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Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021

Paper No: IPACK2021-72621

DOI: https://doi.org/10.1115/IPACK2021-72621

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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat

Proceedings Papers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020

Paper No: IPACK2020-2528

DOI: https://doi.org/10.1115/IPACK2020-2528

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Topics: Computers, Design, Diluents, Glass, Internet, Manufacturing, Packaging, Semiconductor wafers, Semiconductors (Materials), Smart appliances

Proceedings Papers

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020

Paper No: IPACK2020-2591

DOI: https://doi.org/10.1115/IPACK2020-2591

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Topics: Additive manufacturing, Computational fluid dynamics, Computers, Cooling, Heat exchangers, Urethane elastomers, Sealants, Wire, Fluids, Calibration

Proceedings Papers

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

Devdatta P. Kulkarni, Priyanka Tunuguntla, Guixiang Tan, Casey Carte

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 7–9, 2019

Paper No: IPACK2019-6530

DOI: https://doi.org/10.1115/IPACK2019-6530

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Topics: Cooling, Heat sinks, Maintainability, Thermal management, Data centers, Heat pipes, Air flow, Boundary-value problems, Computers, Design

Proceedings Papers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018

Paper No: IPACK2018-8436

DOI: https://doi.org/10.1115/IPACK2018-8436

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Topics: Air flow, Data centers, Density, Flow simulation, Particulate matter, Cooling, Contamination, Air conditioning, Carbon, Computer software

Proceedings Papers

Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling

Chienchih Chen, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 27–30, 2018

Paper No: IPACK2018-8398

DOI: https://doi.org/10.1115/IPACK2018-8398

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Topics: Finite element analysis, Solder joints, Simulation, Electronic packaging, Stress, Algorithms, Alloys, Ball-Grid-Array packaging, Computers, Density

Proceedings Papers

The Effect of Surface Texture on Thermal Sensation and Comfort

Han Zhang, Alan Hedge

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A026, August 29–September 1, 2017

Paper No: IPACK2017-74179

DOI: https://doi.org/10.1115/IPACK2017-74179

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Topics: Computers, Heat, Surface roughness, Surface texture, Surfaces (Materials), Temperature

Proceedings Papers

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Jayati D. Athavale, Yogendra Joshi, Minami Yoda

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017

Paper No: IPACK2017-74108

DOI: https://doi.org/10.1115/IPACK2017-74108

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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Cooling, Temperature, Fans, Pressure, Actuators, Air conditioning

Proceedings Papers

Theoretical and Empirical Energy Impacts of Economization in Data Centers

Dan Comperchio, Sameer Behere

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A018, July 6–9, 2015

Paper No: IPACK2015-48274

DOI: https://doi.org/10.1115/IPACK2015-48274

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Topics: Data centers, Compressors, Energy consumption, Air conditioners, Computers, Cooling, Electronic systems, Evaporative cooling, System architecture, System monitoring

Proceedings Papers

Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption

Hamza Salih Erden, H. Ezzat Khalifa

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A026, July 6–9, 2015

Paper No: IPACK2015-48430

DOI: https://doi.org/10.1115/IPACK2015-48430

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Topics: Capacitance, Modeling, Parameter estimation, Water, Data centers, Transients (Dynamics), Air flow, Computers, Cooling, Failure

Proceedings Papers

Key Technologies to Implement High Thermal Ambient Data Center

Shu Zhang, Yu Han, Nishi Ahuja, Xiaohong Liu, Huahua Ren, Guangliang Guo

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A010, July 6–9, 2015

Paper No: IPACK2015-48015

DOI: https://doi.org/10.1115/IPACK2015-48015

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Topics: Data centers, Temperature, Cooling, Design, Internet, Air conditioners, Ceilings, Computers, Energy consumption, Failure

Proceedings Papers

Thermodynamic Analysis of Full Liquid-Cooled Data Centers

A. Bhalerao, A. P. Wemhoff

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A028, July 6–9, 2015

Paper No: IPACK2015-48439

DOI: https://doi.org/10.1115/IPACK2015-48439

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Topics: Data centers, Heat, Plates (structures), Cooling, Exergy, Computers, Cooling towers, Modeling, Systems analysis

