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Proceedings Papers

Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
https://doi.org/10.1115/IPACK2023-112012
View Paper titled, Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
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Topics: Bonding, Circuits, Electrical properties, Electronics, Inks, Silver, Water, Adhesives, Low temperature, Solders
Proceedings Papers

Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors

Pradeep Lall, Shriram Kulkarni, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111980
https://doi.org/10.1115/IPACK2023-111980
View Paper titled, Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors
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Topics: Capacitors, Inductors, Resistors, Printing, Circuits, Drops, Electronics, Inks, Particulate matter, Resolution (Optics)
Proceedings Papers

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2648
https://doi.org/10.1115/IPACK2020-2648
View Paper titled, Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies
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Topics: Electronics, Reliability, Shock (Mechanics), Vehicles, Manufacturing, Solder joints, Aerospace industry, Ball-Grid-Array packaging, Capacitors, Ceramics
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2581
https://doi.org/10.1115/IPACK2020-2581
View Paper titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

System Electrothermal Transient Analysis of a High Current (40A) Synchronous Step Down Converter

Rajen Murugan, Jie Chen, Todd Harrison, C. T. Kao, Nathan Ai
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6384
https://doi.org/10.1115/IPACK2019-6384
View Paper titled, System Electrothermal Transient Analysis of a High Current (40A) Synchronous Step Down Converter
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Topics: Capacitors, Design, Inductors, Modeling, Multi-chip modules, Packaging, Power density, Silicon, Simulation, Transient analysis
Proceedings Papers

Degradation Modeling and Reliability Assessment of Capacitors

Anunay Gupta, Om Prakash Yadav, Arighna Roy, Douglas DeVoto, Joshua Major
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A018, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6456
https://doi.org/10.1115/IPACK2019-6456
View Paper titled, Degradation Modeling and Reliability Assessment of Capacitors
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Topics: Capacitors, Modeling, Reliability, Stochastic processes
Proceedings Papers

A Review of Degradation Behavior and Modeling of Capacitors

Anunay Gupta, Om Prakash Yadav, Douglas DeVoto, Joshua Major
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8262
https://doi.org/10.1115/IPACK2018-8262
View Paper titled, A Review of Degradation Behavior and Modeling of Capacitors
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Topics: Capacitors, Modeling, Failure, Electronic systems, Metallized plastic film, Physics, Reliability
Proceedings Papers

Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor

Takahiro Kinoshita, Takashi Kawakami, Tadaharu Adachi, Masahiro Funaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74099
https://doi.org/10.1115/IPACK2017-74099
View Paper titled, Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor
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Topics: Capacitors, Ceramics, Design, Stress, Finite element methods, Computer simulation, Pressure
Proceedings Papers

Mechanical Behavior of Thermal Interface Materials in Electronic Components Under Dynamic Loading Conditions

Emad A. Poshtan, Sudarshan Hegde, Andreas Roessle
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74021
https://doi.org/10.1115/IPACK2017-74021
View Paper titled, Mechanical Behavior of Thermal Interface Materials in Electronic Components Under Dynamic Loading Conditions
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Topics: Dynamic testing (Materials), Electronic components, Mechanical behavior, Capacitors, Flat heat pipes, Heat, Materials properties, Reliability, Thermomechanics
Proceedings Papers

System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles

Kraig J. Olejniczak, Tom Flint, David Simco, Sergei Storkov, Brad McGee, Kenny George, Peter Killeen, Austin Curbow, Robert S. Shaw, Brandon Passmore, Ty R. McNutt
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48602
https://doi.org/10.1115/IPACK2015-48602
View Paper titled, System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles
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Topics: Energy gap, Packaging, Traction, Vehicles, Silicon, Reliability, Capacitors, Cooling, High temperature, Junctions
Proceedings Papers

Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging

Pradeep Lall, Peter Sakalaukus, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73250
https://doi.org/10.1115/IPACK2013-73250
View Paper titled, Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging
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Topics: Algorithms, Aluminum, Capacitance, Capacitors, Climate, Damage, Electrical components, Failure, High temperature, Service life (Equipment)
Proceedings Papers

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

Shawn J. Cunningham, Yvonne Heng, Nabeel Idrisi, Brad Nelson, John McKillop
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73222
https://doi.org/10.1115/IPACK2013-73222
View Paper titled, Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors
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Topics: Capacitors, Flip-chip, Flip-chip devices, Microelectromechanical systems, Packaging, Semiconductor wafers, Solders, Stress, Deflection, Failure
Proceedings Papers

A Study on Impact Stresses in Ceramic Capacitors

Takashi Kawakami, Noriyo Horikawa, Takahiro Kinoshita, Tomohiro Inagaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73191
https://doi.org/10.1115/IPACK2013-73191
View Paper titled, A Study on Impact Stresses in Ceramic Capacitors
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Topics: Capacitors, Ceramics, Stress, Design engineering, Fracture (Materials), Impact testing, Machinery, Manufacturing, Printed circuit boards
Proceedings Papers

Microprocessor Package Embedded Thin Film Capacitor for Power Delivery Improvement

Michael J. Hill, Kemal Aygun, Kaladhar Radhakrishnan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 627-631, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52254
https://doi.org/10.1115/IPACK2011-52254
View Paper titled, Microprocessor Package Embedded Thin Film Capacitor for Power Delivery Improvement
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Topics: Capacitors, Thin films, Engineering prototypes
Proceedings Papers

Use Condition Characterization of Package Components

Leigh Wojewoda, Dhanya Athreya, Michael J. Hill
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 633-639, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52268
https://doi.org/10.1115/IPACK2011-52268
View Paper titled, Use Condition Characterization of Package Components
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Topics: Capacitors, Design, Electronic packages, Inductors, Metallic composites, Printed circuit boards
Proceedings Papers

A First-Principle Guided Circuit Simulator of Linear Complexity and its Linear Speedup for Die-Package Co-Design

Qing He, Duo Chen, Dan Jiao
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 647-652, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52276
https://doi.org/10.1115/IPACK2011-52276
View Paper titled, A First-Principle Guided Circuit Simulator of Linear Complexity and its Linear Speedup for Die-Package Co-Design
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Topics: Circuits, Design, Simulation, Capacitors, Complementary metal oxide semiconductors, Computation, Electromagnetic force, Electromagnetism, Inductors, Resistors
Proceedings Papers

Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 95-103, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52294
https://doi.org/10.1115/IPACK2011-52294
View Paper titled, Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique
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Topics: Ball-Grid-Array packages, Lasers, Lead-free solders, Ultrasound, Wetting, Solders, Inspection, Transients (Dynamics), Ball-Grid-Array packaging, Displacement
Proceedings Papers

Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment

Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 239-245, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89052
https://doi.org/10.1115/InterPACK2009-89052
View Paper titled, Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment
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Topics: Capacitors, Electronic equipment, Modeling, Computational fluid dynamics, Flow simulation, Temperature, Design, Flow (Dynamics), Switches, Thermal analysis
Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33335
https://doi.org/10.1115/IPACK2007-33335
View Paper titled, A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication
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Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation
Proceedings Papers

A Novel Discrete Passives Integration on Organic Substrate

Vasudivan Sunappan, Chee Wai Lu, Lai Lai Wai, Wei Fan, Boon Keng Lok
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1963-1967, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73102
https://doi.org/10.1115/IPACK2005-73102
View Paper titled, A Novel Discrete Passives Integration on Organic Substrate
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Topics: Capacitors, Inductors, Integrated circuits, Lamination, Manufacturing, Printed circuit boards, Reliability, Resistors, Resonance, Solder joints