1-20 of 219
Data centers
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Exploring the Impact of CRAH Unit Partial Failure in Hybrid-Cooled Data Centers

Available to Purchase

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139031
https://doi.org/10.1115/IPACK2024-139031
View Paper titled, Exploring the Impact of CRAH Unit Partial Failure in Hybrid-Cooled Data Centers
Open the PDF for Exploring the Impact of CRAH Unit Partial Failure in Hybrid-Cooled Data Centers in another window
Topics: Cooling, Data centers, Density, Failure, Heat
Proceedings Papers

Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology

Available to Purchase

Ali Heydari, Omar Al-Zu'bi, Yaman Manaserh, Ahmad R. Gharaibeh, Russ Tipton, Mehdi Mehrabikermani, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141342
https://doi.org/10.1115/IPACK2024-141342
View Paper titled, Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology
Open the PDF for Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology in another window
Topics: Cooling, Data centers, Density, Heat, Refrigerants, Thermal management
Proceedings Papers

Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling

Available to Purchase

Yousaf Shah, Alfonso Ortega, Mehdi Mehrabi-kermani, Victor A. Martinez, Yaman Manaserh, Ali Heydari, Jeremy Rodriguez
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140277
https://doi.org/10.1115/IPACK2024-140277
View Paper titled, Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling
Open the PDF for Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling in another window
Topics: Cooling, Data centers, Flow (Dynamics), Microchannels, Plates (structures)
Proceedings Papers

Commissioning and Thermohydraulic Characterization of a Single-Phase Liquid-Cooled High-Density Data Center Rack

Available to Purchase

Ali Heydari, Deogratius Kisitu, Alfonso Ortega, Bahareh Eslami, Pardeep Shahi, Mohammad Tradat, James Costello, Benjamin Margaritondo
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140672
https://doi.org/10.1115/IPACK2024-140672
View Paper titled, Commissioning and Thermohydraulic Characterization of a Single-Phase Liquid-Cooled High-Density Data Center Rack
Open the PDF for Commissioning and Thermohydraulic Characterization of a Single-Phase Liquid-Cooled High-Density Data Center Rack in another window
Topics: Cooling, Data centers, Density, Plates (structures)
Proceedings Papers

Bio-Analysis of Cross-Mixed Coolants in High Powered Liquid Cooled Data Center

Available to Purchase

Pardeep Shahi, Ali Heydari, Lochan Sai Reddy Chinthaparthy, Himanshu Modi, Anto Barigala, Sean Sivapalan, Harold Miyamura, Dereje Agonafer, Mohammad Tradat, Jeremy Rodriguez
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141343
https://doi.org/10.1115/IPACK2024-141343
View Paper titled, Bio-Analysis of Cross-Mixed Coolants in High Powered Liquid Cooled Data Center
Open the PDF for Bio-Analysis of Cross-Mixed Coolants in High Powered Liquid Cooled Data Center in another window
Topics: Contamination, Coolants, Data centers
Proceedings Papers

Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center

Available to Purchase

Pardeep Shahi, Ali Heydari, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Anto Barigala, Bahareh Eslami, Uschas Chowdhury, Dereje Agonafer, Mohammad Tradat, Jeremy Rodriguez
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141349
https://doi.org/10.1115/IPACK2024-141349
View Paper titled, Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center
Open the PDF for Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center in another window
Topics: Coolants, Data centers, Heat exchangers
Proceedings Papers

Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors

Available to Purchase

Devdatta Kulkarni, John Gulick, Jeff King, Brian Jarrett, Paul George, Yoav Feldman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141367
https://doi.org/10.1115/IPACK2024-141367
View Paper titled, Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors
Open the PDF for Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors in another window
Topics: Cooling, Heat flux, Heat, Data centers, Design, Flux (Metallurgy), Climate change, Construction, Design methodology, Energy consumption
Proceedings Papers

Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System

Available to Purchase

Bharath Ram Ravi, Jiwon Yu, Stephen Keefe, Herman Chu, Chase Wealther
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139429
https://doi.org/10.1115/IPACK2024-139429
View Paper titled, Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System
Open the PDF for Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System in another window
Topics: Cooling, Thermofluids, Heat, Internet of things, Artificial intelligence, Blockchain technology, Carbon footprint, Coolants, Cooling systems, Data centers
Proceedings Papers

A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling

Available to Purchase

Satyam Saini, Gautam Gupta, Pratik Bansode, Pardeep Shahi, Vibin Shalom Simon, Himanshu Modi, Dereje Agonafer, Jimil Shah
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112005
https://doi.org/10.1115/IPACK2023-112005
View Paper titled, A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling
Open the PDF for A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling in another window
Topics: Cooling, Data centers, Heat sinks, Heat transfer, Mixed convection, Thermal management
Proceedings Papers

