007-33330
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Topics: Chain, Flow (Dynamics), Temperature, Temperature distribution, Biomedical microelectromechanical systems, Liquid crystals, Copper, Thermal management, Thermocouples, Thin films
Proceedings Papers

Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips

Yuki Sato, Hideo Miura
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 473-479, July 8–12, 2007
Paper No: IPACK2007-33257
DOI: https://doi.org/10.1115/IPACK2007-33257
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Topics: Failure, Nondestructive evaluation, Deformation, Delamination, Finite element analysis, Surface deformation, Diluents, Epoxy resins, Lasers, Microscopes
Proceedings Papers

Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures

Yuhki Sato, Hideo Miura
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1587-1592, July 17–22, 2005
Paper No: IPACK2005-73109
DOI: https://doi.org/10.1115/IPACK2005-73109
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Topics: Failure, Flip-chip, Flip-chip devices, Nondestructive evaluation, Deformation, Silicon chips, Adhesion, Bonding, Delamination, Diluents
Proceedings Papers

Deformation Analysis of Center-Anchored Square Plate Induced by Residual Gradient Stress

Pen-Lun Chang, Meng-Ju Lin, Tsung-Li Fan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 783-787, July 17–22, 2005
Paper No: IPACK2005-73430
DOI: https://doi.org/10.1115/IPACK2005-73430
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Topics: Deformation, Stress, Warping, Metals, Mirrors, Shapes, Temperature, Diluents, Finite element methods, Materials properties
Proceedings Papers

A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures

Hisashi Tanie, Takeshi Terasaki, Yasuhiro Naka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1229-1235, July 17–22, 2005
Paper No: IPACK2005-73331
DOI: https://doi.org/10.1115/IPACK2005-73331
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Topics: Fatigue life, Semiconductors (Materials), Solders, Crack propagation, Fracture (Materials), Ball-Grid-Array packaging, Solder joints, Surface mount devices, Diluents, Damage
Proceedings Papers

Thermo-Mechanical Deformation and Stress Analysis of a Flip-Chip BGA

J. D. Wu, Y. S. Lai, Y. L. Kuo, S. C. Hung, M.-H. R. Jen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 309-316, July 6–11, 2003
Paper No: IPACK2003-35082
DOI: https://doi.org/10.1115/IPACK2003-35082
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Topics: Ball-Grid-Array packaging, Deformation, Flip-chip, Stress analysis (Engineering), Temperature, Thermomechanics, Warping, Stress, Diluents, Flip-chip packages