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Proceedings Papers

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97349
https://doi.org/10.1115/IPACK2022-97349
View Paper titled, Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Reliability, Thermomechanics, Cycles, Solders, Corners (Structural elements), Bonding, Deformation, Stiffness
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2547
https://doi.org/10.1115/IPACK2020-2547
View Paper titled, High Performance Computing Package With Chip Module on Substrate Solutions
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Thermal Interface Materials Enhanced by Micro and Nanostructures

Mei-Chien Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8307
https://doi.org/10.1115/IPACK2018-8307
View Paper titled, Thermal Interface Materials Enhanced by Micro and Nanostructures
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Topics: Architecture, Corners (Structural elements), Design, Electronic packages, Electronics, Energy gap, Failure, Finite element methods, High temperature, Nanostructures
Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8257
https://doi.org/10.1115/IPACK2018-8257
View Paper titled, Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP
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Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics
Proceedings Papers

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Deng Yun Chen, Michael Osterman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74249
https://doi.org/10.1115/IPACK2017-74249
View Paper titled, Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling
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Topics: Ball-Grid-Array packaging, Corners (Structural elements), Fatigue life, Solder joints, Solders, Adhesives, Failure, Materials properties, Stress, Temperature
Proceedings Papers

Investigation on Singular Fields at the Vertex of Interface in Piezoelectric Material Joints and its Application

Hideo Koguchi, Tomiya Maekawa, Chonlada Luangarpa
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48381
https://doi.org/10.1115/IPACK2015-48381
View Paper titled, Investigation on Singular Fields at the Vertex of Interface in Piezoelectric Material Joints and its Application
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Topics: Piezoelectric materials, Density, Displacement, Stress, Stress singularity, Compression, Corners (Structural elements)
Proceedings Papers

Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices

Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48105
https://doi.org/10.1115/IPACK2015-48105
View Paper titled, Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices
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Topics: Bonding, Boundary element methods, Cooling, Corners (Structural elements), Delamination, Joining, Numerical analysis, Packaging, Photonic equipment, Polymers
Proceedings Papers

Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures

Toshihiko Sayama, Hiroyuki Tsuritani, Yoshiyuki Okamoto, Masayoshi Kinoshita, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48605
https://doi.org/10.1115/IPACK2015-48605
View Paper titled, Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures
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Topics: Fatigue cracks, Shear (Mechanics), Solder joints, Stiffness, Cycles, Fatigue testing, Fracture (Materials), Stress, Copper, Corners (Structural elements)
Proceedings Papers

Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method

Hideo Koguchi, Yasuyuki Tsukada, Takahiko Kurahashi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73112
https://doi.org/10.1115/IPACK2013-73112
View Paper titled, Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method
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Topics: Corners (Structural elements), Silicon chips, Displacement, Galerkin method, Stress, Bonding, Density, Electronics, Failure, Lasers
Proceedings Papers

Robust Thermal Management for Embedded CPU and GPUs in Displays

Sung Ki Kim, Woo Young Kan, Sang Hak Kim, Vincent Tan, Gamal Refai-Ahmed, Ali Akbar Merrikh
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 7-11, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52014
https://doi.org/10.1115/IPACK2011-52014
View Paper titled, Robust Thermal Management for Embedded CPU and GPUs in Displays
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Topics: Graphics processing units, Thermal management, Design, Reliability, Brightness (Photometry), Circuits, Corners (Structural elements), Energy dissipation, Heat, Manufacturing
Proceedings Papers

Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)

Jae B. Kwak, Da Yu, Tung T. Nguyen, Seungbae Park
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 307-316, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52233
https://doi.org/10.1115/IPACK2011-52233
View Paper titled, Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)
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Topics: Flip-chip packages, Reliability, Solder joints, Solders, Finite element analysis, Corners (Structural elements), Stress, Thermomechanics, Chemical etching, Damage
Proceedings Papers

