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1-20 of 219
Data centers
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Proceedings Papers
Exploring the Impact of CRAH Unit Partial Failure in Hybrid-Cooled Data Centers
Available to PurchaseAli Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139031
Proceedings Papers
Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology
Available to PurchaseAli Heydari, Omar Al-Zu'bi, Yaman Manaserh, Ahmad R. Gharaibeh, Russ Tipton, Mehdi Mehrabikermani, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141342
Proceedings Papers
Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling
Available to PurchaseYousaf Shah, Alfonso Ortega, Mehdi Mehrabi-kermani, Victor A. Martinez, Yaman Manaserh, Ali Heydari, Jeremy Rodriguez
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140277
Proceedings Papers
Commissioning and Thermohydraulic Characterization of a Single-Phase Liquid-Cooled High-Density Data Center Rack
Available to PurchaseAli Heydari, Deogratius Kisitu, Alfonso Ortega, Bahareh Eslami, Pardeep Shahi, Mohammad Tradat, James Costello, Benjamin Margaritondo
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140672
Proceedings Papers
Bio-Analysis of Cross-Mixed Coolants in High Powered Liquid Cooled Data Center
Available to PurchasePardeep Shahi, Ali Heydari, Lochan Sai Reddy Chinthaparthy, Himanshu Modi, Anto Barigala, Sean Sivapalan, Harold Miyamura, Dereje Agonafer, Mohammad Tradat, Jeremy Rodriguez
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141343
Proceedings Papers
Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center
Available to PurchasePardeep Shahi, Ali Heydari, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Anto Barigala, Bahareh Eslami, Uschas Chowdhury, Dereje Agonafer, Mohammad Tradat, Jeremy Rodriguez
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141349
Proceedings Papers
Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141367
Proceedings Papers
Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139429
Proceedings Papers
A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling
Available to PurchaseSatyam Saini, Gautam Gupta, Pratik Bansode, Pardeep Shahi, Vibin Shalom Simon, Himanshu Modi, Dereje Agonafer, Jimil Shah
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112005
Proceedings Papers
A New Low-GWP Dielectric Fluid for Two-Phase Immersion Cooling
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111743
Proceedings Papers
Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112019
Proceedings Papers
Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems
Available to PurchasePardeep Shahi, Ali Heydari, Chandraprakash Hinge, Lochan Sai Reddy Chinthaparthy, Himanshu Modi, Harold Miyamura, Mohammad Tradat, Uschas Chowdhury, Vahideh Radmard, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110576
Proceedings Papers
Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments
Available to PurchaseBidzina Kekelia, Qianying Wu, Sreekant Narumanchi, Joshua Major, Gilbert Moreno, Mehdi Asheghi, Ercan M. Dede, James Palko, Kenneth Goodson
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113781
Proceedings Papers
At Scale Development of Thermal Test Vehicles for Data Center Liquid Cooling Developments
Available to PurchaseAli Heydari, Harold Miyamura, Uschas Chowdhury, Yaman Mohammad Ali Manaserh, Mohammad Tradat, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Dwayne Kalma, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111307
Proceedings Papers
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
Available to PurchasePardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110587
Proceedings Papers
Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution
Available to PurchaseVibin Shalom Simon, Saket Karajgikar, Veerendra Mulay, Sai Abhideep Pundla, Krishna Bhavana Sivaraju, Gautam Gupta, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112078
Proceedings Papers
Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server
Available to PurchaseVibin Shalom Simon, Bhavana Reddy Mandadi, Pardeep Shahi, Himanshu Modi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
Proceedings Papers
Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks
Available to PurchaseAli Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112404
Proceedings Papers
L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
Available to PurchaseAli Heydari, Qusai Soud, Mohammad Tradat, Ahmad Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111564
Proceedings Papers
Experimental and CFD Analysis of a Rack Manifold for High Power Density Liquid-Cooled Rack
Available to PurchasePardeep Shahi, Ali Heydari, Pratik Bansode, Ashwin Siddarth, Uschas Chowdhury, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Mohammad Tradat, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114351
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