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Proceedings Papers

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

Ashreet Mishra, A. G. Agwu Nnanna
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A017, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8387
https://doi.org/10.1115/IPACK2018-8387
View Paper titled, A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light
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Topics: Activated carbon, Steam, Sunlight, Carbon nanotubes, Nanoparticles, Water, Solar energy, Evaporation, Light, Medical devices
Proceedings Papers

Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance

Thomas L. Bougher, John H. Taphouse, Baratunde A. Cola
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48587
https://doi.org/10.1115/IPACK2015-48587
View Paper titled, Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance
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Topics: Carbon nanotubes, Thermoreflectance, Contact resistance, Heat transfer, Heating, Mechanical properties, Metrology, Probes, Thermal conductivity, Uncertainty
Proceedings Papers

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73130
https://doi.org/10.1115/IPACK2013-73130
View Paper titled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density
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Topics: Carbon nanotubes, Current density, Damage, Oxidation, Oxygen, Atoms, Carbon, Density, Electrodes, Electrodiffusion
Proceedings Papers

Highly Sensitive 2D Strain Sensor Using Carbon Nanotube

Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73156
https://doi.org/10.1115/IPACK2013-73156
View Paper titled, Highly Sensitive 2D Strain Sensor Using Carbon Nanotube
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Topics: Carbon nanotubes, Strain sensors, Multi-walled carbon nanotubes, Electrical conductivity, Shapes, Chemical vapor deposition, Electrical resistance, Single-walled carbon nanotubes, Catalysts, Design
Proceedings Papers

High Field Breakdown of Carbon Nanotube Network Transistors

Man Prakash Gupta, Ashkan Behnam, David Estrada, Eric Pop, Satish Kumar
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73115
https://doi.org/10.1115/IPACK2013-73115
View Paper titled, High Field Breakdown of Carbon Nanotube Network Transistors
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Topics: Carbon nanotubes, Transistors, Density, Heating, Reliability, Thin film transistors
Proceedings Papers

Development of Micro/Nano Engineered Wick-Based Passive Heat Spreaders for Thermal Management of High Power Electronic Devices

David H. Altman, Joseph R. Wasniewski, Mark T. North, Sungwon S. Kim, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 213-220, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52122
https://doi.org/10.1115/IPACK2011-52122
View Paper titled, Development of Micro/Nano Engineered Wick-Based Passive Heat Spreaders for Thermal Management of High Power Electronic Devices
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Topics: Carbon nanotubes, Flat heat pipes, Thermal management, Thermal resistance, Vapors
Proceedings Papers

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 231-240, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52148
https://doi.org/10.1115/IPACK2011-52148
View Paper titled, Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique
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Topics: Carbon, Nanotubes, Steady state, Carbon nanotubes, Bonding, Design, Heat, Nanomaterials, Optimization, Pressure
Proceedings Papers

Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density

Kazuhiko Sasagawa, Jun Unuma, Takehiro Abo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 487-491, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52169
https://doi.org/10.1115/IPACK2011-52169
View Paper titled, Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density
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Topics: Carbon nanotubes, Current density, Damage, Oxygen, Multi-walled carbon nanotubes, Oxidation, Carbon, Density, Electrodiffusion, Electrons
Proceedings Papers

Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin

Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 381-386, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52062
https://doi.org/10.1115/IPACK2011-52062
View Paper titled, Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin
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Topics: Carbon, Nanotubes, Resins, Sensors, Multi-walled carbon nanotubes, Carbon nanotubes, Electrical conductivity, Electrical resistance, Rubber, Single-walled carbon nanotubes
Proceedings Papers

Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field

Masato Ohnishi, Yusuke Suzuki, Yusuke Ohashi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 457-462, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52057
https://doi.org/10.1115/IPACK2011-52057
View Paper titled, Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field
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Topics: Carbon nanotubes, Electrical conductivity, Graphene, Thermal conductivity, Buckling, Cylinders, Deformation, Shapes, Density functional theory, Electrical resistivity
Proceedings Papers

Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain

Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 703-708, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52064
https://doi.org/10.1115/IPACK2011-52064
View Paper titled, Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain
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Topics: Carbon, Electrical conductivity, Nanotubes, Resins, Carbon nanotubes, Microwaves, Reflectance, Impedance (Electricity), Stress, Electrical properties
Proceedings Papers

