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Proceedings Papers

Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141881
https://doi.org/10.1115/IPACK2024-141881
View Paper titled, Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment
Open the PDF for Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment in another window
Topics: Biodegradation, Cellulose, Circuits, Electronics, Errors, Low temperature, Manufacturing, Printing, Sanitary landfills, Stability
Proceedings Papers

Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects

Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141879
https://doi.org/10.1115/IPACK2024-141879
View Paper titled, Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects
Open the PDF for Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects in another window
Topics: Aerosols, Biodegradation, Circuits, Inks, Low temperature, Silver, Water
Proceedings Papers

Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process

Pradeep Lall, Daniel Karakitie, Ved Soni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142110
https://doi.org/10.1115/IPACK2024-142110
View Paper titled, Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process
Open the PDF for Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process in another window
Topics: Additive manufacturing, Aerosols, Ceramics, Circuits, Filters, High temperature, Inks, Laser ablation
Proceedings Papers

Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive

Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141858
https://doi.org/10.1115/IPACK2024-141858
View Paper titled, Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive
Open the PDF for Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive in another window
Topics: Adhesives, Aerosols, Circuits, Printing, Reliability, Sustainability, Temperature, Water based printing inks
Proceedings Papers

Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Matthew Bowman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140062
https://doi.org/10.1115/IPACK2024-140062
View Paper titled, Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures
Open the PDF for Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures in another window
Topics: Temperature, Testing, Circuits, Failure, Failure mechanisms, Extruding, Polysulfone, Shock (Mechanics), Silver, Accelerometers
Proceedings Papers

Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation

Pradeep Lall, Md Golam Sarwar, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141863
https://doi.org/10.1115/IPACK2024-141863
View Paper titled, Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation
Open the PDF for Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation in another window
Topics: Adhesives, Circuits, High temperature, Printing, Reliability, Signal processing
Proceedings Papers

Evaluation of Printed Logic Circuits With Additively Packaged GaN Bare Die Devices at High Temperatures

Pradeep Lall, Ved Soni, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142113
https://doi.org/10.1115/IPACK2024-142113
View Paper titled, Evaluation of Printed Logic Circuits With Additively Packaged GaN Bare Die Devices at High Temperatures
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Topics: Circuits, Electronics, Gallium nitride, High temperature, Lasers
Proceedings Papers

Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits

Pradeep Lall, Ved Soni, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112060
https://doi.org/10.1115/IPACK2023-112060
View Paper titled, Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits
Open the PDF for Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits in another window
Topics: Circuits, Electronic circuits, Electronics, Offset printing
Proceedings Papers

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
https://doi.org/10.1115/IPACK2023-114686
View Paper titled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform
Open the PDF for Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform in another window
Topics: Circuits, Inks, Silver, Water, Printing, Manufacturing, Adhesives, Electronic circuits, Electronics, Filters
Proceedings Papers

Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112069
https://doi.org/10.1115/IPACK2023-112069
View Paper titled, Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications
Open the PDF for Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications in another window
Topics: Adhesives, Circuits, Electronics, Inks, Printing
Proceedings Papers

Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112058
https://doi.org/10.1115/IPACK2023-112058
View Paper titled, Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability
Open the PDF for Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability in another window
Topics: Aerosols, Batteries, Circuits, Electronics, Inks, Offset printing, Printing, Silver, Sustainability
Proceedings Papers

Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Jian Yu, Andres Bujanda, Harvey Tsang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111895
https://doi.org/10.1115/IPACK2023-111895
View Paper titled, Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels
Open the PDF for Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels in another window
Topics: Accelerated life testing, Accelerometers, Additive manufacturing, Aluminum, Circuits, Computer numerical control machine tools, Cracking (Materials), Delamination, Domes (Structural elements), Durability
Proceedings Papers

Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink

Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111957
https://doi.org/10.1115/IPACK2023-111957
View Paper titled, Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink
Open the PDF for Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink in another window
Topics: Additive manufacturing, Aerosols, Circuits, Inks, Nanoparticles, Silver, Surface mount components, Sustainability, Water
Proceedings Papers

Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
https://doi.org/10.1115/IPACK2023-112012
View Paper titled, Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
Open the PDF for Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits in another window
Topics: Bonding, Circuits, Electrical properties, Electronics, Inks, Silver, Water, Adhesives, Low temperature, Solders
Proceedings Papers

Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112001
https://doi.org/10.1115/IPACK2023-112001
View Paper titled, Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques
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Topics: Additive manufacturing, Filters, Flexible electronics, Inks, Manufacturing, Silver, Sustainability, Circuits, Surface mount components, Biodegradable materials
Proceedings Papers

Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit

Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112064
https://doi.org/10.1115/IPACK2023-112064
View Paper titled, Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit
Open the PDF for Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit in another window
Topics: Adhesives, Aerosols, Circuits, Failure, Inks, Shear (Mechanics), Silver, Stress, Sustainability
Proceedings Papers

Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics

Pradeep Lall, Md Golam Sarwar, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112063
https://doi.org/10.1115/IPACK2023-112063
View Paper titled, Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics
Open the PDF for Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics in another window
Topics: Circuits, Electronics, Printing, Silver, Surface mount devices
Proceedings Papers

Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors

Pradeep Lall, Shriram Kulkarni, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111980
https://doi.org/10.1115/IPACK2023-111980
View Paper titled, Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors
Open the PDF for Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors in another window
Topics: Capacitors, Inductors, Resistors, Printing, Circuits, Drops, Electronics, Inks, Particulate matter, Resolution (Optics)
Proceedings Papers

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97450
https://doi.org/10.1115/IPACK2022-97450
View Paper titled, Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries
Open the PDF for Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries in another window
Topics: Circuits, Electronics, Printing
Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97430
https://doi.org/10.1115/IPACK2022-97430
View Paper titled, Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
Open the PDF for Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components in another window
Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat