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Proceedings Papers

Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model

Utsav Gupta, Andras Vass-Varnai
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97669
https://doi.org/10.1115/IPACK2022-97669
View Paper titled, Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model
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Topics: Control systems, Design, Electric vehicles, Power converters, Automobiles, Batteries, Electronic components, Energy management, Modeling, Motors
Proceedings Papers

Weather Analysis Using Neural Networks for Modular Data Centers

Feyisola Adejokun, Ashwin Siddarth, Abhishek Guhe, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8253
https://doi.org/10.1115/IPACK2018-8253
View Paper titled, Weather Analysis Using Neural Networks for Modular Data Centers
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Topics: Artificial neural networks, Data centers, Cooling, Evaporative cooling, Cooling systems, Neural network models, Temperature, Algorithms, Computation, Control systems
Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8322
https://doi.org/10.1115/IPACK2018-8322
View Paper titled, Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
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Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine
Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Michal Talmor, Jamal Yagoobi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74107
https://doi.org/10.1115/IPACK2017-74107
View Paper titled, Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device
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Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry
Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48302
https://doi.org/10.1115/IPACK2015-48302
View Paper titled, On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)
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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites
Proceedings Papers

Discrete Control of Air Conditioning Units in Mission Critical Facilities

Sergio A. Bermudez, Hendrik F. Hamann, Levente J. Klein, Fernando J. Marianno, Alan C. Claassen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A033, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48593
https://doi.org/10.1115/IPACK2015-48593
View Paper titled, Discrete Control of Air Conditioning Units in Mission Critical Facilities
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Topics: Air conditioning, Fans, Automatic control, Control systems, Cooling, Data centers, Energy consumption, Failure, Redundancy (Engineering), Safety
Proceedings Papers

Do You Know Your Onboard Temperature Sensing IC?

Herman Chu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 377-384, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52288
https://doi.org/10.1115/IPACK2011-52288
View Paper titled, Do You Know Your Onboard Temperature Sensing IC?
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Topics: Temperature, Power density, Air flow, Algorithms, Circuit design, Computer simulation, Control systems, Design, Electronic packaging, Heating
Proceedings Papers

A Data-Centric Approach for Integrated Data Center Management

Christopher Hoover
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 565-576, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52159
https://doi.org/10.1115/IPACK2011-52159
View Paper titled, A Data-Centric Approach for Integrated Data Center Management
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Topics: Data centers, Bridges (Structures), Control systems, Modeling, Visualization
Proceedings Papers

Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers

Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Xiao Ping Wu, Tien Nguyen, Vijit Wuttijumnong, Randeep Singh
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 653-661, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52265
https://doi.org/10.1115/IPACK2011-52265
View Paper titled, Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers
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Topics: Computers, Data centers, Energy conservation, Heat pipes, Energy storage, Design, Storage, Water storage, Climate change, Control systems
Proceedings Papers

Desktop NC Machine Tool With Abilities of Compliant Motion and Stick-Slip Motion

Fusaomi Nagata, Shintaro Tani, Takanori Mizobuchi, Tetsuo Hase, Zenku Haga, Keigo Watanabe
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 211-217, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89042
https://doi.org/10.1115/InterPACK2009-89042
View Paper titled, Desktop NC Machine Tool With Abilities of Compliant Motion and Stick-Slip Motion
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Topics: Machine tools, Stick-slip, Finishing, Control systems, Feedback, Feedforward control, Force feedback, Motion control, Lenses (Optics), Mirrors
Proceedings Papers

Energy-Efficiency Through the Integration of Information and Communications Technology Management and Facilities Controls

Michael K. Patterson, Michael Meakins, Dennis Nasont, Prasad Pusuluri, William Tschudi, Geoffrey C. Bell, Roger Schmidt, Ken Schneebeli, Tom Brey, Monty McGraw, Wade Vinson, Jason Gloeckner
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1015-1020, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89359
https://doi.org/10.1115/InterPACK2009-89359
View Paper titled, Energy-Efficiency Through the Integration of Information and Communications Technology Management and Facilities Controls
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Topics: Energy efficiency, Technology management, Cooling systems, Data centers, Temperature, Temperature sensors, Air flow, Control systems, Cooling, Design
Proceedings Papers

Energy-Efficient Air Cooling of Data Centers at 2000 W/ft 2

Magnus K. Herrlin, Michael K. Patterson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 875-880, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89224
https://doi.org/10.1115/InterPACK2009-89224
View Paper titled, Energy-Efficient Air Cooling of Data Centers at 2000 W/ft 2
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Topics: Cooling, Data centers, Air flow, Density, Design, Heat, Computational fluid dynamics, Cooling systems, Energy efficiency, Control systems
Proceedings Papers

Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer

Ronald Warzoha, Amy Fleischer, Simon D. Bird, Mahesh Gandhi, Ashok Sundaram
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 945-951, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89294
https://doi.org/10.1115/InterPACK2009-89294
View Paper titled, Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer
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Topics: Cooling systems, Design, Heat, Stress, Control systems, Forced convection, Mineral oil, Natural convection, Power grids, Renewable energy
Proceedings Papers

Reliability of Indium Solder for Cold Temperature Packaging

Rui Wu, F. Patrick McCluskey
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 553-556, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33456
https://doi.org/10.1115/IPACK2007-33456
View Paper titled, Reliability of Indium Solder for Cold Temperature Packaging
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Topics: Packaging, Reliability, Solders, Temperature, Stress, Ceramics, Control systems, Damage, Failure, Fatigue
Proceedings Papers

Design and Driving Methodology of Out-of-Plane Electrostatic Microactuator With Extended Stable Motion Range

Takashi Fukushige, Seiichi Hata, Takehiko Hayashi, Akira Shimokohbe
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1709-1713, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73145
https://doi.org/10.1115/IPACK2005-73145
View Paper titled, Design and Driving Methodology of Out-of-Plane Electrostatic Microactuator With Extended Stable Motion Range
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Topics: Design, Microactuators, Cantilevers, Electrodes, Engineering prototypes, Shapes, Control systems, Deflection, Design methodology, Equilibrium (Physics)
Proceedings Papers

Control of a Laboratory-Based Thermal Management System

Mark H. McKinney, Charles Wall
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 417-421, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35198
https://doi.org/10.1115/IPACK2003-35198
View Paper titled, Control of a Laboratory-Based Thermal Management System
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Topics: Control systems, Refrigeration, Thermal management, Vapors
Proceedings Papers

Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems

B. Elliott Short, Jr., Donald C. Price, Peter E. Raad
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 47-55, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35004
https://doi.org/10.1115/IPACK2003-35004
View Paper titled, Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems
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Topics: Design, Electronics, Reynolds number, Control systems, Fins, Flow (Dynamics), Friction
Proceedings Papers

Miniature Loop Heat Pipes for Electronic Cooling

Triem T. Hoang, Tamara A. O’Connell, Jentung Ku, C. Dan Butler, Theodore D. Swanson
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 517-525, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35245
https://doi.org/10.1115/IPACK2003-35245
View Paper titled, Miniature Loop Heat Pipes for Electronic Cooling
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Topics: Computer cooling, Heat pipes, Heat, Electronics, Packaging, Water, Control systems, Electricity (Physics), Energy dissipation, Fluids