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Proceedings Papers

Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems

Tianyi Gao, Marcelo del Valle, Alfonso Ortega, Bahgat G. Sammakia
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A043, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48377
https://doi.org/10.1115/IPACK2015-48377
View Paper titled, Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems
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Topics: Cooling systems, Data centers, Experimental characterization, Heat exchangers, Transients (Dynamics), Water, Computer simulation, Flow (Dynamics), Temperature, Coolers
Proceedings Papers

Experimental Characterization of the Transient Response of Air/Water Crossflow Heat Exchangers for Data Center Cooling Systems

Marcelo del Valle, Alfonso Ortega
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A021, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48375
https://doi.org/10.1115/IPACK2015-48375
View Paper titled, Experimental Characterization of the Transient Response of Air/Water Crossflow Heat Exchangers for Data Center Cooling Systems
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Topics: Cooling systems, Data centers, Experimental characterization, Heat exchangers, Transients (Dynamics), Water, Flow (Dynamics), Temperature, Circuits, Cooling
Proceedings Papers

Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink

Afzal Husain, Jun-Hee Kim, Kwang-Yong Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73063
https://doi.org/10.1115/IPACK2013-73063
View Paper titled, Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink
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Topics: Heat sinks, Silicon, Flow (Dynamics), Laminar flow, Design, Boundary-value problems, Cross-flow, Electronics, Heat flux, Heat transfer
Proceedings Papers

Interaction of Synthetic Jet Cooling Performance With Gravity and Buoyancy Driven Flows

Mehmet Arik, Yogen Utturkar, Mustafa Gursoy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 123-128, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33188
https://doi.org/10.1115/IPACK2007-33188
View Paper titled, Interaction of Synthetic Jet Cooling Performance With Gravity and Buoyancy Driven Flows
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Topics: Buoyancy, Cooling, Flow (Dynamics), Gravity (Force), Heat transfer, Boundary layers, Convection, Cross-flow, Energy dissipation, Heat
Proceedings Papers

Laminar Cross-Flow Conjugated Forced Convection Heat Transfer From a Cylinder With Fins

Bassam A. K. Abu-Hijleh
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 565-570, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33553
https://doi.org/10.1115/IPACK2007-33553
View Paper titled, Laminar Cross-Flow Conjugated Forced Convection Heat Transfer From a Cylinder With Fins
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Topics: Cross-flow, Cylinders, Fins, Forced convection, Heat transfer, Diluents, Reynolds number
Proceedings Papers

Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow

Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Dongming He, Suzana Prstic
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 717-725, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73086
https://doi.org/10.1115/IPACK2005-73086
View Paper titled, Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow
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Topics: Cross-flow, Heat exchangers, Pressure drop, Silicon, Thermal resistance, Dimensions, Fins, Fluids, Friction, Pins (Engineering)
Proceedings Papers

Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow

Felipe E. Ortega Gutierrez, Alfonso Ortega, Guoping Xu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 315-327, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73228
https://doi.org/10.1115/IPACK2005-73228
View Paper titled, Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Heat, Temperature measurement, Boundary-value problems, Clearances (Engineering), Copper, Cross-flow, Finishes
Proceedings Papers

Thermal Management of Airbourne Early Warning and Electronic Warfare Systems Using Foam Metal Fins

John Klein, George Gilchrist, Jim Karanik, Noe Arcas, Richard Yurman, James Whiteside, Bill Shields, Tony Bartilucci
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 395-400, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35187
https://doi.org/10.1115/IPACK2003-35187
View Paper titled, Thermal Management of Airbourne Early Warning and Electronic Warfare Systems Using Foam Metal Fins
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Topics: Fins, Metals, Thermal management, Warfare, Heat exchangers, Heat transfer, Cooling, Heat transfer coefficients, Aircraft, Electronics