A New Low-GWP Dielectric Fluid for Two-Phase Immersion Cooling

Available to Purchase

Gustavo Pottker, Abigail Van Wassen, Drew R. Brandt
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111743
https://doi.org/10.1115/IPACK2023-111743
View Paper titled, A New Low-GWP Dielectric Fluid for Two-Phase Immersion Cooling
Open the PDF for A New Low-GWP Dielectric Fluid for Two-Phase Immersion Cooling in another window
Topics: Cooling, Data centers, Fluids
Proceedings Papers

Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection

Available to Purchase

Joseph Herring, Gautam Gupta, Jacob Lamotte-Dawaghreh, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112019
https://doi.org/10.1115/IPACK2023-112019
View Paper titled, Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection
Open the PDF for Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection in another window
Topics: Computational fluid dynamics, Cooling, Data centers, Design, Heat sinks, Natural convection, Optimization
Proceedings Papers

Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems

Available to Purchase

Pardeep Shahi, Ali Heydari, Chandraprakash Hinge, Lochan Sai Reddy Chinthaparthy, Himanshu Modi, Harold Miyamura, Mohammad Tradat, Uschas Chowdhury, Vahideh Radmard, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110576
https://doi.org/10.1115/IPACK2023-110576
View Paper titled, Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems
Open the PDF for Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems in another window
Topics: Coolants, Cooling, Data centers, Event history analysis, Reliability
Proceedings Papers

Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments

Available to Purchase

Bidzina Kekelia, Qianying Wu, Sreekant Narumanchi, Joshua Major, Gilbert Moreno, Mehdi Asheghi, Ercan M. Dede, James Palko, Kenneth Goodson
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113781
https://doi.org/10.1115/IPACK2023-113781
View Paper titled, Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments
Open the PDF for Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments in another window
Topics: Copper, Critical heat flux, Data centers, Heat, Heat transfer, Microcoolers, Pool boiling, Refrigerants, Reliability
Proceedings Papers

At Scale Development of Thermal Test Vehicles for Data Center Liquid Cooling Developments

Available to Purchase

Ali Heydari, Harold Miyamura, Uschas Chowdhury, Yaman Mohammad Ali Manaserh, Mohammad Tradat, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Dwayne Kalma, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111307
https://doi.org/10.1115/IPACK2023-111307
View Paper titled, At Scale Development of Thermal Test Vehicles for Data Center Liquid Cooling Developments
Open the PDF for At Scale Development of Thermal Test Vehicles for Data Center Liquid Cooling Developments in another window
Topics: Cooling, Data centers, Vehicles
Proceedings Papers

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Available to Purchase

Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110587
https://doi.org/10.1115/IPACK2023-110587
View Paper titled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
Open the PDF for Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers in another window
Topics: Cooling, Data centers, Flow (Dynamics), Manifolds, Modeling
Proceedings Papers

Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution

Available to Purchase

Vibin Shalom Simon, Saket Karajgikar, Veerendra Mulay, Sai Abhideep Pundla, Krishna Bhavana Sivaraju, Gautam Gupta, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112078
https://doi.org/10.1115/IPACK2023-112078
View Paper titled, Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution
Open the PDF for Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution in another window
Topics: Cooling, Data centers, Doors, Heat exchangers
Proceedings Papers

Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server

Available to Purchase

Vibin Shalom Simon, Bhavana Reddy Mandadi, Pardeep Shahi, Himanshu Modi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
https://doi.org/10.1115/IPACK2023-112084
View Paper titled, Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server
Open the PDF for Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server in another window
Topics: Cloud computing, Computational fluid dynamics, Coolants, Cooling, Cooling systems, Data centers, Design, Electronic components, Electronics, Energy consumption
Proceedings Papers

Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks

Available to Purchase

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112404
https://doi.org/10.1115/IPACK2023-112404
View Paper titled, Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks
Open the PDF for Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks in another window
Topics: Cooling, Data centers, Density, Heat, Heat exchangers
Proceedings Papers

L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Available to Purchase

Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111564
https://doi.org/10.1115/IPACK2023-111564
View Paper titled, L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
Open the PDF for L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning in another window
Topics: Air conditioning, Cooling, Coolants, Heat, HVAC equipment, Artificial intelligence, Cooling loads, Data centers, Density, Fans
Proceedings Papers

Experimental and CFD Analysis of a Rack Manifold for High Power Density Liquid-Cooled Rack

Available to Purchase

Pardeep Shahi, Ali Heydari, Pratik Bansode, Ashwin Siddarth, Uschas Chowdhury, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Mohammad Tradat, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114351
https://doi.org/10.1115/IPACK2023-114351
View Paper titled, Experimental and CFD Analysis of a Rack Manifold for High Power Density Liquid-Cooled Rack
Open the PDF for Experimental and CFD Analysis of a Rack Manifold for High Power Density Liquid-Cooled Rack in another window
Topics: Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Manifolds, Power density