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1-20 of 194
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Proceedings Papers
Passive Direct Liquid Cooling for High-Power Processors
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
Proceedings Papers
Exploring the Impact of CRAH Unit Partial Failure in Hybrid-Cooled Data Centers
Available to PurchaseAli Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139031
Proceedings Papers
Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology
Available to PurchaseAli Heydari, Omar Al-Zu'bi, Yaman Manaserh, Ahmad R. Gharaibeh, Russ Tipton, Mehdi Mehrabikermani, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141342
Proceedings Papers
Commissioning and Thermohydraulic Characterization of a Single-Phase Liquid-Cooled High-Density Data Center Rack
Available to PurchaseAli Heydari, Deogratius Kisitu, Alfonso Ortega, Bahareh Eslami, Pardeep Shahi, Mohammad Tradat, James Costello, Benjamin Margaritondo
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140672
Proceedings Papers
Effect of Passivation Layer and Line Thickness on Damage Mechanism of Flexible Ag Nanowire Interconnects Under High Density Current
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141181
Proceedings Papers
Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140105
Proceedings Papers
Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139429
Proceedings Papers
Evaluation of Warpage Deformation in Semiconductor Device Packaging Process
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140852
Proceedings Papers
Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111922
Proceedings Papers
A Numerical Study Comparing Forced and Natural Convection in a High-Density Single-Phase Immersed Cooled Server
Available to PurchaseGautam Gupta, Vivek Nair, Pratik Bansode, Rohit Suthar, Sai Abhideep Pundla, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112065
Proceedings Papers
Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks
Available to PurchaseAli Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112404
Proceedings Papers
L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
Available to PurchaseAli Heydari, Qusai Soud, Mohammad Tradat, Ahmad Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111564
Proceedings Papers
Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
Proceedings Papers
High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97438
Proceedings Papers
Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers
Available to PurchaseAli Heydari, Vahideh Radmard, Bahareh Eslami, Mohammad I. Tradat, Yaman Manaserh, Harold Miyamura, Uschas Chowdhury, Pardeep Shahi, Kevin Dave Hall, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97386
Proceedings Papers
Single-Phase Immersion Cooling Study of a High-Density Storage System
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97490
Proceedings Papers
Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center
Available to PurchaseVibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97494
Proceedings Papers
Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
Available to PurchaseAli Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97416
Proceedings Papers
Topology Optimization of Heat Sink for 3d Integrated Power Converters
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-98066
Proceedings Papers
Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
Available to PurchaseShidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97455
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