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Proceedings Papers

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Marco J. Echeverría, Pedro O. Quintero, Dimeji Ibitayo, Lauren Boteler
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8279
https://doi.org/10.1115/IPACK2018-8279
View Paper titled, Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging
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Topics: Ceramics, Electronic packaging, Sprays, Copper, Manufacturing, Reliability, Aluminum, Bonding, Brittleness, Computer simulation
Proceedings Papers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74138
https://doi.org/10.1115/IPACK2017-74138
View Paper titled, Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation
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Topics: Cracking (Materials), Fracture (Process), High temperature, Simulation, Thermomechanics, Transients (Dynamics), Tension-leg platforms, Stress, Fracture (Materials), Tin
Proceedings Papers

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74169
https://doi.org/10.1115/IPACK2017-74169
View Paper titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
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Topics: Electronics, High temperature, Alloys, Fracture (Materials), Deformation, Shear strength, Solders, Tension, Thermal conductivity, Brittleness
Proceedings Papers

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A020, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74129
https://doi.org/10.1115/IPACK2017-74129
View Paper titled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model
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Topics: Mechanical properties, Network models, Particulate matter, Thermal conductivity, Brittleness, Computer simulation, Elastic moduli, Heat, Heat sinks, Particle size
Proceedings Papers

Thermal Performance Enhancement of Glass Interposer

Sangbeom Cho, Yogendra K. Joshi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A021, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48563
https://doi.org/10.1115/IPACK2015-48563
View Paper titled, Thermal Performance Enhancement of Glass Interposer
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Topics: Glass, Electronics, Packaging, Brittleness, Computer simulation, Cooling, Copper, Design, Electrical resistivity, Modeling
Proceedings Papers

Fracture Mechanisms in Sn-Ag-Cu Solder Micro-Bumps for 3D Microelectronic Packages

Babak Talebanpour, Indranath Dutta
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48125
https://doi.org/10.1115/IPACK2015-48125
View Paper titled, Fracture Mechanisms in Sn-Ag-Cu Solder Micro-Bumps for 3D Microelectronic Packages
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Topics: Fracture (Materials), Solders, Tin, Fracture toughness, Failure, Brittleness, Ductile fracture, Electronic packages, Fractography, Fracture mechanics
Proceedings Papers

Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries

Takahiro Nakanishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48200
https://doi.org/10.1115/IPACK2015-48200
View Paper titled, Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries
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Topics: Grain boundaries, Reliability, Copper, Thin films, Electrical resistivity, Electron backscatter diffraction, Brittleness, Diffusion (Physics), Dislocations, Focused ion beams
Proceedings Papers

Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73151
https://doi.org/10.1115/IPACK2013-73151
View Paper titled, Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP
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Topics: Silicon chips, Simulation, Thermal stresses, Stress, Bending strength, Copper, Finite element methods, Yield stress, Brittleness, Elevations (Drawings)
Proceedings Papers

Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging

Z. Huang, I. Dutta, G. S. Subbarayan
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73079
https://doi.org/10.1115/IPACK2013-73079
View Paper titled, Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging
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Topics: Fracture (Materials), Fracture (Process), Solders, Tin, Brittleness, Fracture mechanics, Fracture toughness, Solder joints, Adhesives, Ball-Grid-Array packaging
Proceedings Papers

Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application

Ryou Kikuchi, Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara, Fusao Iwase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 667-672, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52025
https://doi.org/10.1115/IPACK2011-52025
View Paper titled, Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application
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Topics: Aerospace industry, Solders, Tensile strength, Tin, Elongation, Brittleness, Electrodes, Mechanical properties
Proceedings Papers

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 677-684, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52048
https://doi.org/10.1115/IPACK2011-52048
View Paper titled, Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections
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Topics: Copper, Electrical properties, Grain boundaries, Thin films, Fracture (Materials), Annealing, Reliability, Brittle fracture, Electron backscatter diffraction, Stress
Proceedings Papers

