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Proceedings Papers

Comparing Wire Bonding Strategies for High Power Applications

Whit Vinson, Frida Torres, David Huitink
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140965
https://doi.org/10.1115/IPACK2024-140965
View Paper titled, Comparing Wire Bonding Strategies for High Power Applications
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Topics: Alloys, Aluminum, Current density, Electrical resistivity, Electrodiffusion, Failure, Heating, Intermetallic compounds, Joules, Nickel
Proceedings Papers

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Mahsa Montazeri, David R. Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2598
https://doi.org/10.1115/IPACK2020-2598
View Paper titled, Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects
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Topics: Electrodiffusion, Solders, Stress, Reliability, Tension, Copper, Current density, Wire, Bonding, Electrical resistance
Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
https://doi.org/10.1115/IPACK2019-6408
View Paper titled, Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density
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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74059
https://doi.org/10.1115/IPACK2017-74059
View Paper titled, Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
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Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons
Proceedings Papers

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74092
https://doi.org/10.1115/IPACK2017-74092
View Paper titled, Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line
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Topics: Current density, Damage, Electrodiffusion, Reservoirs, Shapes, Density, Anodes, Computer simulation
Proceedings Papers

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Daniel Bae, Raphael Mandel, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A024, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74158
https://doi.org/10.1115/IPACK2017-74158
View Paper titled, Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling
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Topics: Bonding, Cooling, Design, Manifolds, Microchannels, Heat flux, Electronics, Fluids, Manufacturing, Computational fluid dynamics
Proceedings Papers

Design Considerations of Packaging a High Voltage Current Switch

Ankan De, Adam Morgan, Subhashish Bhattacharya, Douglas C. Hopkins
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48714
https://doi.org/10.1115/IPACK2015-48714
View Paper titled, Design Considerations of Packaging a High Voltage Current Switch
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Topics: Design, Packaging, Switches, Anodes, Computer software, Current density, Electromagnetic fields, Gates (Closures), Packing (Shipments), Packings (Cushioning)
Proceedings Papers

Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir

Kazuhiro Fujisaki, Hikaru Narita, Kazuhiko Sasagawa
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48744
https://doi.org/10.1115/IPACK2015-48744
View Paper titled, Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir
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Topics: Current density, Electrodiffusion, Numerical analysis, Reservoirs, Tree (Data structure), Damage, Metals, Electric current, Circuits, Computer simulation
Proceedings Papers

Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels

H. Y. Zhang, Xiao Yan, W. H. Zhu, Leon Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48088
https://doi.org/10.1115/IPACK2015-48088
View Paper titled, Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels
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Topics: Design, Heat sinks, Silicon, Aluminum, Copper, Energy dissipation, Heat, Modeling, Slug flows, Cooling
Proceedings Papers

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73130
https://doi.org/10.1115/IPACK2013-73130
View Paper titled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density
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Topics: Carbon nanotubes, Current density, Damage, Oxidation, Oxygen, Atoms, Carbon, Density, Electrodes, Electrodiffusion
Proceedings Papers

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73149
https://doi.org/10.1115/IPACK2013-73149
View Paper titled, Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films
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Topics: Reliability, Thin films, Electroplating, Copper, Annealing, Current density, Electrical properties, Electron backscatter diffraction, Electrical resistivity, Grain boundaries
Proceedings Papers

Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests

Shinichi Fujiwara, Nobuhiko Chiwata, Masaru Fujiyoshi, Motoki Wakano, Hisashi Tanie
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 719-723, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52110
https://doi.org/10.1115/IPACK2011-52110
View Paper titled, Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests
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Topics: Copper, Cycles, Electrodiffusion, Solders, Intermetallic compounds, Solder joints, Current density, Joining, Reliability, Accelerated life testing
Proceedings Papers

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 677-684, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52048
https://doi.org/10.1115/IPACK2011-52048
View Paper titled, Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections
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Topics: Copper, Electrical properties, Grain boundaries, Thin films, Fracture (Materials), Annealing, Reliability, Brittle fracture, Electron backscatter diffraction, Stress
Proceedings Papers

Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 685-690, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52058
https://doi.org/10.1115/IPACK2011-52058
View Paper titled, Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration
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Topics: Copper, Electrodiffusion, Stress, Thin films, Atoms, Sulfur, Current density, Electroplating, Fracture (Materials), Fracture (Process)
Proceedings Papers

Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density

Kazuhiko Sasagawa, Jun Unuma, Takehiro Abo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 487-491, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52169
https://doi.org/10.1115/IPACK2011-52169
View Paper titled, Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density
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Topics: Carbon nanotubes, Current density, Damage, Oxygen, Multi-walled carbon nanotubes, Oxidation, Carbon, Density, Electrodiffusion, Electrons
Proceedings Papers

Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering

Xu Zhao, Masumi Saka, Mitsuo Yamashita, Fumiaki Togoh
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 397-400, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89282
https://doi.org/10.1115/InterPACK2009-89282
View Paper titled, Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering
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Topics: Electrodiffusion, Sputtering (Irradiation), Diffusion (Physics), Grain size, Temperature, Ceramics, Current density, Electron field emission, Focused ion beams, Materials properties
Proceedings Papers

Electromigration Damage Mechanics of Interconnects

Cemal Basaran, Minghui Lin
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 83-94, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89006
https://doi.org/10.1115/InterPACK2009-89006
View Paper titled, Electromigration Damage Mechanics of Interconnects
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Topics: Damage mechanics, Electrodiffusion, Damage, Nanoelectronics, Boundary-value problems, Current density, Diffusion (Physics), Copper, Materials degradation, Plasticity
Proceedings Papers

Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree

Kazuhiko Sasagawa, Akihiko Kirita, Takehiro Abo, Abdul Hafiz Nor Hassan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 119-124, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89229
https://doi.org/10.1115/InterPACK2009-89229
View Paper titled, Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree
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Topics: Computer simulation, Current density, Damage, Electrodiffusion, Reliability, Atoms, Electrons, Evaluation methods, Integrated circuits, Silicon
Proceedings Papers

Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 193-200, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89014
https://doi.org/10.1115/InterPACK2009-89014
View Paper titled, Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale
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Topics: Copper, Heating, Interferometry, Joules, Heat, Current density, Design, Electrodiffusion, Electronic packaging, Energy dissipation
Proceedings Papers

Evaluation of Threshold Current Density of Electromigration Damage in Angled Bamboo Lines

Kazuhiko Sasagawa, Shota Fukushi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 849-854, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33237
https://doi.org/10.1115/IPACK2007-33237
View Paper titled, Evaluation of Threshold Current Density of Electromigration Damage in Angled Bamboo Lines
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Topics: Current density, Damage, Electrodiffusion, Metals, Reliability, Atoms, Computer simulation, Corners (Structural elements), Density, Electrons