Effects of TSV Interposer on the Reliability of 3D IC Integration SiP

John H. Lau, Xiaowu Zhang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 65-73, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52205
https://doi.org/10.1115/IPACK2011-52205
View Paper titled, Effects of TSV Interposer on the Reliability of 3D IC Integration SiP
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Topics: Reliability, Corners (Structural elements), Creep, Cycles, Density, Failure analysis, Silicon, Solder joints, Stress, System-in-package
Proceedings Papers

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 443-451, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52047
https://doi.org/10.1115/IPACK2011-52047
View Paper titled, Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
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Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Crack propagation, Fatigue, Fracture (Materials), Microcracks, Computerized tomography
Proceedings Papers

Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the H -Integral Method

Toru Ikeda, Hiroshi Hirai, Mitsutoshi Abe, Masatsugu Chiba, Noriyuki Miyazaki
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 463-471, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52073
https://doi.org/10.1115/IPACK2011-52073
View Paper titled, Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the H -Integral Method
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Topics: Corners (Structural elements), Stress, Anisotropy, Piezoelectric materials, Eigenvalues, Electronic packages, Finite element methods, Microelectromechanical systems, Eigenfunctions, Failure
Proceedings Papers

Evaluation of the Reliability of Film Adhesives Under Hygrothermal Condition

Naoya Saiki, Kazuaki Inaba, Kikuo Kishimoto, Hideo Senoo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 473-478, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52096
https://doi.org/10.1115/IPACK2011-52096
View Paper titled, Evaluation of the Reliability of Film Adhesives Under Hygrothermal Condition
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Topics: Adhesives, Reliability, Stress, Bonding, Evaluation methods, Shear (Mechanics), Corners (Structural elements), Finite element methods, Finite element model, Integrated circuit fabrication
Proceedings Papers

Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory

Dennis Chan, Dhruv Bhate, Ganesh Subbarayan, Luu Nguyen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 199-205, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89402
https://doi.org/10.1115/InterPACK2009-89402
View Paper titled, Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory
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Topics: Fracture (Materials), Cycles, Failure analysis, Finite element model, Geometry, Solder joints, Solders, Computer software, Corners (Structural elements), Creep
Proceedings Papers

Steady-State and Transient Thermal Performance Optimization of Power Automotive Modules

Victor Chiriac
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 371-378, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89136
https://doi.org/10.1115/InterPACK2009-89136
View Paper titled, Steady-State and Transient Thermal Performance Optimization of Power Automotive Modules
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Topics: Optimization, Steady state, Transients (Dynamics), Temperature, Automotive industry, Boundary-value problems, Computer simulation, Corners (Structural elements), Heat, Heat budget (Physics)
Proceedings Papers

Larger Array Fine Pitch Wafer Level Package Drop Test Reliability

Tiao Zhou, Robert Derk, Kaysar Rahim, Xuejun Fan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 693-701, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89018
https://doi.org/10.1115/InterPACK2009-89018
View Paper titled, Larger Array Fine Pitch Wafer Level Package Drop Test Reliability
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Topics: Reliability, Semiconductor wafers, Fracture (Materials), Corners (Structural elements), Failure, Alloys, Failure mechanisms, Finite element analysis, Solder joints, Solders
Proceedings Papers

Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics

Keiji Ogawa, Heisaburo Nakagawa, Masatoshi Matsudaira
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 201-210, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89034
https://doi.org/10.1115/InterPACK2009-89034
View Paper titled, Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics
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Topics: Fiber reinforced plastics, Glass, Printed circuit boards, Drilling, Drills (Tools), Surface roughness, Temperature, Circuits, Delamination, Glass fibers
Proceedings Papers

Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints Under Mechanical Cyclic Loading at the Same Temperature

Hiroyuki Nakano, Yasuhiro Ejiri, Takao Mori, Toshihiko Sayama, Takeshi Takayanagi, Yoshiyuki Okamoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 833-839, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89275
https://doi.org/10.1115/InterPACK2009-89275
View Paper titled, Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints Under Mechanical Cyclic Loading at the Same Temperature
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Topics: Solder joints, Temperature, Tin, Creep, Fatigue cracks, Corners (Structural elements), Cycles, Finite element analysis, Finite element methods, Fracture (Materials)