1-20 of 79
Creep
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Modelling Effect of Isothermal Aging of Anisotropic SaAgCu(SAC) Solder Joint Using Crystal Viscoplasticity

Available to Purchase

Aniket Bharamgonda, Abhijit Dasgupta, Yaxiong Chen, Torsten Hauck
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141036
https://doi.org/10.1115/IPACK2024-141036
View Paper titled, Modelling Effect of Isothermal Aging of Anisotropic SaAgCu(SAC) Solder Joint Using Crystal Viscoplasticity
Open the PDF for Modelling Effect of Isothermal Aging of Anisotropic SaAgCu(SAC) Solder Joint Using Crystal Viscoplasticity in another window
Topics: Anisotropy, Creep, Crystals, Modeling, Solder joints, Solders, Viscoplasticity
Proceedings Papers

Mechanical Characterization and Aging Behavior of iSAC Lead Free Solder

Available to Purchase

Golam Rakib Mazumder, Souvik Chakraborty, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A021, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141363
https://doi.org/10.1115/IPACK2024-141363
View Paper titled, Mechanical Characterization and Aging Behavior of iSAC Lead Free Solder
Open the PDF for Mechanical Characterization and Aging Behavior of iSAC Lead Free Solder in another window
Topics: Alloys, Creep, Elastic moduli, Lead-free solders, Nanoindentation, Stress
Proceedings Papers

Evolution of Mechanical Properties and Microstructure of SAC305 Lead Free Solder Subjected to Mechanical Cycling and High Temperature Aging

Available to Purchase

Mahbub Alam Maruf, Golam Rakib Mazumder, Souvik Chakraborty, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A019, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141347
https://doi.org/10.1115/IPACK2024-141347
View Paper titled, Evolution of Mechanical Properties and Microstructure of SAC305 Lead Free Solder Subjected to Mechanical Cycling and High Temperature Aging
Open the PDF for Evolution of Mechanical Properties and Microstructure of SAC305 Lead Free Solder Subjected to Mechanical Cycling and High Temperature Aging in another window
Topics: Creep, High temperature, Lead-free solders, Mechanical properties, Nanoindentation, Scanning electron microscopy
Proceedings Papers

Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages

Available to Purchase

Ibaad Gandikota, Aniket Bharamgonda, Abhijit Dasgupta, Patrick McCluskey
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A016, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141249
https://doi.org/10.1115/IPACK2024-141249
View Paper titled, Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages
Open the PDF for Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages in another window
Topics: Event history analysis, Fatigue, Gallium nitride, Solders, Failure, Creep, Delamination, Failure mechanisms, Fatigue life, Finite element analysis
Proceedings Papers

Incorporation of Damage in Creep Models for SAC305 Lead Free Solder

Available to Purchase

Golam Rakib Mazumder, Souvik Chakraborty, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112030
https://doi.org/10.1115/IPACK2023-112030
View Paper titled, Incorporation of Damage in Creep Models for SAC305 Lead Free Solder
Open the PDF for Incorporation of Damage in Creep Models for SAC305 Lead Free Solder in another window
Topics: Creep, Damage, Energy dissipation, Lead-free solders
Proceedings Papers

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Available to Purchase

Golam Rakib Mazumder, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-93878
https://doi.org/10.1115/IPACK2022-93878
View Paper titled, Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder
Open the PDF for Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder in another window
Topics: Creep, Damage, Lead-free solders, Solders
Proceedings Papers

Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods

Available to Purchase

David Leslie, Abhijit Dasgupta, Andrei Damian
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97363
https://doi.org/10.1115/IPACK2022-97363
View Paper titled, Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods
Open the PDF for Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods in another window
Topics: Creep, Silver
Proceedings Papers

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Available to Purchase

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73548
https://doi.org/10.1115/IPACK2021-73548
View Paper titled, Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys
Open the PDF for Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys in another window
Topics: Alloys, Creep, Lead-free solders, Stress-strain curves, Temperature
Proceedings Papers

Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading

Available to Purchase

Abdullah Fahim, Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2655
https://doi.org/10.1115/IPACK2020-2655
View Paper titled, Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading
Open the PDF for Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading in another window
Topics: Creep, Nanoindentation, Solder masks
Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Available to Purchase

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2695
https://doi.org/10.1115/IPACK2020-2695
View Paper titled, Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging
Open the PDF for Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging in another window
Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties
Proceedings Papers

Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints

Available to Purchase

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2690
https://doi.org/10.1115/IPACK2020-2690
View Paper titled, Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints
Open the PDF for Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints in another window
Topics: Creep, Solder joints, Testing
Proceedings Papers

Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling

Available to Purchase

S. M. Kamrul Hasan, Abdullah Fahim, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2693
https://doi.org/10.1115/IPACK2020-2693
View Paper titled, Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling
Open the PDF for Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling in another window
Topics: Creep, Lead-free solders
Proceedings Papers

Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading

Available to Purchase

Abdullah Fahim, S. M. Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6471
https://doi.org/10.1115/IPACK2019-6471
View Paper titled, Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading
Open the PDF for Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading in another window
Topics: Creep, Nanoindentation, Solder joints, Testing
Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Available to Purchase

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6561
https://doi.org/10.1115/IPACK2019-6561
View Paper titled, Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties
Open the PDF for Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties in another window
Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)
Proceedings Papers

Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints

Available to Purchase

Mohd Aminul Hoque, Md Mahmudur Chowdhury, Sa’d Hamasha, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6567
https://doi.org/10.1115/IPACK2019-6567
View Paper titled, Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints
Open the PDF for Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints in another window
Topics: Creep, Lead-free solders, Mechanical properties, Nanoindentation, Shear (Mechanics)
Proceedings Papers

The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials

Available to Purchase

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8405
https://doi.org/10.1115/IPACK2018-8405
View Paper titled, The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials
Open the PDF for The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials in another window
Topics: Hardening (Curing), Mechanical behavior, Solder masks, Temperature, Ultraviolet radiation, Creep, Mechanical properties, Elastic moduli, Stress, Tensile testing
Proceedings Papers

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

Available to Purchase

Abdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8408
https://doi.org/10.1115/IPACK2018-8408
View Paper titled, Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging
Open the PDF for Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging in another window
Topics: Lead-free solders, Mechanical properties, Nanoindentation, Tin, Solder joints, Particulate matter, Composite materials, Creep, Deformation, Elastic moduli
Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Available to Purchase

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8345
https://doi.org/10.1115/IPACK2018-8345
View Paper titled, Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)
Open the PDF for Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA) in another window
Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design
Proceedings Papers

Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders

Available to Purchase

Mohammad S. Alam, K. M. Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A020, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8396
https://doi.org/10.1115/IPACK2018-8396
View Paper titled, Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders
Open the PDF for Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders in another window
Topics: Lead-free solders, Mechanical behavior, Temperature effects, High temperature, Solders, Temperature, Mechanical properties, Alloys, Stress, Tensile strength
Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Available to Purchase

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74133
https://doi.org/10.1115/IPACK2017-74133
View Paper titled, Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?
Open the PDF for Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration? in another window
Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling