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Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6424
https://doi.org/10.1115/IPACK2019-6424
View Paper titled, Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

A Two-Dimensional Microfluidic-Based Tactile Sensor for Tissue Palpation Under the Influence of Misalignment

Yichao Yang, Jiayue Shen, Zhili Hao
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48134
https://doi.org/10.1115/IPACK2015-48134
View Paper titled, A Two-Dimensional Microfluidic-Based Tactile Sensor for Tissue Palpation Under the Influence of Misalignment
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Topics: Biological tissues, Microfluidics, Tactile sensors, Sensors, Deflection, Transducers, Elasticity, Electrolytes, Phantoms, Power presses
Proceedings Papers

CMUTs in Permanent Contact Operation for High Output Pressure

Min-Chieh Ho, Maik Hoffmann, Alexander Unger, Kwan Kyu Park, Mario Kupnik, Butrus T. Khuri-Yakub
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48733
https://doi.org/10.1115/IPACK2015-48733
View Paper titled, CMUTs in Permanent Contact Operation for High Output Pressure
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Topics: Pressure, Transducers, Acoustics, Cavities, Ultrasonic transducers, Bonding, Cycles, Deflection, Displacement, High temperature
Proceedings Papers

Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Pradeep Lall, Nakul Kothari, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48457
https://doi.org/10.1115/IPACK2015-48457
View Paper titled, Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments
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Topics: Accelerometers, Event history analysis, Microelectromechanical systems, Modeling, Shock (Mechanics), Failure mechanisms, Capacitance, Failure, Defense industry, Deflection
Proceedings Papers

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

Pradeep Lall, Geeta Limaye
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A017, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73245
https://doi.org/10.1115/IPACK2013-73245
View Paper titled, A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration
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Topics: High cycle fatigue, High temperature, Vibration, Temperature, Solders, Stress, Alloys, Electronics, Failure, Failure mechanisms
Proceedings Papers

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

Shawn J. Cunningham, Yvonne Heng, Nabeel Idrisi, Brad Nelson, John McKillop
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73222
https://doi.org/10.1115/IPACK2013-73222
View Paper titled, Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors
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Topics: Capacitors, Flip-chip, Flip-chip devices, Microelectromechanical systems, Packaging, Semiconductor wafers, Solders, Stress, Deflection, Failure
Proceedings Papers

Energy Conversion Efficiency of Synthetic Jets

Ri Li, Rajdeep Sharma, Mehmet Arik
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 115-122, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52034
https://doi.org/10.1115/IPACK2011-52034
View Paper titled, Energy Conversion Efficiency of Synthetic Jets
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Topics: Energy conversion, Jets, Electricity (Physics), Energy efficiency, Signals, Actuators, Air flow, Design, Piezoelectric actuators, Cooling
Proceedings Papers

Effect of Packaging Stress in a Laser Chip on Its Radiation Spectrum

Atsushi Kitamura, Taira Kawauchi, Ken Suzuki, Hideo Miura, Minoru Sasaki
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 687-692, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33262
https://doi.org/10.1115/IPACK2007-33262
View Paper titled, Effect of Packaging Stress in a Laser Chip on Its Radiation Spectrum
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Topics: Lasers, Packaging, Radiation (Physics), Stress, Wavelength, Laser beams, Adhesion, Deflection, Energy gap, Finite element methods
Proceedings Papers

Study of Printed Circuit Board Shock Transmissibility

Frank Fan Wang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 151-155, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33074
https://doi.org/10.1115/IPACK2007-33074
View Paper titled, Study of Printed Circuit Board Shock Transmissibility
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Topics: Printed circuit boards, Shock (Mechanics), Stress, Deflection, Resonance, Electronics, Excitation
Proceedings Papers

A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP

Hideo Koguchi, Mirai Ishida, Kazuto Nishida, Tomoaki Kuroishi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1405-1412, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73096
https://doi.org/10.1115/IPACK2005-73096
View Paper titled, A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP
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Topics: Deflection, Reliability, Stress, Viscoelasticity, Relaxation (Physics), Resins, Thermodynamic cycles, Adhesives, Thermal expansion, Thermal stresses
Proceedings Papers

Development of Piezoelectric RF-MEMS Switch Driven by Low Operating Voltage

Isaku Kanno, Takaaki Suzuki, Hironobo Endo, Hidetoshi Kotera
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2033-2036, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73099
https://doi.org/10.1115/IPACK2005-73099
View Paper titled, Development of Piezoelectric RF-MEMS Switch Driven by Low Operating Voltage
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Topics: Microelectromechanical systems, Switches, Thin films, Actuators, Cantilevers, Deflection, Electrodes, Microcantilevers
Proceedings Papers

Design and Driving Methodology of Out-of-Plane Electrostatic Microactuator With Extended Stable Motion Range

Takashi Fukushige, Seiichi Hata, Takehiko Hayashi, Akira Shimokohbe
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1709-1713, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73145
https://doi.org/10.1115/IPACK2005-73145
View Paper titled, Design and Driving Methodology of Out-of-Plane Electrostatic Microactuator With Extended Stable Motion Range
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Topics: Design, Microactuators, Cantilevers, Electrodes, Engineering prototypes, Shapes, Control systems, Deflection, Design methodology, Equilibrium (Physics)
Proceedings Papers

A Basic Study of Characteristics Between Stress and Deflection on Strength Test of Bio-Ceramics

Mitsuyuki Nakayama, Hideto Suzuki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1715-1718, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73147
https://doi.org/10.1115/IPACK2005-73147
View Paper titled, A Basic Study of Characteristics Between Stress and Deflection on Strength Test of Bio-Ceramics
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Topics: Ceramics, Deflection, Stress, Biomaterials, Bone, Young's modulus, Materials properties, Mechanical properties
Proceedings Papers

Measurement of Transverse Deflection for Composite Laminates Using Holographic Interferometry

Jin-Chein Lin, T. Y. Yang, L. C. Chang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 191-195, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35261
https://doi.org/10.1115/IPACK2003-35261
View Paper titled, Measurement of Transverse Deflection for Composite Laminates Using Holographic Interferometry
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Topics: Composite materials, Deflection, Holographic interferometry, Laminates
Proceedings Papers

Ultra-Thin and High-Density Packaging Using Both Sides Flip Chip Technology

Kazuto Nishida, Kazumichi Shimizu, Michiro Yoshino, Hideo Koguchi, Nipon Taweejun
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 819-826, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35066
https://doi.org/10.1115/IPACK2003-35066
View Paper titled, Ultra-Thin and High-Density Packaging Using Both Sides Flip Chip Technology
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Topics: Density, Flip-chip, Flip-chip devices, Packaging, Finite element methods, Reliability, Bonding, Deflection, Numerical analysis, Shear stress