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Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97452
https://doi.org/10.1115/IPACK2022-97452
View Paper titled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97438
https://doi.org/10.1115/IPACK2022-97438
View Paper titled, High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C
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Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry
Proceedings Papers

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2648
https://doi.org/10.1115/IPACK2020-2648
View Paper titled, Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies
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Topics: Electronics, Reliability, Shock (Mechanics), Vehicles, Manufacturing, Solder joints, Aerospace industry, Ball-Grid-Array packaging, Capacitors, Ceramics
Proceedings Papers

State of the Art of Electronics Cooling for Radar Antenna Applications

Girish Upadhya, Clayton Pullins, Karl Freitag, George Hall, James Marthinuss
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A023, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74080
https://doi.org/10.1115/IPACK2017-74080
View Paper titled, State of the Art of Electronics Cooling for Radar Antenna Applications
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Topics: Computer cooling, Radar, Cooling, Heat flux, Defense industry, Design, Electronics, Refrigerants, Two-phase flow, Analytical methods
Proceedings Papers

Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Pradeep Lall, Nakul Kothari, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48457
https://doi.org/10.1115/IPACK2015-48457
View Paper titled, Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments
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Topics: Accelerometers, Event history analysis, Microelectromechanical systems, Modeling, Shock (Mechanics), Failure mechanisms, Capacitance, Failure, Defense industry, Deflection
Proceedings Papers

Thermal Solution of High Flux Phased Radar Antenna for Military Application

Murat Parlak, Murat Yaban
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48055
https://doi.org/10.1115/IPACK2015-48055
View Paper titled, Thermal Solution of High Flux Phased Radar Antenna for Military Application
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Topics: Defense industry, Radar, Design, Cooling, Heat flux, Manifolds, Computational fluid dynamics, Computer software, Finite element methods, Flow (Dynamics)
Proceedings Papers

Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys

Yifei Zhang, Zijie Cai, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 959-976, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89373
https://doi.org/10.1115/InterPACK2009-89373
View Paper titled, Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys
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Topics: Alloys, Mechanical behavior, Reliability, Temperature, Creep, Solders, Lead-free solders, Failure, Silver, Accelerated life testing
Proceedings Papers

Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging

Hongtao Ma, Jeffrey C. Suhling, Yifei Zhang, Pradeep Lall, Michael J. Bozack
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 563-579, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33545
https://doi.org/10.1115/IPACK2007-33545
View Paper titled, Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging
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Topics: Lead-free solders, Temperature, Solders, Creep, Reliability, Solder joints, Alloys, Failure, Mechanical behavior, Mechanical properties
Proceedings Papers

Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses

Pradeep Lall, Madhura Hande, Chandan Bhat, Jeff Suhling
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 101-116, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33876
https://doi.org/10.1115/IPACK2007-33876
View Paper titled, Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses
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Topics: Electronics, Packaging, Reliability, Stress, Thermomechanics, Failure, Damage, Algorithms, Architecture, Automotive safety
Proceedings Papers

Survey of Environmental Data for COTS (Commercial Off-the-Shelf) Used in Military Systems

Medy Ramot, Eran Weiss, Niv Cohen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 819-826, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73025
https://doi.org/10.1115/IPACK2005-73025
View Paper titled, Survey of Environmental Data for COTS (Commercial Off-the-Shelf) Used in Military Systems
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Topics: Military systems, Defense industry, Design, Computers, Data storage systems, Semiconductors (Materials), Telecommunications
Proceedings Papers

Comparing Random Vibration Inputs: Power Spectral Density (PSD) Versus Root Mean-Square Acceleration (G rms )

Ivan Straznicky
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 763-766, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35056
https://doi.org/10.1115/IPACK2003-35056
View Paper titled, Comparing Random Vibration Inputs: Power Spectral Density (PSD) Versus Root Mean-Square Acceleration (G rms )
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Topics: Random vibration, Spectral energy distribution, Damage, Circuits, Defense industry, Electronics, Fatigue damage, Manufacturing, Vehicles, Vibration
Proceedings Papers

Analysis and Design of Liquid-Cooling Systems Using Flow Network Modeling (FNM)

Kanchan M. Kelkar, Suhas V. Patankar
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 467-472, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35233
https://doi.org/10.1115/IPACK2003-35233
View Paper titled, Analysis and Design of Liquid-Cooling Systems Using Flow Network Modeling (FNM)
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Topics: Cooling, Design, Flow (Dynamics), Modeling, Temperature, Biomedicine, Computers, Cooling systems, Defense industry, Electronic components
Proceedings Papers

Insertion of HDI and Grid Array Technologies Into Military/Space Applications

Jerry D. Keller
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 783-788, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35248
https://doi.org/10.1115/IPACK2003-35248
View Paper titled, Insertion of HDI and Grid Array Technologies Into Military/Space Applications
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Topics: Military systems, Aerospace industry, Density, Electronics, Ball-Grid-Array packaging, Defense industry, Durability, Electronic packaging, Packaging, Printed circuit boards