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Proceedings Papers

Enhancing Manual Visual Inspection Process by Using OpenCV AI and Anomalib for Defect Detection in Automotive Assembly and Manufacturing Process

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Stewart Christie, Anna Prakash, Elaina Ashton, Veronica Tanner
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111936
https://doi.org/10.1115/IPACK2023-111936
View Paper titled, Enhancing Manual Visual Inspection Process by Using OpenCV AI and Anomalib for Defect Detection in Automotive Assembly and Manufacturing Process
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Topics: Artificial intelligence, Flaw detection, Manufacturing, Optical quality control, Errors, Computers, Electronics, Flat heat pipes, Inspection, Laptop computers
Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

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Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72621
https://doi.org/10.1115/IPACK2021-72621
View Paper titled, Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat
Proceedings Papers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

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Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2528
https://doi.org/10.1115/IPACK2020-2528
View Paper titled, Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application
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Topics: Computers, Design, Diluents, Glass, Internet, Manufacturing, Packaging, Semiconductor wafers, Semiconductors (Materials), Smart appliances
Proceedings Papers

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

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Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2591
https://doi.org/10.1115/IPACK2020-2591
View Paper titled, Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers
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Topics: Additive manufacturing, Computational fluid dynamics, Computers, Cooling, Heat exchangers, Urethane elastomers, Sealants, Wire, Fluids, Calibration
Proceedings Papers

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

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Devdatta P. Kulkarni, Priyanka Tunuguntla, Guixiang Tan, Casey Carte
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6530
https://doi.org/10.1115/IPACK2019-6530
View Paper titled, Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink
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Topics: Cooling, Heat sinks, Maintainability, Thermal management, Data centers, Heat pipes, Air flow, Boundary-value problems, Computers, Design
Proceedings Papers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

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Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8436
https://doi.org/10.1115/IPACK2018-8436
View Paper titled, Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization
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Topics: Air flow, Data centers, Density, Flow simulation, Particulate matter, Cooling, Contamination, Air conditioning, Carbon, Computer software
Proceedings Papers

Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling

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Chienchih Chen, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8398
https://doi.org/10.1115/IPACK2018-8398
View Paper titled, Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling
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Topics: Finite element analysis, Solder joints, Simulation, Electronic packaging, Stress, Algorithms, Alloys, Ball-Grid-Array packaging, Computers, Density
Proceedings Papers

The Effect of Surface Texture on Thermal Sensation and Comfort

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Han Zhang, Alan Hedge
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A026, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74179
https://doi.org/10.1115/IPACK2017-74179
View Paper titled, The Effect of Surface Texture on Thermal Sensation and Comfort
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Topics: Computers, Heat, Surface roughness, Surface texture, Surfaces (Materials), Temperature
Proceedings Papers

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

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Jayati D. Athavale, Yogendra Joshi, Minami Yoda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74108
https://doi.org/10.1115/IPACK2017-74108
View Paper titled, Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Cooling, Temperature, Fans, Pressure, Actuators, Air conditioning
Proceedings Papers

Users’ Thermal Response to a Simulated Tablet Computer Surface

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Han Zhang, Alan Hedge, Beiyuan Guo
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A023, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48787
https://doi.org/10.1115/IPACK2015-48787
View Paper titled, Users’ Thermal Response to a Simulated Tablet Computer Surface
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Topics: Computers, Temperature, Engineering prototypes, Heat, Heating, Aluminum, Design, Sensors, Skin
Proceedings Papers

Measuring Moisture Leakage Out of Water Cooling Hardware

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Prabjit Singh, Michael Ellsworth
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48154
https://doi.org/10.1115/IPACK2015-48154
View Paper titled, Measuring Moisture Leakage Out of Water Cooling Hardware
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Topics: Cooling, Hardware, Leakage, Water, Computers, Cooling systems, Electronics, Acoustics, Coolants, Errors
Proceedings Papers

Theoretical and Empirical Energy Impacts of Economization in Data Centers

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Dan Comperchio, Sameer Behere
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48274
https://doi.org/10.1115/IPACK2015-48274
View Paper titled, Theoretical and Empirical Energy Impacts of Economization in Data Centers
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Topics: Data centers, Compressors, Energy consumption, Air conditioners, Computers, Cooling, Electronic systems, Evaporative cooling, System architecture, System monitoring
Proceedings Papers

Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption

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Hamza Salih Erden, H. Ezzat Khalifa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A026, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48430
https://doi.org/10.1115/IPACK2015-48430
View Paper titled, Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption
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Topics: Capacitance, Modeling, Parameter estimation, Water, Data centers, Transients (Dynamics), Air flow, Computers, Cooling, Failure
Proceedings Papers

Key Technologies to Implement High Thermal Ambient Data Center

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Shu Zhang, Yu Han, Nishi Ahuja, Xiaohong Liu, Huahua Ren, Guangliang Guo
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48015
https://doi.org/10.1115/IPACK2015-48015
View Paper titled, Key Technologies to Implement High Thermal Ambient Data Center
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Topics: Data centers, Temperature, Cooling, Design, Internet, Air conditioners, Ceilings, Computers, Energy consumption, Failure
Proceedings Papers

Thermodynamic Analysis of Full Liquid-Cooled Data Centers

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A. Bhalerao, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A028, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48439
https://doi.org/10.1115/IPACK2015-48439
View Paper titled, Thermodynamic Analysis of Full Liquid-Cooled Data Centers
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Topics: Data centers, Heat, Plates (structures), Cooling, Exergy, Computers, Cooling towers, Modeling, Systems analysis
Proceedings Papers

Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling

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Mark E. Steinke, Vinod Kamath, Lynn Parnell
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A030, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48466
https://doi.org/10.1115/IPACK2015-48466
View Paper titled, Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling
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Topics: Cooling, Water, Design, Air flow, Heat, Energy consumption, Energy efficiency, Stress, Algorithms, Boundary-value problems
Proceedings Papers

Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads

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Lynn Parnell, Garrison Vaughan, John Thompson, Daniel Duffy, Louis Capps, Mark E. Steinke, Vinod Kamath
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A031, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48470
https://doi.org/10.1115/IPACK2015-48470
View Paper titled, Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads
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Topics: Server racks, Stress, Water, Cooling, Flow (Dynamics), Temperature, Computers, Coolants, Density, Design
Proceedings Papers

3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler

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Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73263
https://doi.org/10.1115/IPACK2013-73263
View Paper titled, 3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler
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Topics: Microchannels, Cooling, Manufacturing, Thermohydrodynamics, Architecture, Computers, Density, Design, Electronic components, Engineering simulation
Proceedings Papers

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

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Koichi Mashiko, Masataka Mochizuki, Kazuhiko Goto, Makoto Takahashi, Masahiro Matsuda, Yasuhiro Horiuchi, Tien Nguyen
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73028
https://doi.org/10.1115/IPACK2013-73028
View Paper titled, Applications of Cold Plate Units With Micro-Channel for Cooling Electronics
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Topics: Cooling, Electronics, Microchannels, Computers, Water, Brazing, Cooling systems, Data centers, Collaboration, Design
Proceedings Papers

Dynamically Controlled Long Duration Operation of a Highly Energy Efficient Chiller-Less Data Center Test Facility

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Milnes P. David, Pritish R. Parida, Mark D. Schultz, Robert E. Simons, Michael Gaynes, Roger Schmidt, Timothy J. Chainer
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73183
https://doi.org/10.1115/IPACK2013-73183
View Paper titled, Dynamically Controlled Long Duration Operation of a Highly Energy Efficient Chiller-Less Data Center Test Facility
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Topics: Data centers, Test facilities, Cooling, Energy consumption, Water, Energy efficiency, Computers, Water temperature