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Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73456
https://doi.org/10.1115/IPACK2021-73456
View Paper titled, Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q
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Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis
Proceedings Papers

CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware

Satyam Saini, Kaustubh K. Adsul, Pardeep Shahi, Amirreza Niazmand, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2590
https://doi.org/10.1115/IPACK2020-2590
View Paper titled, CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware
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Topics: Computational fluid dynamics, Contamination, Data centers, Hardware, Modeling, Particulate matter
Proceedings Papers

Development of a Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center

Jimil M. Shah, Roshan Anand, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Prabjit Singh, Mike Kaler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6601
https://doi.org/10.1115/IPACK2019-6601
View Paper titled, Development of a Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center
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Topics: Contamination, Data centers, Particulate matter
Proceedings Papers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8436
https://doi.org/10.1115/IPACK2018-8436
View Paper titled, Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization
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Topics: Air flow, Data centers, Density, Flow simulation, Particulate matter, Cooling, Contamination, Air conditioning, Carbon, Computer software
Proceedings Papers

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

Dinesh P. R. Thanu, Roozbeh Danaei, Alexander Bermudez, Sergio A. Chan, Suzana Prstic
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8254
https://doi.org/10.1115/IPACK2018-8254
View Paper titled, Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging
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Topics: Integrated circuit packaging, Metal bonding, Polymers, Bonding, Manufacturing, Metals, Adhesion, Warping, Adhesives, Chemistry
Proceedings Papers

Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability

Prabjit Singh, Levente Klein, Dereje Agonafer, Jimil M. Shah, Kanan D. Pujara
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48176
https://doi.org/10.1115/IPACK2015-48176
View Paper titled, Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability
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Topics: Contamination, Particulate matter, Reliability, Temperature, Data centers, Electronic equipment, Temperature effects, Cutting, High temperature, Risk
Proceedings Papers

Energy Efficiency and Air Quality Considerations in Airside Economized Data Centers

Levente J. Klein, Sergio A. Bermudez, Fernando J. Marianno, Hendrik F. Hamann, Prabjit Singh
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48349
https://doi.org/10.1115/IPACK2015-48349
View Paper titled, Energy Efficiency and Air Quality Considerations in Airside Economized Data Centers
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Topics: Air pollution, Data centers, Energy efficiency, Cooling, Corrosion, Temperature, Sensors, Air conditioning, Air flow, Contamination
Proceedings Papers

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

Tejeshkumar Bagul, Kanan Pujara, Jimil Shah, Oluwaseun Awe, Dereje Agonafer
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A034, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48049
https://doi.org/10.1115/IPACK2015-48049
View Paper titled, Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination
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Topics: Absorption, Contamination, Corrosion, Data centers, Air conditioning, Gases, Reliability, Wheels, China, Circuits
Proceedings Papers

Development of a Miniature Vapor Compression Refrigeration System for Electronic Cooling

Gareth F. Davies, Ian W. Eames, Paul B. Bailey, Michael W. Dadd, Adam Janiszewski, C. Richard Stone, Graeme G. Maidment, Brian Agnew
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 399-408, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89162
https://doi.org/10.1115/InterPACK2009-89162
View Paper titled, Development of a Miniature Vapor Compression Refrigeration System for Electronic Cooling
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Topics: Compression, Computer cooling, Refrigeration, Vapors, Compressors, Cooling, Heat, Heat exchangers, Porous materials, Transients (Dynamics)
Proceedings Papers

Process Development and Die Shear Testing in MOEMS Packaging

Nikhil Lakhkar, Abiodun Fasoro, Amit Patil, Woo Ho Lee, Dan Popa, Dereje Agonafer, Harry Stephanou
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 971-977, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33986
https://doi.org/10.1115/IPACK2007-33986
View Paper titled, Process Development and Die Shear Testing in MOEMS Packaging
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Topics: Microoptoelectromechanical systems, Packaging, Shear (Mechanics), Testing, Reliability, MEMS packaging, Microelectromechanical systems, Signals, Contamination, Failure
Proceedings Papers

Chip Scale Package for Image Sensor Device

Yung-Ching Chao, John Liu, Yao-Jung Lee, De-Shin Liu, Jeff Wang, Ching-Yang Chen, Sam Huang, Alex Lu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 993-998, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73329
https://doi.org/10.1115/IPACK2005-73329
View Paper titled, Chip Scale Package for Image Sensor Device
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Topics: Sensors, Bonding, Flip-chip, Flip-chip devices, Manufacturing, Metals, Optical glass, Reliability, Sealing (Process), Semiconductor wafers
Proceedings Papers

Very High Performance Thermal Interface Material and Attachment Technology

Ralph L. Webb, Jin Wook Paek, David Pickrell
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 537-543, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35253
https://doi.org/10.1115/IPACK2003-35253
View Paper titled, Very High Performance Thermal Interface Material and Attachment Technology
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Topics: Alloys, Contact resistance, Contamination, Copper, Diffusion (Physics), Errors, Melting, Melting point, Modeling, Oxidation