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Proceedings Papers

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74073
https://doi.org/10.1115/IPACK2017-74073
View Paper titled, Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging
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Topics: Delamination, Electronic packaging, Fracture (Materials), Simulation, Electronic packages, Copper, Finite element analysis, Fracture mechanics, Risk, Stress
Proceedings Papers

Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnection Embedded in a Si Substrate

Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73148
https://doi.org/10.1115/IPACK2013-73148
View Paper titled, Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnection Embedded in a Si Substrate
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Topics: Copper, Thin films, Electroplating, Electrical properties, Electrical resistivity, Annealing, Bulk solids, Density, Grain boundaries, High temperature
Proceedings Papers

Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 353-359, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89079
https://doi.org/10.1115/InterPACK2009-89079
View Paper titled, Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection
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Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Fracture (Materials), Fatigue strength, Grain boundaries, Brittle fracture, Ductile fracture, Fatigue testing
Proceedings Papers

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

Khalid Alzoubi, Susan Lu, Bahgat Sammakia, Mark Poliks
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 27-32, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89247
https://doi.org/10.1115/InterPACK2009-89247
View Paper titled, Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications
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Topics: Flexible electronics, High cycle fatigue, Metals, Thin films, Unsaturated polyesters, Fracture (Materials), Bulk solids, Electrical resistance, Electronic systems, Failure
Proceedings Papers

New Technique for Testing Performance of Thermoelectric Quantum Well Materials

Velimir Jovanovic, Saeid Ghamaty, Norbert B. Elsner, Daniel Krommenhoek, John Morris
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 317-320.8, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89328
https://doi.org/10.1115/InterPACK2009-89328
View Paper titled, New Technique for Testing Performance of Thermoelectric Quantum Well Materials
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Topics: Quantum wells, Testing performance, Electrical resistivity, Thin films, Stress, Temperature, Alloys, Bulk solids, Copper, Electrical properties
Proceedings Papers

Quantum Simulation of Nanocrystalline Composite Thermoelectric Properties

T. D. Musho, D. G. Walker
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 171-175, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89332
https://doi.org/10.1115/InterPACK2009-89332
View Paper titled, Quantum Simulation of Nanocrystalline Composite Thermoelectric Properties
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Topics: Composite materials, Simulation, Alloys, Bulk solids, Density, Design, Electromagnetic scattering, Nanoscale phenomena, Phonons, Radiation scattering
Proceedings Papers

Thermal Conductivity and Contact Resistance Measurements for Adhesives

Peter Teertstra
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 381-388, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33026
https://doi.org/10.1115/IPACK2007-33026
View Paper titled, Thermal Conductivity and Contact Resistance Measurements for Adhesives
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Topics: Adhesives, Contact resistance, Thermal conductivity, Thermal properties, ASTM International, Bulk solids, Ceramics, Electronics, Fillers (Materials), Heat flux
Proceedings Papers

Micro Texture-Induced Variation of Mechanical Properties of Electroplated Copper Thin Films

Muneyuki Otani, Kazuhiko Sakutani, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 735-741, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33261
https://doi.org/10.1115/IPACK2007-33261
View Paper titled, Micro Texture-Induced Variation of Mechanical Properties of Electroplated Copper Thin Films
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Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Young's modulus, Bulk solids, Grain boundaries, Cold rolling, Deformation, Elasticity
Proceedings Papers

Thermoelectric Micro-Cooler of Bismuth Telluride Thin Films

Koji Miyazaki, Jun-Ichiro Kurosaki, Masayuki Takashiri, Bertrand Lenoir, Hiroshi Tsukamoto
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 335-342, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33756
https://doi.org/10.1115/IPACK2007-33756
View Paper titled, Thermoelectric Micro-Cooler of Bismuth Telluride Thin Films
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Topics: Microcoolers, Thin films, Shades and shadows, Temperature, Thermal conductivity, Annealing, Atmospheric pressure, Bulk solids, Chemical etching, Dry etching
Proceedings Papers

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73239
https://doi.org/10.1115/IPACK2005-73239
View Paper titled, Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy
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Topics: Alloys, Creep, Heat, Manufacturing, Modeling, Surface mount devices, Bulk solids, Solders, Solder joints, Thermomechanics
Proceedings Papers

Design of Micro-Arrayed Thin Film Thermocouples (TFTC)

Jong-Jin Park, Minoru Taya
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 213-217, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35040
https://doi.org/10.1115/IPACK2003-35040
View Paper titled, Design of Micro-Arrayed Thin Film Thermocouples (TFTC)
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Topics: Design, Thermocouples, Thin films, Copper, Aluminum, Bulk solids, Semiconductor wafers, Simulation, Heat conduction, Junctions