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Proceedings Papers

Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications

Nikhil R. Lakhkar
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68870
https://doi.org/10.1115/IPACK2021-68870
View Paper titled, Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications
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Topics: Cooling, Design, Electric vehicles, Hybrid electric vehicles, Vehicles, Compressors, Batteries, Electrification, HVAC equipment, Internal combustion engines
Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73271
https://doi.org/10.1115/IPACK2021-73271
View Paper titled, Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model
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Topics: Compression, Compressors, Cooling, Heat recovery, Modeling, Thermal management, Vapors
Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48814
https://doi.org/10.1115/IPACK2015-48814
View Paper titled, Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps
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Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities
Proceedings Papers

Theoretical and Empirical Energy Impacts of Economization in Data Centers

Dan Comperchio, Sameer Behere
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48274
https://doi.org/10.1115/IPACK2015-48274
View Paper titled, Theoretical and Empirical Energy Impacts of Economization in Data Centers
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Topics: Data centers, Compressors, Energy consumption, Air conditioners, Computers, Cooling, Electronic systems, Evaporative cooling, System architecture, System monitoring
Proceedings Papers

Micro Cryogenic Coolers With Mixed Refrigerants

Ryan Lewis, Yunda Wang, Paul Schroeder, Collin Coolidge, Ray Radebaugh, Y. C. Lee
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73290
https://doi.org/10.1115/IPACK2013-73290
View Paper titled, Micro Cryogenic Coolers With Mixed Refrigerants
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Topics: Coolers, Refrigerants, Microelectromechanical systems, Flow (Dynamics), Heat exchangers, Low temperature, Microchannel flow, Pressure, Temperature, Valves
Proceedings Papers

CFD Modeling of Indirect/Direct Evaporative Cooling Unit for Modular Data Center Applications

Betsegaw Gebrehiwot, Nikhil Dhiman, Kasturi Rajagopalan, Dereje Agonafer, Naveen Kannan, James Hoverson, Mike Kaler
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A054, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73302
https://doi.org/10.1115/IPACK2013-73302
View Paper titled, CFD Modeling of Indirect/Direct Evaporative Cooling Unit for Modular Data Center Applications
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Topics: Computational fluid dynamics, Data centers, Evaporative cooling, Modeling, Climate, Containers, Cooling, Cooling systems, Air conditioning, Air filters
Proceedings Papers

Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Niru Kumari, Cullen E. Bash, Scot Heath, Brandon Rubenstein
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 553-563, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52141
https://doi.org/10.1115/IPACK2011-52141
View Paper titled, Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency
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Topics: Data centers, Energy efficiency, Uncertainty, Stress, Temperature, Design, Experimental analysis, Flow (Dynamics), Air flow, Compressors
Proceedings Papers

Development of a Miniature Vapor Compression Refrigeration System for Electronic Cooling

Gareth F. Davies, Ian W. Eames, Paul B. Bailey, Michael W. Dadd, Adam Janiszewski, C. Richard Stone, Graeme G. Maidment, Brian Agnew
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 399-408, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89162
https://doi.org/10.1115/InterPACK2009-89162
View Paper titled, Development of a Miniature Vapor Compression Refrigeration System for Electronic Cooling
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Topics: Compression, Computer cooling, Refrigeration, Vapors, Compressors, Cooling, Heat, Heat exchangers, Porous materials, Transients (Dynamics)
Proceedings Papers

Miniaturized Refrigeration System With Absorption: Application to Microelectronics Cooling

Victor Chiriac, Florea Chiriac
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 87-92, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33726
https://doi.org/10.1115/IPACK2007-33726
View Paper titled, Miniaturized Refrigeration System With Absorption: Application to Microelectronics Cooling
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Topics: Absorption, Compressors, Cooling, Heat exchangers, Microelectronic devices, Refrigeration
Proceedings Papers

High Coefficient of Performance Quantum Well Thermoelectric Nano Cooler

Velimir Jovanovic, Saeid Ghamaty, Daniel Krommenhoek, John C. Bass
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 595-601, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33838
https://doi.org/10.1115/IPACK2007-33838
View Paper titled, High Coefficient of Performance Quantum Well Thermoelectric Nano Cooler
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Topics: Quantum wells, Cooling, Sensors, Temperature, National Institute of Standards and Technology, Thin films, Air conditioning, Compression, Compressors, Cooling systems
Proceedings Papers

Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling

Ioan Sauciuc, Hakan Erturk, Gregory Chrysler, Vikram Bala, Ravi Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2153-2159, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73243
https://doi.org/10.1115/IPACK2005-73243
View Paper titled, Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling
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Topics: Compressors, Computation, Computational fluid dynamics, Computer cooling, Control equipment, Cooling, Cycles, Energy consumption, Fluids, Geometry
Proceedings Papers

Thermodynamic Design of Compact Thermal Compressor for Sorption Assisted Cryogenic Cooling of Electronics

Shivesh K. Suman, Andrei G. Fedorov, Yogendra K. Joshi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 647-654, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73452
https://doi.org/10.1115/IPACK2005-73452
View Paper titled, Thermodynamic Design of Compact Thermal Compressor for Sorption Assisted Cryogenic Cooling of Electronics
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Topics: Compressors, Cooling, Design, Electronics, Refrigeration, Sorption
Proceedings Papers

Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging

Patrick E. Phelan, Victor Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 309-315, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35140
https://doi.org/10.1115/IPACK2003-35140
View Paper titled, Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging
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Topics: Electronic packaging, Refrigeration, Compression, Vapors, Compressors, Cycles, Microelectronic devices, Thermoelectric coolers