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Proceedings Papers

Passive Direct Liquid Cooling for High-Power Processors

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Alexei Tyryshkin, John Kim, Raffaele Luca Amalfi, Ryan Enright
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
https://doi.org/10.1115/IPACK2024-141022
View Paper titled, Passive Direct Liquid Cooling for High-Power Processors
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Topics: Cooling, Refrigerants, Cooling systems, Design, Computer cooling, Condensation, Density, Electronic equipment, Electronics, Energy dissipation
Proceedings Papers

Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam

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Bolape Alade, Deogratius Kisitu, May Battleson, Denver Schaffarzick, Alfonso Ortega
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140105
https://doi.org/10.1115/IPACK2024-140105
View Paper titled, Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam
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Topics: Copper, Forced convection, Water, Compression, Flow (Dynamics), Metal foams, Cooling, Heat, Computer cooling, Coolants
Proceedings Papers

Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application

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Heungdong Kwon, Daeyoung Kong, Hyoungsoon Lee, James Palko, Ercan M. Dede, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140613
https://doi.org/10.1115/IPACK2024-140613
View Paper titled, Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application
Open the PDF for Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application in another window
Topics: Boiling, Computer cooling, Flow (Dynamics), Heat, Manifolds, Microchannels, Microcoolers, Silicon
Proceedings Papers

Cooling Electronics by Direct Contact With Liquids

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Amanie N. Abdelmessih, David F. Delgado, Ezry Lopez, Nathaniel P. Michael, Grant P. Napierala, Nicholas J. Ramos
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141334
https://doi.org/10.1115/IPACK2024-141334
View Paper titled, Cooling Electronics by Direct Contact With Liquids
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Topics: Computer cooling, Cooling, Electronics
Proceedings Papers

Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement

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Qianying Wu, Zheng Gong, Chih-Yao Chan, Heungdong Kwon, Kenneth Goodson, Tiwei Wei
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109944
https://doi.org/10.1115/IPACK2023-109944
View Paper titled, Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement
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Topics: Boiling, Bubbles, Computer cooling, Coolants, Cooling, Cooling systems, Drying, Energy consumption, Experimental characterization, Flow (Dynamics)
Proceedings Papers

Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage

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Michael Shanks, Uduak Inyang-Udoh, Neera Jain
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111816
https://doi.org/10.1115/IPACK2023-111816
View Paper titled, Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage
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Topics: Thermal energy storage, Thermal management, Transients (Dynamics), Control equipment, Heat, Simulation, Architecture, Computer cooling, Feedback, Fluids
Proceedings Papers

Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling

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Filippo Cataldo, Raffaele Luca Amalfi
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97729
https://doi.org/10.1115/IPACK2022-97729
View Paper titled, Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling
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Topics: Computer cooling, Cooling, Cooling systems
Proceedings Papers

Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling

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Deogratius Kisitu, Carol Caceres, Metodi Zlatinov, Denver Schaffarzick, Alfonso Ortega
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97400
https://doi.org/10.1115/IPACK2022-97400
View Paper titled, Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling
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Topics: Boiling, Computer cooling, Cooling, Copper, Flow (Dynamics), Heat flux, Metal foams
Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

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Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72621
https://doi.org/10.1115/IPACK2021-72621
View Paper titled, Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat
Proceedings Papers

Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications

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John Kim, Raffaele L. Amalfi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72618
https://doi.org/10.1115/IPACK2021-72618
View Paper titled, Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications
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Topics: Computer cooling, Heat transfer, Machine learning, Machinery, Refrigerants, Two-phase flow
Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

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Lucas Arrivo, Steven Schon, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73015
https://doi.org/10.1115/IPACK2021-73015
View Paper titled, Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
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Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling
Proceedings Papers

Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material

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Bharath Bharadwaj, Prashant Singh, Roop L. Mahajan
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69254
https://doi.org/10.1115/IPACK2021-69254
View Paper titled, Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material
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Topics: Agglomeration (Materials), Coal, Computer cooling, Electronic packages, Electronic packaging, Energy dissipation, Graphene, Graphite, Heat, Heat sinks
Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

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Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72612
https://doi.org/10.1115/IPACK2021-72612
View Paper titled, Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
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Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design
Proceedings Papers

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

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Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2562
https://doi.org/10.1115/IPACK2020-2562
View Paper titled, Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling
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Topics: Composite materials, Computer cooling, Heat flux, Heat sinks, Phase change materials, Thermal conductivity
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

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Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2541
https://doi.org/10.1115/IPACK2020-2541
View Paper titled, Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

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Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2605
https://doi.org/10.1115/IPACK2020-2605
View Paper titled, Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow
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Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow

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E. A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, M. Arik
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2569
https://doi.org/10.1115/IPACK2020-2569
View Paper titled, An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow
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Topics: Air flow, Computer cooling, Cooling, Design, Fins, Flow (Dynamics), Forced convection, Heat flux, Heat sinks, Heat transfer
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

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Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2542
https://doi.org/10.1115/IPACK2020-2542
View Paper titled, Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

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Arun V. Gowda, Rinaldo L. Miorini, Michael Fish, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2608
https://doi.org/10.1115/IPACK2020-2608
View Paper titled, Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions
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Topics: Silicon, Steady state, Transients (Dynamics), Additive manufacturing, Flow (Dynamics), Army, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

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Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2591
https://doi.org/10.1115/IPACK2020-2591
View Paper titled, Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers
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Topics: Additive manufacturing, Computational fluid dynamics, Computers, Cooling, Heat exchangers, Urethane elastomers, Sealants, Wire, Fluids, Calibration