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Proceedings Papers

High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape

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Kaiying Jiang, Heungdong Kwon, Hansen Qiao, Yini He, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140287
https://doi.org/10.1115/IPACK2024-140287
View Paper titled, High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape
Open the PDF for High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape in another window
Topics: Composite materials, Copper, Gallium, Liquid metals, Nanowires, Polydimethylsiloxane, Thermal characterization, Thermal resistance, ASTM International, Contact resistance
Proceedings Papers

Thermal and Electrical Performance of Silicone Gel Insulation With Encapsulated Phase Change Material Additives

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Joshua Kasitz, Muhammad Ghufran, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111964
https://doi.org/10.1115/IPACK2023-111964
View Paper titled, Thermal and Electrical Performance of Silicone Gel Insulation With Encapsulated Phase Change Material Additives
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Topics: Composite materials, Cooling, Insulation, Phase change materials, Silicones
Proceedings Papers

Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites

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Hansen Qiao, Katherine Jiang, Tiwei Wei, Yujui Lin, Chris Perez, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113126
https://doi.org/10.1115/IPACK2023-113126
View Paper titled, Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites
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Topics: Composite materials, Copper, Nanowires, Plasma desorption mass spectrometry
Proceedings Papers

Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam

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Shinya Kawakita, Yuki Ishizaka, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-70410
https://doi.org/10.1115/IPACK2021-70410
View Paper titled, Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam
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Topics: Composite materials, Copper, Thermal conductivity
Proceedings Papers

Thermal Analysis of Wavy Thermal Management System With Phase Change Composite and Pyrolytic Graphite Sheet for Cylindrical Lithium-Ion Battery Packs

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Damon Gresham-Chisolm, Sonya Smith
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2565
https://doi.org/10.1115/IPACK2020-2565
View Paper titled, Thermal Analysis of Wavy Thermal Management System With Phase Change Composite and Pyrolytic Graphite Sheet for Cylindrical Lithium-Ion Battery Packs
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Topics: Composite materials, Graphite, Lithium-ion batteries, Thermal analysis, Thermal management, Cooling, Design, Heat, Batteries, Stress
Proceedings Papers

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

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Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2562
https://doi.org/10.1115/IPACK2020-2562
View Paper titled, Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling
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Topics: Composite materials, Computer cooling, Heat flux, Heat sinks, Phase change materials, Thermal conductivity
Proceedings Papers

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

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Abdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8408
https://doi.org/10.1115/IPACK2018-8408
View Paper titled, Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging
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Topics: Lead-free solders, Mechanical properties, Nanoindentation, Tin, Solder joints, Particulate matter, Composite materials, Creep, Deformation, Elastic moduli
Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

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Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74133
https://doi.org/10.1115/IPACK2017-74133
View Paper titled, Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?
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Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling
Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

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Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74196
https://doi.org/10.1115/IPACK2017-74196
View Paper titled, Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System
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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite
Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

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Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74112
https://doi.org/10.1115/IPACK2017-74112
View Paper titled, Thermal Metamaterials for Heat Flow Control in Electronics
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Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

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Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74244
https://doi.org/10.1115/IPACK2017-74244
View Paper titled, Optimization of Graphite Composite Latent Heat Storage Systems
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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

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Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48427
https://doi.org/10.1115/IPACK2015-48427
View Paper titled, Lid-Integral Cold Plate Topology Integration, Performance, and Reliability
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Topics: Reliability, Topology, Silicon, Packaging, Composite materials, Cooling, Finite element model, Fracture (Materials), Fracture (Process), Gaskets
Proceedings Papers

A Numerical Study on the Thermal Conductivity of Hybrid-Filler-Nanoparticle Composite Materials

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Ich-Long Ngo, Chan Byon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A089, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48740
https://doi.org/10.1115/IPACK2015-48740
View Paper titled, A Numerical Study on the Thermal Conductivity of Hybrid-Filler-Nanoparticle Composite Materials
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Topics: Composite materials, Fillers (Materials), Nanoparticles, Thermal conductivity, Particulate matter, Polymers
Proceedings Papers

Pre-Applied Inter Chip Fill for 3D-IC Chip Joining

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Yasuhiro Kawase, Makoto Ikemoto, Masaya Sugiyama, Hidehiro Yamamoto, Hideki Kiritani
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48738
https://doi.org/10.1115/IPACK2015-48738
View Paper titled, Pre-Applied Inter Chip Fill for 3D-IC Chip Joining
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Topics: Joining, Pellet fusion, Thermal conductivity, Fillers (Materials), Aluminum, Boron, Composite materials, Cooling, Density, Epoxy adhesives
Proceedings Papers

A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips

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Arthur Suszko, Mohamed S. El-Genk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A088, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48678
https://doi.org/10.1115/IPACK2015-48678
View Paper titled, A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips
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Topics: Composite materials, Cooling, Flat heat pipes, Critical heat flux, Copper, Dielectric liquids, Graphite, Nucleate pool boiling, Numerical analysis, Surface roughness
Proceedings Papers

Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels

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Sajjad Bigham, Saeed Moghaddam
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48581
https://doi.org/10.1115/IPACK2015-48581
View Paper titled, Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Physics, Bubbles, Evaporation, Heat flux, Resolution (Optics), Thermal conductivity
Proceedings Papers

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

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Hossein Sojoudi, Fernando Reiter, Samuel Graham
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73158
https://doi.org/10.1115/IPACK2013-73158
View Paper titled, Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites
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Topics: Composite materials, Electrodes, Graphene, Single-walled carbon nanotubes, Transparency, Single-walled nanotubes, Chemical vapor deposition, Electrical properties, Annealing, Heat conduction
Proceedings Papers

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

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Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73092
https://doi.org/10.1115/IPACK2013-73092
View Paper titled, Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
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Topics: Nanoparticles, Self-assembly, Columns (Structural), Evaporation, Particulate matter, Annealing, Bridges (Structures), Composite materials, Copper, Electronic packages
Proceedings Papers

Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials

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J. Liu, P. Kumar, I. Dutta, C. M. Nagaraj, R. Raj, M. Renavikar, R. Mahajan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 773-780, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52221
https://doi.org/10.1115/IPACK2011-52221
View Paper titled, Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials
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Topics: Composite materials, Solders, Sintering, Yield strength, Melting, Contact resistance, Diffusion (Physics), Electrical properties, Intermetallic compounds, Shear (Mechanics)
Proceedings Papers

Characterization of a Macrofiber Piezoelectric Composite

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David A. Miller
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 437-441, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52293
https://doi.org/10.1115/IPACK2011-52293
View Paper titled, Characterization of a Macrofiber Piezoelectric Composite
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Displacement measurement, Electrical measurement, Excitation, Fibers, Laminates, Resonance, Service life (Equipment)