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Proceedings Papers

High Heat Flux Subcooled Flow Boiling of Methanol in Microtubes

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Farzad Houshmand, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48734
https://doi.org/10.1115/IPACK2015-48734
View Paper titled, High Heat Flux Subcooled Flow Boiling of Methanol in Microtubes
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Topics: Boiling, Flow (Dynamics), Heat flux, Methanol, Subcooling, Critical heat flux, Flux (Metallurgy), Pressure drop, Heat, Cooling
Proceedings Papers

A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips

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Arthur Suszko, Mohamed S. El-Genk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A088, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48678
https://doi.org/10.1115/IPACK2015-48678
View Paper titled, A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips
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Topics: Composite materials, Cooling, Flat heat pipes, Critical heat flux, Copper, Dielectric liquids, Graphite, Nucleate pool boiling, Numerical analysis, Surface roughness
Proceedings Papers

Dependence of Flow Boiling Heat Transfer Coefficient on Location and Vapor Quality in a Microchannel Heat Sink

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Ravi S. Patel, Tannaz Harirchian, Suresh V. Garimella
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 143-151, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52089
https://doi.org/10.1115/IPACK2011-52089
View Paper titled, Dependence of Flow Boiling Heat Transfer Coefficient on Location and Vapor Quality in a Microchannel Heat Sink
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Topics: Boiling, Flow (Dynamics), Heat sinks, Heat transfer coefficients, Microchannels, Vapors, Dimensions, Dielectric liquids, Energy dissipation, Entrance region
Proceedings Papers

Thermal Imaging of Two-Phase Coooled Microgap Channel Wall

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Jessica Sheehan, Dae Whan Kim, Avram Bar-Cohen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 491-499, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89238
https://doi.org/10.1115/InterPACK2009-89238
View Paper titled, Thermal Imaging of Two-Phase Coooled Microgap Channel Wall
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Topics: Absorption, Coolers, Cooling, Dielectric liquids, Electronic components, Flow (Dynamics), Flux (Metallurgy), Heat, Heat flux, Imaging
Proceedings Papers

Variable Focal Length Microlens by Low Voltage Electrowetting on Dielectric (EWOD) Actuation

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Raj K. Dash, Theodorian Borca-Tasciuc
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 797-802, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73441
https://doi.org/10.1115/IPACK2005-73441
View Paper titled, Variable Focal Length Microlens by Low Voltage Electrowetting on Dielectric (EWOD) Actuation
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Topics: Design, Dielectric liquids, Dielectric materials, Electrodes, Lenses (Optics), Microfabrication