An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History

John Brueckner, Rainer Dudek, Sven Rzepka, Bernd Michel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 139-145, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89270
https://doi.org/10.1115/InterPACK2009-89270
View Paper titled, An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History
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Topics: Anisotropy, Brittleness, Ceramics, Damage, Experimental characterization, Failure, Finite element analysis, Fracture (Process), Grinding, Grinding wheels
Proceedings Papers

A Multiscale Damage Accumulation Theory for Solder Joint Failure

Dhruv Bhate, Kaushik Mysore, Ganesh Subbarayan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 191-197, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89399
https://doi.org/10.1115/InterPACK2009-89399
View Paper titled, A Multiscale Damage Accumulation Theory for Solder Joint Failure
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Topics: Damage, Failure, Solder joints, Fracture (Materials), Alloys, Energy dissipation, Thermodynamics, Brittleness, Microscopes, Plasticity
Proceedings Papers

Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 353-359, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89079
https://doi.org/10.1115/InterPACK2009-89079
View Paper titled, Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection
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Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Fracture (Materials), Fatigue strength, Grain boundaries, Brittle fracture, Ductile fracture, Fatigue testing
Proceedings Papers

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 729-736, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89098
https://doi.org/10.1115/InterPACK2009-89098
View Paper titled, Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints
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Topics: Brittleness, Failure, Lead-free solders, Solders, Solder joints, Brittle fracture, Failure mechanisms, Design, Dynamic testing (Materials), Finite element analysis
Proceedings Papers

Effects of Tooling Tip Wear and Fixture Rigidity on Solder Ball Shear and Ball Pull Tests

Fubin Song, S. W. Ricky Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 889-894, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33933
https://doi.org/10.1115/IPACK2007-33933
View Paper titled, Effects of Tooling Tip Wear and Fixture Rigidity on Solder Ball Shear and Ball Pull Tests
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Topics: Shear (Mechanics), Solders, Stiffness, Tooling, Wear, Failure mechanisms, Fracture (Materials), Gluing, Brittleness, Electromagnetic scattering
Proceedings Papers

Effects of Thermal Lids Gold Plating Thickness on Thermal Interface Reliability for Flip Chip Packaging

Chin Hock Toh, Arun Raman, Thomas Fitzgerald, Madhuri Narkhede, Alfred A. La Mar, Dennis Prem Kumar Chandran
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 979-984, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33505
https://doi.org/10.1115/IPACK2007-33505
View Paper titled, Effects of Thermal Lids Gold Plating Thickness on Thermal Interface Reliability for Flip Chip Packaging
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Topics: Flip-chip, Flip-chip devices, Gold plating, Packaging, Reliability, Plating, Solders, Soldering, Corners (Structural elements), Cycles
Proceedings Papers

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

J. Varghese, A. Dasgupta
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 845-848, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73014
https://doi.org/10.1115/IPACK2005-73014
View Paper titled, Failure Site Transition During Drop Testing of Printed Wiring Assemblies
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Topics: Electrical wires, Failure, Testing, Durability, Intermetallic compounds, Solders, Damage, Surface mount packaging, Brittleness, Deformation
Proceedings Papers

Mechanical Modeling of a Solder Thermal Interface Material: Implications for Thermo-Mechanical Reliability

Sankara J. Subramanian
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 959-963, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73304
https://doi.org/10.1115/IPACK2005-73304
View Paper titled, Mechanical Modeling of a Solder Thermal Interface Material: Implications for Thermo-Mechanical Reliability
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Topics: Finite element model, Modeling, Reliability, Solders, Thermomechanics, Cracking (Materials), Fracture (Process), Testing, Brittleness, Corners (Structural elements)
Proceedings Papers

The Effect of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modeling

Mohammad Masum Hossain, Dereje Agonafer, Puligandla Viswanadham, Tommi Reinikainen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 853-862, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35281
https://doi.org/10.1115/IPACK2003-35281
View Paper titled, The Effect of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modeling
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Topics: Fatigue life, Finite element analysis, Intermetallic compounds, Modeling, Solder joints, Solders, Temperature, Electronic packages, Failure, Finite element model