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Proceedings Papers

Topology Optimization of Electronic Line Using Computer Aided Engineering Software

Kotaro Miura, Hiromu Kudo, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139338
https://doi.org/10.1115/IPACK2024-139338
View Paper titled, Topology Optimization of Electronic Line Using Computer Aided Engineering Software
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Topics: Computer software, Computer-aided engineering, Steady state, Topology optimization
Proceedings Papers

Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter

Pradeep Lall, Fatahi Musa, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141874
https://doi.org/10.1115/IPACK2024-141874
View Paper titled, Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter
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Topics: Filters, Low-pass filters, Reliability, Automobiles, Durability, Electronics, Adhesives, Computer software, Cutting, Engineering simulation
Proceedings Papers

Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112001
https://doi.org/10.1115/IPACK2023-112001
View Paper titled, Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques
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Topics: Additive manufacturing, Filters, Flexible electronics, Inks, Manufacturing, Silver, Sustainability, Circuits, Surface mount components, Biodegradable materials
Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97437
https://doi.org/10.1115/IPACK2022-97437
View Paper titled, Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform
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Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models
Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2695
https://doi.org/10.1115/IPACK2020-2695
View Paper titled, Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging
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Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties
Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6391
https://doi.org/10.1115/IPACK2019-6391
View Paper titled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
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Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software
Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6424
https://doi.org/10.1115/IPACK2019-6424
View Paper titled, Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6585
https://doi.org/10.1115/IPACK2019-6585
View Paper titled, Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications

Suresh Parameswaran, Gamal Refai-Ahmed, Suresh Ramalingam, Boon Ang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8300
https://doi.org/10.1115/IPACK2018-8300
View Paper titled, Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications
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Topics: Internet of things, Stress, Vehicles, Circuits, Computer software, Cooling, Cycles, Energy dissipation, Flip-chip packages, Modeling
Proceedings Papers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8436
https://doi.org/10.1115/IPACK2018-8436
View Paper titled, Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization
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Topics: Air flow, Data centers, Density, Flow simulation, Particulate matter, Cooling, Contamination, Air conditioning, Carbon, Computer software
Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8410
https://doi.org/10.1115/IPACK2018-8410
View Paper titled, The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders
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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability
Proceedings Papers

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Jayati D. Athavale, Yogendra Joshi, Minami Yoda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74108
https://doi.org/10.1115/IPACK2017-74108
View Paper titled, Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Cooling, Temperature, Fans, Pressure, Actuators, Air conditioning
Proceedings Papers

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Daniel Bae, Raphael Mandel, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A024, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74158
https://doi.org/10.1115/IPACK2017-74158
View Paper titled, Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling
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Topics: Bonding, Cooling, Design, Manifolds, Microchannels, Heat flux, Electronics, Fluids, Manufacturing, Computational fluid dynamics
Proceedings Papers

An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions

Pradeep Lall, Peter Sakalaukus, Lynn Davis
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A045, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48257
https://doi.org/10.1115/IPACK2015-48257
View Paper titled, An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions
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Topics: Computer software, Construction, Cracking (Materials), Delamination, Design, Energy efficiency, Failure, Failure mechanisms, Fracture (Process), Junctions
Proceedings Papers

Thermal Behavior of Aluminum Alloy Metal Foam Heat Sinks: A Computational and Experimental Approach

Khaled S. Al-Athel, Shahzada P. Aly, Abul Fazal M. Arif, Javad Mostaghimi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48745
https://doi.org/10.1115/IPACK2015-48745
View Paper titled, Thermal Behavior of Aluminum Alloy Metal Foam Heat Sinks: A Computational and Experimental Approach
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Topics: Aluminum alloys, Heat sinks, Metal foams, Computer-aided design, Computerized tomography, Finite element analysis, Geometry, Computer software, Engineering systems and industry applications, Mechanical behavior
Proceedings Papers

Modeling the Reflow Soldering Process in PCB’s

João Costa, Delfim Soares, Senhorinha F. Teixeira, Fátima Cerqueira, Francisco Macedo, Nelson Rodrigues, Luis Ribas, José Carlos Teixeira
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48720
https://doi.org/10.1115/IPACK2015-48720
View Paper titled, Modeling the Reflow Soldering Process in PCB’s
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Topics: Alloys, Computational fluid dynamics, Computer software, Copper, Enthalpy, Fluids, Geometry, Heat of fusion, Materials properties, Melting
Proceedings Papers

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A050, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48051
https://doi.org/10.1115/IPACK2015-48051
View Paper titled, Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature
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Topics: Temperature, Boundary-value problems, Finite element methods, Computer software, Cooling, Flux (Metallurgy), Fourier series, Heat, Heat flux, Laplace equations
Proceedings Papers

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

Masood Razavi, Alireza Dehghani-Sanij, Yuri S. Muzychka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A058, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48685
https://doi.org/10.1115/IPACK2015-48685
View Paper titled, Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane
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Topics: Convection, Thermal resistance, Heat transfer coefficients, Boundary-value problems, Cooling, Thermal analysis, Computer software, Design, Engineers, Finite volume methods
Proceedings Papers

Thermal Spreading Resistance in a Multilayered Orthotropic Circular Disk With Interfacial Resistance and Variable Heat Flux

Y. S. Muzychka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A053, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48243
https://doi.org/10.1115/IPACK2015-48243
View Paper titled, Thermal Spreading Resistance in a Multilayered Orthotropic Circular Disk With Interfacial Resistance and Variable Heat Flux
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Topics: Disks, Heat flux, Interfacial thermal resistance, Electrical conductance, Boundary-value problems, Computer software, Contact resistance, FORTRAN, Modeling, Thermal resistance
Proceedings Papers

Modeling Thermal Spreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A070, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48422
https://doi.org/10.1115/IPACK2015-48422
View Paper titled, Modeling Thermal Spreading Resistance in Via Arrays
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Topics: Modeling, Boundary-value problems, Anisotropy, Computer simulation, Computer software, Electronic packages, Finite element analysis, Flow (Dynamics), Heat, Heat flux