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Proceedings Papers
Evaluation of Warpage Deformation in Semiconductor Device Packaging Process
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140852
Proceedings Papers
Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74060
Proceedings Papers
Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2528
Proceedings Papers
Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48814
Proceedings Papers
Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment
Available to Purchase
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A044, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48600
Proceedings Papers
Optimum Design and Operation of Thermoelectric Heat Pump With Two Temperatures
Available to Purchase
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A080, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48682
Proceedings Papers
Enhancement and Optimization of Planar Impingement Heat Transfer for Thermoelectric Power Generation
Available to Purchase
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A081, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48692
Proceedings Papers
New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP
Available to PurchaseYukio Nakamura, Kenichi Oohashi, Koji Morita, Shuji Nomoto, Takayuki Suzuki, Shin Takanezawa, Shinji Tsuchikawa, Masaaki Takekoshi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48836
Proceedings Papers
A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48447
Proceedings Papers
Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A042, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48669
Proceedings Papers
Effects of Non-Uniform Heating on Two-Phase Flow Through Microchannels
Available to Purchase
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A012, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73058
Proceedings Papers
Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 367-375, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52267
Proceedings Papers
Determination and Verification of Silicon Die Strength Using Ball-Breaker Test
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 299-305, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52200
Proceedings Papers
Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 129-135, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33330
Proceedings Papers
Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 473-479, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33257
Proceedings Papers
Laminar Cross-Flow Conjugated Forced Convection Heat Transfer From a Cylinder With Fins
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 565-570, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33553
Proceedings Papers
Engineering New Package Ideal Materials Using Polymer Resins and Nanoparticles
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 965-969, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33312
Proceedings Papers
Deformation Analysis of Center-Anchored Square Plate Induced by Residual Gradient Stress
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 783-787, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73430
Proceedings Papers
A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1229-1235, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73331
Proceedings Papers
Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1587-1592, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73109
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