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Proceedings Papers

High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering

Mohammad Azarifar, Ceren Cengiz, Kerem Ocaksönmez, Asim Onal, Sedat Nizamoglu, Mehmet Arik
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 25–27, 2022
Paper No: IPACK2022-97220
https://doi.org/10.1115/IPACK2022-97220
View Paper titled, High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering
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Topics: Brightness (Photometry), Diffusion (Physics), Electromagnetic scattering, Lasers, Radiation scattering, Scattering (Physics)
Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Paper No: IPACK2020-2695
https://doi.org/10.1115/IPACK2020-2695
View Paper titled, Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging
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Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties
Proceedings Papers

Reliability Assessment of Cu-Al WB Under High Temperature and High Voltage Bias Application

Pradeep Lall, Sungmo Jung
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 27–29, 2020
Paper No: IPACK2020-2678
https://doi.org/10.1115/IPACK2020-2678
View Paper titled, Reliability Assessment of Cu-Al WB Under High Temperature and High Voltage Bias Application
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Topics: Diffusion (Physics), Electrolytic corrosion, High temperature, Polarization (Electricity), Polarization (Light), Polarization (Waves), Reliability
Proceedings Papers

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Shuai Shuai, Zichen Du, Binjian Ma, Li Shan, Baris Dogruoz, Damena Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018
Paper No: IPACK2018-8311
https://doi.org/10.1115/IPACK2018-8311
View Paper titled, Numerical Investigation of Shape Effect on Microdroplet Evaporation
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Topics: Evaporation, Shapes, Drops, Vapors, Cooling, Computer cooling, Computer simulation, Design, Diffusion (Physics), Electric fields
Proceedings Papers

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

Cody J. Marbut, Mahsa Montazeri, David Huitink
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 27–30, 2018
Paper No: IPACK2018-8275
https://doi.org/10.1115/IPACK2018-8275
View Paper titled, Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction
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Topics: Fatigue failure, Reliability, Stress, Damage, Design, Fatigue, Finite element analysis, Solders, Failure, Flip-chip
Proceedings Papers

Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates

Shenghui Lei, Alexandre Shen, Ryan Enright
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 29–September 1, 2017
Paper No: IPACK2017-74181
https://doi.org/10.1115/IPACK2017-74181
View Paper titled, Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates
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Topics: Photonics, Silicon, Thermal resistance, Etching, Silicon-on-insulator, Cladding systems (Building), Thermal conductivity, Aluminum, Crystals, Diffusion (Physics)
Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017
Paper No: IPACK2017-74273
https://doi.org/10.1115/IPACK2017-74273
View Paper titled, The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages
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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)
Proceedings Papers

Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature

Pradeep Lall, Yihua Luo, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 29–September 1, 2017
Paper No: IPACK2017-74325
https://doi.org/10.1115/IPACK2017-74325
View Paper titled, Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature
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Topics: Aluminum, Copper, Electronics, High temperature, Ionic mobility, Wire, Corrosion, Diffusion (Physics), Gates (Closures), Bonding
Proceedings Papers

A Model to Guide Template-Based Nanoparticle Printing Development

David A. Rolfe, Kristen L. Dorsey, Jim C. Cheng, Albert P. Pisano
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A006, July 6–9, 2015
Paper No: IPACK2015-48449
https://doi.org/10.1115/IPACK2015-48449
View Paper titled, A Model to Guide Template-Based Nanoparticle Printing Development
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Topics: Nanoparticles, Printing, Inks, Sorption, Fluid dynamics, Fluids, Molding, Vapors, Diffusion (Physics), Engineering simulation
Proceedings Papers

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A040, July 6–9, 2015
Paper No: IPACK2015-48626
https://doi.org/10.1115/IPACK2015-48626
View Paper titled, Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies
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Topics: Flip-chip, Flip-chip devices, Laminates, Simulation, Stress, Flip-chip assemblies, Diffusion (Physics), Storage, Temperature, Absorption
Proceedings Papers

Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages

Lutz Meinshausen, Ming Liu, Tae-Kyu Lee, Indranath Dutta, Li Li
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A002, July 6–9, 2015
Paper No: IPACK2015-48124
https://doi.org/10.1115/IPACK2015-48124
View Paper titled, Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages
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Topics: Reliability, Silicon, Finite element analysis, Finite element model, Shear stress, Temperature, Copper, Creep, Diffusion (Physics), Electrodiffusion
Proceedings Papers

