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Proceedings Papers
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142110
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111917
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111534
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69270
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2648
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2614
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6436
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6616
Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8226
Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8279
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74099
Proceedings Papers
Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74177
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A030, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48503
Proceedings Papers
Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Takuya Hanamura, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48553
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73150
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73209
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73191
Proceedings Papers
Bill Burdick, Jeff Erlbaum, Kaustubh Nagarkar, Brian Yanoff, Liang Yin, Raj Bahadur, Esmaeil Heidari, Donna Sherman, James E. Simpson
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73314
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 91-93, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52289
Proceedings Papers
Seiji Aoyagi, Masato Suzuki, Tomokazu Takahashi, Tsutomu Tajikawa, Ken-ichi Saitoh, Shoso Shingubara, Yasuhiko Arai, Hiroyuki Tajiri, Yasuhiro Yoshikawa
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 429-436, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52290
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