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Proceedings Papers

Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages

Ibaad Gandikota, Aniket Bharamgonda, Abhijit Dasgupta, Patrick McCluskey
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A016, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141249
https://doi.org/10.1115/IPACK2024-141249
View Paper titled, Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages
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Topics: Event history analysis, Fatigue, Gallium nitride, Solders, Failure, Creep, Delamination, Failure mechanisms, Fatigue life, Finite element analysis
Proceedings Papers

Design and Fabrication of an Inverter Module Co-Designed With the Busbar and Gate Driver

Aishworya Roy, Christina DiMarino, Jesi Miranda-Santos
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111921
https://doi.org/10.1115/IPACK2023-111921
View Paper titled, Design and Fabrication of an Inverter Module Co-Designed With the Busbar and Gate Driver
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Topics: Design, Gates (Closures), Manufacturing, Cooling, Bridges (Structures), Electric vehicles, Energy dissipation, Heat, Junctions, MOSFET transistors
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

Hayden Carlton, Md Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Alan Mantooth, Asif Imran, Fang Luo, John Harris, Alexis Krone, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72726
https://doi.org/10.1115/IPACK2021-72726
View Paper titled, Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module
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Topics: Bridges (Structures), Cooling, Gallium nitride, Gates (Closures), Optimization
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2547
https://doi.org/10.1115/IPACK2020-2547
View Paper titled, High Performance Computing Package With Chip Module on Substrate Solutions
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

Michael James Martin, Harish Manohara
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73053
https://doi.org/10.1115/IPACK2013-73053
View Paper titled, Thermo-Electric Modeling of Nanotube-Based Environmental Sensors
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Topics: Modeling, Nanotubes, Sensors, Temperature, Pressure, Bridges (Structures), Heat transfer coefficients, Circuits, Convection, Electrical resistivity
Proceedings Papers

Unsteady Thermo-Structural Simulation of Nano-Bridge Resonators

Elham Maghsoudi, Michael James Martin
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73061
https://doi.org/10.1115/IPACK2013-73061
View Paper titled, Unsteady Thermo-Structural Simulation of Nano-Bridge Resonators
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Topics: Bridges (Structures), Simulation
Proceedings Papers

Four-Wire Bridge Measurements of van der Pauw Stress Sensors on (100) and (111) Silicon

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73249
https://doi.org/10.1115/IPACK2013-73249
View Paper titled, Four-Wire Bridge Measurements of van der Pauw Stress Sensors on (100) and (111) Silicon
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Topics: Bridges (Structures), Sensors, Silicon, Stress, Wire
Proceedings Papers

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73092
https://doi.org/10.1115/IPACK2013-73092
View Paper titled, Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
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Topics: Nanoparticles, Self-assembly, Columns (Structural), Evaporation, Particulate matter, Annealing, Bridges (Structures), Composite materials, Copper, Electronic packages
Proceedings Papers

A Data-Centric Approach for Integrated Data Center Management

Christopher Hoover
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 565-576, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52159
https://doi.org/10.1115/IPACK2011-52159
View Paper titled, A Data-Centric Approach for Integrated Data Center Management
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Topics: Data centers, Bridges (Structures), Control systems, Modeling, Visualization
Proceedings Papers

Simulation of Thermal Positioning in Micro- and Nano-Scale Bridge Structures

Elham Maghsoudi, Michael James Martin
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 247-255, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52144
https://doi.org/10.1115/IPACK2011-52144
View Paper titled, Simulation of Thermal Positioning in Micro- and Nano-Scale Bridge Structures
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Topics: Bridges (Structures), Convection, Heat conduction, Nanoscale phenomena, Simulation, Displacement, Pressure, Silicon, Cooling, Diamonds
Proceedings Papers

The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading

Kayleen L. E. Helms, Ketan R. Shah, Dan Gerbus, Vasu S. Vasudevan, Jagadeesh Radhakrishnan, Will Berry
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 945-951, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89347
https://doi.org/10.1115/InterPACK2009-89347
View Paper titled, The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading
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Topics: Ball-Grid-Array packaging, Damage, Electronic packages, Flip-chip, Shock (Mechanics), Design, Risk, Solder joints, Accelerated life testing, Alloys