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Proceedings Papers

Evaluation of Low Order Stress Models for Use in Co-Design Analysis of Electronics Packaging

L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 7–9, 2019
Paper No: IPACK2019-6381
DOI: https://doi.org/10.1115/IPACK2019-6381
View Paper titled, Evaluation of Low Order Stress Models for Use in Co-Design Analysis of Electronics Packaging
Click here to open pdf in another window PDF for Evaluation of Low Order Stress Models for Use in Co-Design Analysis of Electronics Packaging
Topics: Design, Electronic packaging, Stress, Temperature, Finite element analysis, Army, Design engineering, Flat heat pipes, Heat sinks, Manufacturing
Proceedings Papers

Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 7–9, 2019
Paper No: IPACK2019-6444
DOI: https://doi.org/10.1115/IPACK2019-6444
View Paper titled, Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922
Click here to open pdf in another window PDF for Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922
Topics: Cooling, Design, Design engineering, Thermal management, Water, Graphics processing units, Electronic components, Flow (Dynamics), Artificial intelligence, Data centers
Proceedings Papers

A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life

Takashi Kawakami, Takahiro Kinoshita, Hirokazu Oriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A010, July 6–9, 2015
Paper No: IPACK2015-48136
DOI: https://doi.org/10.1115/IPACK2015-48136
View Paper titled, A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life
Click here to open pdf in another window PDF for A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life
Topics: Lead-free solders, Low cycle fatigue, Stress, Simulation, Design engineering, Fatigue cracks, Fatigue life, Fatigue testing, Shapes, Solder joints
Proceedings Papers

A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

Hirokazu Oriyama, Takashi Kawakami, Takahiro Kinoshita
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A019, July 6–9, 2015
Paper No: IPACK2015-48138
DOI: https://doi.org/10.1115/IPACK2015-48138
View Paper titled, A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material
Click here to open pdf in another window PDF for A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material
Topics: Creep, Damage, Fatigue, Lead-free solders, Tin, Solder joints, Electronics, Design engineering, Fatigue damage, Stress
Proceedings Papers

A Study on Impact Stresses in Ceramic Capacitors

Takashi Kawakami, Noriyo Horikawa, Takahiro Kinoshita, Tomohiro Inagaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A013, July 16–18, 2013
Paper No: IPACK2013-73191
DOI: https://doi.org/10.1115/IPACK2013-73191
View Paper titled, A Study on Impact Stresses in Ceramic Capacitors
Click here to open pdf in another window PDF for A Study on Impact Stresses in Ceramic Capacitors
Topics: Capacitors, Ceramics, Stress, Design engineering, Fracture (Materials), Impact testing, Machinery, Manufacturing, Printed circuit boards
Proceedings Papers

Thermal Mechanical Design and Validation of Memory Heat Spreaders

Ted Lee, Bruce Pederson, An Qiu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 513-519, July 19–23, 2009
Paper No: InterPACK2009-89261
DOI: https://doi.org/10.1115/InterPACK2009-89261
View Paper titled, Thermal Mechanical Design and Validation of Memory Heat Spreaders
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Topics: Design engineering, Flat heat pipes, Design
Proceedings Papers

Mechanical Design Optimization of a Package on Package

Abhilash R. Menon, Nikhil Lakhkar, Saket Karajgikar, Dereje Agonafer
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 177-184, July 19–23, 2009
Paper No: InterPACK2009-89349
DOI: https://doi.org/10.1115/InterPACK2009-89349
View Paper titled, Mechanical Design Optimization of a Package on Package
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Topics: Design engineering, Optimization, Package on package
Proceedings Papers

Mechanical Design and Analysis of Land Grid Array (LGA) Sockets

Vinayak Pandey, Sankara Subramanian, Sudarshan Rangaraj, Tod Byquist
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1005-1011, July 17–22, 2005
Paper No: IPACK2005-73360
DOI: https://doi.org/10.1115/IPACK2005-73360
View Paper titled, Mechanical Design and Analysis of Land Grid Array (LGA) Sockets
Click here to open pdf in another window PDF for Mechanical Design and Analysis of Land Grid Array (LGA) Sockets
Topics: Accelerated life testing, Ball-Grid-Array packaging, Computer simulation, Design, Design engineering, Manufacturing, Optimization, Pins (Engineering), Reliability, Shock (Mechanics)
Proceedings Papers

Mechanical Design Aspects During Full-Scale Development Process of Electronic Assemblies for Military Systems

Medy Ramot
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 827-833, July 17–22, 2005
Paper No: IPACK2005-73026
DOI: https://doi.org/10.1115/IPACK2005-73026
View Paper titled, Mechanical Design Aspects During Full-Scale Development Process of Electronic Assemblies for Military Systems
Click here to open pdf in another window PDF for Mechanical Design Aspects During Full-Scale Development Process of Electronic Assemblies for Military Systems
Topics: Design engineering, Manufacturing, Military systems
Proceedings Papers

Mechanical Shock FE Modeling for ATCA Circuit Board Design

Frank Z. Liang, Larry M. Palanuk, Wade Hezeltine
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1487-1492, July 17–22, 2005
Paper No: IPACK2005-73274
DOI: https://doi.org/10.1115/IPACK2005-73274
View Paper titled, Mechanical Shock FE Modeling for ATCA Circuit Board Design
Click here to open pdf in another window PDF for Mechanical Shock FE Modeling for ATCA Circuit Board Design
Topics: Design, Modeling, Printed circuit boards, Shock (Mechanics), Finite element model, Bricks, Design engineering, Displacement, Displacement measurement, Dynamic response
Proceedings Papers

Effects of A Rotated Chip Package on Mechanical and Thermal Performances

Henry H. Jung, Ron Zhang, Eddie Lee, Sai Ankireddi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 529-535, July 6–11, 2003
Paper No: IPACK2003-35311
DOI: https://doi.org/10.1115/IPACK2003-35311
View Paper titled, Effects of A Rotated Chip Package on Mechanical and Thermal Performances
Click here to open pdf in another window PDF for Effects of A Rotated Chip Package on Mechanical and Thermal Performances
Topics: Air flow, Clamps (Tools), Computers, Design engineering, Junctions, Manufacturing, Rotation, Silicon, Stress, Temperature
Proceedings Papers

Measurement of the Constitutive Behavior of Underfill Encapsulants

M. Saiful Islam, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 923-931, July 6–11, 2003
Paper No: IPACK2003-35321
DOI: https://doi.org/10.1115/IPACK2003-35321
View Paper titled, Measurement of the Constitutive Behavior of Underfill Encapsulants
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Topics: Creep, Design engineering, Dimensions, Electronic packages, Flip-chip assemblies, Flow (Dynamics), Machinery, Materials properties, Mechanical testing, Microscale devices