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Proceedings Papers

Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors

Devdatta Kulkarni, John Gulick, Jeff King, Brian Jarrett, Paul George, Yoav Feldman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141367
https://doi.org/10.1115/IPACK2024-141367
View Paper titled, Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors
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Topics: Cooling, Heat flux, Heat, Data centers, Design, Flux (Metallurgy), Climate change, Construction, Design methodology, Energy consumption
Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72975
https://doi.org/10.1115/IPACK2021-72975
View Paper titled, Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure
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Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis
Proceedings Papers

An Advanced Energy Efficient Rack Server Design With Distributed Battery Subsystem

Chun Wang, Xiaoguang Sun, Jun Zhang, Nishi Ahuja
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74033
https://doi.org/10.1115/IPACK2017-74033
View Paper titled, An Advanced Energy Efficient Rack Server Design With Distributed Battery Subsystem
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Topics: Batteries, Design, Data centers, Energy efficiency, Energy consumption, Data collection, Design methodology, Lead-acid batteries, Optimization, Topology
Proceedings Papers

Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs

Tiantao Lu, Ankur Srivastava
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A037, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48386
https://doi.org/10.1115/IPACK2015-48386
View Paper titled, Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs
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Topics: Design, Reliability, Finite element methods, Stress, Circuits, Design methodology, Electrodiffusion, Flow (Dynamics), Heat conduction, Optimization
Proceedings Papers

Analysis of Single-Phase Multi-Layer Heat Sinks Using a Porous Media Approach: Influence of Spatially Varying Porosity

John J. Podhiny, Alfonso Ortega
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A040, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73189
https://doi.org/10.1115/IPACK2013-73189
View Paper titled, Analysis of Single-Phase Multi-Layer Heat Sinks Using a Porous Media Approach: Influence of Spatially Varying Porosity
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Topics: Heat sinks, Porosity, Porous materials, Design, Heat exchangers, Design methodology, Fluids, Modeling, Pressure drop, Scaling laws (Mathematical physics)
Proceedings Papers

Signal Integrity Analysis for RF System-in-Package

Jeff Chen, Weiping Li, Feng Ling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 671-674, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52282
https://doi.org/10.1115/IPACK2011-52282
View Paper titled, Signal Integrity Analysis for RF System-in-Package
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Topics: Signals, System-in-package, Design methodology, Architects, Design, Electromagnetic compatibility, Engineering simulation, Noise (Sound), Packaging, Simulation
Proceedings Papers

Study on High Reliability of Lead-Free Solder Joint on Metal Substrate

Kanji Takagi, Masaki Wakabayashi, Junichi Inoue, Qiang Yu, Takahiro Akutsu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 143-148, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52044
https://doi.org/10.1115/IPACK2011-52044
View Paper titled, Study on High Reliability of Lead-Free Solder Joint on Metal Substrate
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Topics: Lead-free solders, Metals, Reliability, Rupture, Solder joints, Crack propagation, Heating, Temperature, Thermal conductivity, Design methodology
Proceedings Papers

Novel Application-Specific LED Packages Integrated With Compact Freeform Lens

Kai Wang, Fei Chen, Zongyuan Liu, Xiaobing Luo, Sheng Liu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 685-691, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89335
https://doi.org/10.1115/InterPACK2009-89335
View Paper titled, Novel Application-Specific LED Packages Integrated With Compact Freeform Lens
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Topics: Lenses (Optics), Packaging, Light-emitting diodes, Roads, Silicones, Computer simulation, Design methodology, Manufacturing, Optics
Proceedings Papers

DOE Analysis of Effects of Geometry and Materials on Cu/Low-K Interconnect Stresses

Ming-Che Hsieh, Wei Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 95-99, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33510
https://doi.org/10.1115/IPACK2007-33510
View Paper titled, DOE Analysis of Effects of Geometry and Materials on Cu/Low-K Interconnect Stresses
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Topics: Geometry, Stress, Copper, Finite element analysis, Dimensions, Dielectric materials, Response surface methodology, Design, Design methodology, Experimental design
Proceedings Papers

Reliability of Power Electronic Modules

H. Lu, W. S. Loh, T. Tilford, M. Johnson, C. Bailey
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 883-888, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33817
https://doi.org/10.1115/IPACK2007-33817
View Paper titled, Reliability of Power Electronic Modules
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Topics: Reliability, Aircraft, Carbon, Climate change, Design methodology, Electric vehicles, Electronics, Emissions, Failure, Physics
Proceedings Papers

The Thermal-Circuit High-Speed Collaboration Layout Design for an Electronic System With Multi-Agent Method

Shintaro Hayashi, Yoshiharu Iwata, Ryohei Satoh, Kozo Fujimoto
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 679-685, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33982
https://doi.org/10.1115/IPACK2007-33982
View Paper titled, The Thermal-Circuit High-Speed Collaboration Layout Design for an Electronic System With Multi-Agent Method
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Topics: Circuits, Collaboration, Design, Electronic systems, Electronics, Optimization, Boundary-value problems, Circuit design, Density, Design methodology
Proceedings Papers

Design and Driving Methodology of Out-of-Plane Electrostatic Microactuator With Extended Stable Motion Range

Takashi Fukushige, Seiichi Hata, Takehiko Hayashi, Akira Shimokohbe
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1709-1713, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73145
https://doi.org/10.1115/IPACK2005-73145
View Paper titled, Design and Driving Methodology of Out-of-Plane Electrostatic Microactuator With Extended Stable Motion Range
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Topics: Design, Microactuators, Cantilevers, Electrodes, Engineering prototypes, Shapes, Control systems, Deflection, Design methodology, Equilibrium (Physics)
Proceedings Papers

Mathematical Optimization of Electronic Enclosures

D. J. De Kock, M. Nagulapally, J. A. Visser, R. Nair, J. Nigen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 253-258, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73185
https://doi.org/10.1115/IPACK2005-73185
View Paper titled, Mathematical Optimization of Electronic Enclosures
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Topics: Optimization, Design, Computational fluid dynamics, Flow (Dynamics), Lumber, Temperature, Filters, Design methodology, Electronic components, Fans
Proceedings Papers

Circuit-Thermal Collaboration Design Method for Outline Design Stage of Mobile Terminal

Yoshiharu Iwata, Shintaro Hayashi, Ryohei Satoh, Kozo Fujimoto
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 225-231, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73157
https://doi.org/10.1115/IPACK2005-73157
View Paper titled, Circuit-Thermal Collaboration Design Method for Outline Design Stage of Mobile Terminal
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Topics: Circuits, Collaboration, Design, Design methodology
Proceedings Papers

A Method for Improving Component Decoupling Using Advanced Capacitor Under Ball Grid Array (ACUB)

Terry Dishongh, Damion Searls, Weston C. Roth, Erik Peter
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 33-36, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35207
https://doi.org/10.1115/IPACK2003-35207
View Paper titled, A Method for Improving Component Decoupling Using Advanced Capacitor Under Ball Grid Array (ACUB)
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Topics: Ball-Grid-Array packaging, Capacitors, Design, Stress, Manufacturing, Capacitance, Transients (Dynamics), Design methodology, Engineering prototypes, Silicon
Proceedings Papers

Thermofluid Design of Energy Efficient and Compact Heat Sinks

Kazuaki Yazawa, Gary L. Solbrekken, Avram Bar-Cohen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 509-516, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35242
https://doi.org/10.1115/IPACK2003-35242
View Paper titled, Thermofluid Design of Energy Efficient and Compact Heat Sinks
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Topics: Design, Heat sinks, Thermofluids, Fins, Convection, Cooling, Cooling systems, Design methodology, Electronic products, Energy efficiency
Proceedings Papers

Design Optimization of Off-Chip Inductors

Lin Jin, Albert Chee W. Lu, Lai L. Wai, Wei Fan, Aik Chong Tan, Kai Chong Chan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 735-739, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35223
https://doi.org/10.1115/IPACK2003-35223
View Paper titled, Design Optimization of Off-Chip Inductors
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Topics: Design, Inductors, Optimization, Design methodology, Engineering simulation, Manufacturing, Semiconductor wafers, Simulation