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Proceedings Papers
Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141871
Proceedings Papers
Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
Proceedings Papers
Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods
Available to PurchaseYangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97349
Proceedings Papers
Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process
Available to PurchaseDaeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97218
Proceedings Papers
Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
Proceedings Papers
Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73314
Proceedings Papers
Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73015
Proceedings Papers
Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69270
Proceedings Papers
Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69495
Proceedings Papers
Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2533
Proceedings Papers
Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2598
Proceedings Papers
Enabling Packaging Architectures and Interconnect Technologies for Image Sensors
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2526
Proceedings Papers
Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal
Available to Purchase
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6539
Proceedings Papers
Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8345
Proceedings Papers
Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8254
Proceedings Papers
Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8279
Proceedings Papers
Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A024, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74158
Proceedings Papers
3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74213
Proceedings Papers
Advancements in Silver Wire Bonding
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74286
Proceedings Papers
Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74325
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