Superior Thermal Interfaces Made by Metallically Anchored Carbon Nanotube Arrays

Xuejiao Hu, Lawrence S. Pan, Gang Gu, Kenneth E. Goodson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 597-603, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89375
https://doi.org/10.1115/InterPACK2009-89375
View Paper titled, Superior Thermal Interfaces Made by Metallically Anchored Carbon Nanotube Arrays
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Topics: Carbon nanotubes, Thermal resistance, Compression, Mechanical properties, Metals, Microscopy, Solders, Thermal conductivity
Proceedings Papers

Molecular Dynamics Simulation of the Thermal Resistance of Carbon Nanotube – Substrate Interfaces

Daniel J. Rogers, Jianmin Qu, Matthew Yao
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 55-61, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89096
https://doi.org/10.1115/InterPACK2009-89096
View Paper titled, Molecular Dynamics Simulation of the Thermal Resistance of Carbon Nanotube – Substrate Interfaces
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Topics: Carbon nanotubes, Interfacial thermal resistance, Molecular dynamics simulation, Phonons, Thermal resistance
Proceedings Papers

Evaluation of the Electrical Behavior of Polydisperse and Monodisperse Carbon Nanotube Networks

Roderick Jackson, Samuel Graham
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 521-527, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89069
https://doi.org/10.1115/InterPACK2009-89069
View Paper titled, Evaluation of the Electrical Behavior of Polydisperse and Monodisperse Carbon Nanotube Networks
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Topics: Absorption spectra, Carbon nanotubes, Electrical conductivity, Single-walled carbon nanotubes, Single-walled nanotubes
Proceedings Papers

Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad

Feng Gao, Jianmin Qu, Matthew Yao
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 543-547, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89099
https://doi.org/10.1115/InterPACK2009-89099
View Paper titled, Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad
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Topics: Carbon nanotubes, Contact resistance, Copper, Electron configuration, Density, Electrodes, Electrons, Density functional theory, Electrical properties, Electronics
Proceedings Papers

Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces for High-Temperature Electronics

Stephen L. Hodson, Thiruvelu Bhuvana, Baratunde A. Cola, Xianfan Xu, G. U. Kulkarni, Timothy S. Fisher
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 631-635, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89352
https://doi.org/10.1115/InterPACK2009-89352
View Paper titled, Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces for High-Temperature Electronics
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Topics: Bonding, Carbon nanotubes, Electronics, High temperature, Palladium, Electrical conductance, Temperature, Interface structure, Mechanical stability, Thermal resistance
Proceedings Papers

Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin

Katsuya Osaki, Hideki Fuji, Masato Onishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 569-574, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89146
https://doi.org/10.1115/InterPACK2009-89146
View Paper titled, Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin
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Topics: Carbon, Nanotubes, Resins, Strain measurement, Carbon nanotubes, Electrical resistance, Waves, Electrical conductivity, Thermal conductivity, Thin films
Proceedings Papers

Carbon Nanotube Array Thermal Interfaces on Chemical Vapor Deposited Diamond

Baratunde A. Cola, Xianfan Xu, Timothy S. Fisher
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 967-969, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33824
https://doi.org/10.1115/IPACK2007-33824
View Paper titled, Carbon Nanotube Array Thermal Interfaces on Chemical Vapor Deposited Diamond
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Topics: Carbon nanotubes, Diamonds, Vapors, Diamond films, Nucleation (Physics), Plasmas (Ionized gases)
Proceedings Papers

Numerical Model for Thermal Transport in 3-D Nanotube Composites

Satish Kumar, Jayathi Y. Murthy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 773-781, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33296
https://doi.org/10.1115/IPACK2007-33296
View Paper titled, Numerical Model for Thermal Transport in 3-D Nanotube Composites
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Topics: Composite materials, Computer simulation, Nanotubes, Nanocomposites, Thermal conductivity, Carbon nanotubes, Approximation, Density, Disperse systems, Heat conduction
Proceedings Papers

Subcooled Pool Boiling Studies on Nano-Textured Surfaces

Vijaykumar Sathyamurthi, Debjyoti Banerjee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 985-991, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33069
https://doi.org/10.1115/IPACK2007-33069
View Paper titled, Subcooled Pool Boiling Studies on Nano-Textured Surfaces
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Topics: Pool boiling, Subcooling, Multi-walled carbon nanotubes, Heat transfer, Nucleate boiling, Carbon nanotubes, Fluids, Heat flux, Nucleation (Physics), Phase transition temperature