Microstructural Stability of Au-Sn SLID Joints for Harsh Environments

Paola Rivera Soto, Pedro O. Quintero, Mellyssa Mulero, Dimeji Ibitayo
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A035, July 6–9, 2015
Paper No: IPACK2015-48323
https://doi.org/10.1115/IPACK2015-48323
View Paper titled, Microstructural Stability of Au-Sn SLID Joints for Harsh Environments
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Topics: Stability, Tin, Bonding, Melting point, Fracture (Materials), Copper, Diffusion (Physics), Electronic packaging, Intermetallic compounds, Microscopy
Proceedings Papers

Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Pradeep Lall, Yihua Luo, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A012, July 6–9, 2015
Paper No: IPACK2015-48639
https://doi.org/10.1115/IPACK2015-48639
View Paper titled, Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
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Topics: Corrosion, Wire, Diffusion (Physics), Electrolytic corrosion, Ions, Copper, Electrical resistivity, Molding, Temperature, Deformation
Proceedings Papers

Analysis of Intermetallic Formation During Ultrasonic Ball Bonding

Panthea Sepehrband, Maryam Gholamirad
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A028, July 6–9, 2015
Paper No: IPACK2015-48812
https://doi.org/10.1115/IPACK2015-48812
View Paper titled, Analysis of Intermetallic Formation During Ultrasonic Ball Bonding
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Topics: Bonding, Intermetallic compounds, Alloys, Aluminum, Copper, Diffusion (Physics), Experimental analysis, Finite element analysis, Low temperature, Micromechanical devices
Proceedings Papers

DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids

Subramanya Sadasiva, Ganesh Subbarayan
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A013, July 6–9, 2015
Paper No: IPACK2015-48655
https://doi.org/10.1115/IPACK2015-48655
View Paper titled, DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids
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Topics: Diffusion (Physics), Simulation, Solids, Stress, Electrodiffusion, Failure, Solder joints, Dynamics (Mechanics), Finite element analysis, Solders
Proceedings Papers

Mitigation of Tin Whisker Growth by Dopant Addition

Lutz Meinshausen, Soumik Banerjee, Indranath Dutta, Bhaskar Majumdar
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A021, July 6–9, 2015
Paper No: IPACK2015-48155
https://doi.org/10.1115/IPACK2015-48155
View Paper titled, Mitigation of Tin Whisker Growth by Dopant Addition
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Topics: Atoms, Density, Diffusion (Physics), Electronic components, Engineering simulation, Grain boundaries, Heat, Molecular dynamics, Reliability, Simulation
Proceedings Papers

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Masaru Gotoh, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A005, July 6–9, 2015
Paper No: IPACK2015-48197
https://doi.org/10.1115/IPACK2015-48197
View Paper titled, Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity
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Topics: Copper, Thermal conductivity, Thin films, Grain boundaries, Electrical resistivity, Heating, Joules, Stress, Thermal properties, Diffusion (Physics)
Proceedings Papers

Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries

Takahiro Nakanishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A006, July 6–9, 2015
Paper No: IPACK2015-48200
https://doi.org/10.1115/IPACK2015-48200
View Paper titled, Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries
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Topics: Grain boundaries, Reliability, Copper, Thin films, Electrical resistivity, Electron backscatter diffraction, Brittleness, Diffusion (Physics), Dislocations, Focused ion beams
Proceedings Papers

Interfacial Reaction Between Molten Sn and Plasma Nitrided Stainless Steel

Shingo Hattori, Naoya Matsubara, Ikuo Shohji, Hideyuki Kuwahara
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A010, July 16–18, 2013
Paper No: IPACK2013-73170
https://doi.org/10.1115/IPACK2013-73170
View Paper titled, Interfacial Reaction Between Molten Sn and Plasma Nitrided Stainless Steel
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Topics: Plasmas (Ionized gases), Stainless steel, Tin, Erosion, Diffusion (Physics), Temperature
Proceedings Papers

Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A013, July 16–18, 2013
Paper No: IPACK2013-73248
https://doi.org/10.1115/IPACK2013-73248
View Paper titled, Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density
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Topics: Density, Simulation, Stress, Diffusion (Physics), Computer simulation, Electron mobility, Electrons, Heat conduction, Momentum, MOSFET transistors