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Proceedings Papers

Effects of Pores on Crack Propagation in Sintered-Silver Die Attach: A Baseline Model

Emmanuel Arriola, Guo-Quan Lu, Aristotle Ubando
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113208
https://doi.org/10.1115/IPACK2023-113208
View Paper titled, Effects of Pores on Crack Propagation in Sintered-Silver Die Attach: A Baseline Model
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Topics: Crack propagation, Reliability, Silver
Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2676
https://doi.org/10.1115/IPACK2020-2676
View Paper titled, Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging
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Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)
Proceedings Papers

In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74177
https://doi.org/10.1115/IPACK2017-74177
View Paper titled, In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading
Open the PDF for In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading in another window
Topics: Fatigue cracks, Synchrotron radiation, X-rays, Solders, Fracture (Materials), Nondestructive evaluation, Ceramics, Crack propagation, Cycles, Delamination
Proceedings Papers

Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Takuya Hanamura, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48553
https://doi.org/10.1115/IPACK2015-48553
View Paper titled, Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography
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Topics: Fatigue cracks, Solder joints, Synchrotron radiation, X-rays, Solders, Crack propagation, Fracture (Materials), Microcracks, Ball-Grid-Array packaging, Ceramics
Proceedings Papers

Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures

Toshihiko Sayama, Hiroyuki Tsuritani, Yoshiyuki Okamoto, Masayoshi Kinoshita, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48605
https://doi.org/10.1115/IPACK2015-48605
View Paper titled, Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures
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Topics: Fatigue cracks, Shear (Mechanics), Solder joints, Stiffness, Cycles, Fatigue testing, Fracture (Materials), Stress, Copper, Corners (Structural elements)
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48447
https://doi.org/10.1115/IPACK2015-48447
View Paper titled, A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface
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Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

Takahiro Omori, Kenji Hirohata, Tomoko Monda, Minoru Mukai
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73161
https://doi.org/10.1115/IPACK2013-73161
View Paper titled, Large-Scale Damage Path Simulation for Solder Joints in a BGA Package
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Topics: Ball-Grid-Array packages, Damage, Simulation, Solder joints, Fatigue, Crack propagation, Electronic packages, Fatigue life, Modeling, Printed circuit boards
Proceedings Papers

Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Masato Hoshino, Takao Mori
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73091
https://doi.org/10.1115/IPACK2013-73091
View Paper titled, Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints
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Topics: Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Fracture (Materials), Microcracks, Solders
Proceedings Papers

Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73192
https://doi.org/10.1115/IPACK2013-73192
View Paper titled, Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint
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Topics: Damage, Low cycle fatigue, Solder joints, Tin, Grain boundaries, Fracture (Materials), Stress concentration, Crack propagation, Cycles, Electron backscatter diffraction
Proceedings Papers

Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Shinichi Fujiwara
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 725-732, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52115
https://doi.org/10.1115/IPACK2011-52115
View Paper titled, Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball
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Topics: Ball-Grid-Array packaging, Flip-chip, Solders, Solder joints, Impact strength, Fatigue life, Finite element analysis, Reliability, Crack propagation, Deformation
Proceedings Papers

Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints

Takahiro Akutsu, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 691-700, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52070
https://doi.org/10.1115/IPACK2011-52070
View Paper titled, Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints
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Topics: Fatigue, Lead-free solders, Fatigue cracks, Crystals, Finite element methods, Finite element model, Solder joints, Fatigue life, Grain size, Solders
Proceedings Papers

Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection

Abhishek Tambat, Hung-Yun Lin, Ian Claydon, Ganesh Subbarayan, Dae-Young Jung, Bahgat Sammakia
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 317-323, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52237
https://doi.org/10.1115/IPACK2011-52237
View Paper titled, Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection
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Topics: Dielectric materials, Fracture (Materials), Modeling, Failure, Fracture (Process), Fracture toughness, Boundary-value problems, Computer-aided design, Crack propagation, Displacement
Proceedings Papers

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 443-451, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52047
https://doi.org/10.1115/IPACK2011-52047
View Paper titled, Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Crack propagation, Fatigue, Fracture (Materials), Microcracks, Computerized tomography
Proceedings Papers

Study on High Reliability of Lead-Free Solder Joint on Metal Substrate

Kanji Takagi, Masaki Wakabayashi, Junichi Inoue, Qiang Yu, Takahiro Akutsu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 143-148, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52044
https://doi.org/10.1115/IPACK2011-52044
View Paper titled, Study on High Reliability of Lead-Free Solder Joint on Metal Substrate
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Topics: Lead-free solders, Metals, Reliability, Rupture, Solder joints, Crack propagation, Heating, Temperature, Thermal conductivity, Design methodology
Proceedings Papers

Effect of Heat Generation on Fatigue-Crack Propagation of Solder in Power Devices

Shinji Hiramitsu, Hiroshi Shintani, Takahiro Satake, Hisashi Tanie
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 345-350, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52247
https://doi.org/10.1115/IPACK2011-52247
View Paper titled, Effect of Heat Generation on Fatigue-Crack Propagation of Solder in Power Devices
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Topics: Fatigue cracks, Heat, Solders, Crack propagation, Fatigue testing, Fracture (Materials), Boundary-value problems, Heat transfer, Reliability, Thermal stresses
Proceedings Papers

Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis

Tomohiro Takahashi, Qiang Yu, Masahiro Kobayashi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 157-163, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52068
https://doi.org/10.1115/IPACK2011-52068
View Paper titled, Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis
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Topics: Fatigue life, Solder joints, Wire, Bonding, Fatigue, Finite element methods, Fracture (Materials), Temperature distribution, Crack propagation, Damage
Proceedings Papers

Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component

Kanji Takagi, Qiang Yu, Tadahiro Shibutani, Hiroki Miyauchi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1-8, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89019
https://doi.org/10.1115/InterPACK2009-89019
View Paper titled, Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component
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Topics: Process simulation, Shapes, Solder joints, Reliability, Electronic components, Manufacturing, Simulation, Surface tension, Crack propagation, Design
Proceedings Papers

Peridynamic Theory for Simulation of Failure Mechanisms in Electronic Packages

Erkan Oterkus, Abigail Agwai, Ibrahim Guven, Erdogan Madenci
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 63-68, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89107
https://doi.org/10.1115/InterPACK2009-89107
View Paper titled, Peridynamic Theory for Simulation of Failure Mechanisms in Electronic Packages
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Topics: Electronic packages, Failure mechanisms, Simulation, Crack propagation, Graphene, Thin films, Molecular dynamics, Nanoindentation, Simulation results
Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89155
https://doi.org/10.1115/InterPACK2009-89155
View Paper titled, Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography
Proceedings Papers

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Takeyuki Itabashi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 797-802, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89232
https://doi.org/10.1115/InterPACK2009-89232
View Paper titled, Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package
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Topics: Ball-Grid-Array packages, Fracture (Materials), Solder joints, Solders, Crack propagation, Shapes, Finite element analysis, Particulate matter, Stiffness, Deformation