Proceedings Papers

Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling

Mark E. Steinke, Vinod Kamath, Lynn Parnell

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A030, July 6–9, 2015

Paper No: IPACK2015-48466

DOI: https://doi.org/10.1115/IPACK2015-48466

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Topics: Cooling, Water, Design, Air flow, Heat, Energy consumption, Energy efficiency, Stress, Algorithms, Boundary-value problems

Proceedings Papers

Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads

Lynn Parnell, Garrison Vaughan, John Thompson, Daniel Duffy, Louis Capps, Mark E. Steinke, Vinod Kamath

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A031, July 6–9, 2015

Paper No: IPACK2015-48470

DOI: https://doi.org/10.1115/IPACK2015-48470

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Topics: Server racks, Stress, Water, Cooling, Flow (Dynamics), Temperature, Computers, Coolants, Density, Design

Proceedings Papers

Users’ Thermal Response to a Simulated Tablet Computer Surface

Han Zhang, Alan Hedge, Beiyuan Guo

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A023, July 6–9, 2015

Paper No: IPACK2015-48787

DOI: https://doi.org/10.1115/IPACK2015-48787

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Topics: Computers, Temperature, Engineering prototypes, Heat, Heating, Aluminum, Design, Sensors, Skin

Proceedings Papers

Measuring Moisture Leakage Out of Water Cooling Hardware

Prabjit Singh, Michael Ellsworth

Paper No: IPACK2015-48154

DOI: https://doi.org/10.1115/IPACK2015-48154

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Topics: Cooling, Hardware, Leakage, Water, Computers, Cooling systems, Electronics, Acoustics, Coolants, Errors

Proceedings Papers

3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler

Jackson B. Marcinichen, John R. Thome

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A020, July 16–18, 2013

Paper No: IPACK2013-73263

DOI: https://doi.org/10.1115/IPACK2013-73263

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Topics: Microchannels, Cooling, Manufacturing, Thermohydrodynamics, Architecture, Computers, Density, Design, Electronic components, Engineering simulation

Proceedings Papers

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

Koichi Mashiko, Masataka Mochizuki, Kazuhiko Goto, Makoto Takahashi, Masahiro Matsuda, Yasuhiro Horiuchi, Tien Nguyen

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A001, July 16–18, 2013

Paper No: IPACK2013-73028

DOI: https://doi.org/10.1115/IPACK2013-73028

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Topics: Cooling, Electronics, Microchannels, Computers, Water, Brazing, Cooling systems, Data centers, Collaboration, Design

Proceedings Papers

Dynamically Controlled Long Duration Operation of a Highly Energy Efficient Chiller-Less Data Center Test Facility

Milnes P. David, Pritish R. Parida, Mark D. Schultz, Robert E. Simons, Michael Gaynes, Roger Schmidt, Timothy J. Chainer

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A014, July 16–18, 2013

Paper No: IPACK2013-73183

DOI: https://doi.org/10.1115/IPACK2013-73183

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Topics: Data centers, Test facilities, Cooling, Energy consumption, Water, Energy efficiency, Computers, Water temperature

Proceedings Papers

Dynamic Analysis of Hybrid Cooling Data Centers Subjects to the Failure of CRAC Units

Tianyi Gao, Emad Samadiani, Roger Schmidt, Bahgat Sammakia

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A015, July 16–18, 2013

Paper No: IPACK2013-73196

DOI: https://doi.org/10.1115/IPACK2013-73196

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Topics: Cooling, Data centers, Dynamic analysis, Failure, Cooling systems, Water, Doors, Emergencies, Heat exchangers, Temperature

NARROW

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling

The Effect of Surface Texture on Thermal Sensation and Comfort

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Theoretical and Empirical Energy Impacts of Economization in Data Centers

Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption

Key Technologies to Implement High Thermal Ambient Data Center

Thermodynamic Analysis of Full Liquid-Cooled Data Centers

Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling

Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads

Users’ Thermal Response to a Simulated Tablet Computer Surface

Measuring Moisture Leakage Out of Water Cooling Hardware

3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

Dynamically Controlled Long Duration Operation of a Highly Energy Efficient Chiller-Less Data Center Test Facility

Dynamic Analysis of Hybrid Cooling Data Centers Subjects to the Failure of CRAC Units

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