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Proceedings Papers

Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures

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Myriam Bouzidi, Junyoung Kim, Jonathan Goldman, Yogendra Joshi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140132
https://doi.org/10.1115/IPACK2024-140132
View Paper titled, Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures
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Topics: Batteries, Electric vehicles, Flexible structures, Thermal management, Temperature, Heat, Cooling, Energy dissipation, Battery life, Coolants
Proceedings Papers

State of Health Estimation Model Development for Li-Ion Battery Lifetime Considering Calendar Aging and Post-Knee Degradation

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Pradeep Lall, Ved Soni, Sabina Bimali
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A030, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142117
https://doi.org/10.1115/IPACK2024-142117
View Paper titled, State of Health Estimation Model Development for Li-Ion Battery Lifetime Considering Calendar Aging and Post-Knee Degradation
Open the PDF for State of Health Estimation Model Development for Li-Ion Battery Lifetime Considering Calendar Aging and Post-Knee Degradation in another window
Topics: Batteries, Battery life, Knee, Lithium-ion batteries, Model development
Proceedings Papers

Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates

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Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2661
https://doi.org/10.1115/IPACK2020-2661
View Paper titled, Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates
Open the PDF for Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates in another window
Topics: Lithium-ion batteries, Batteries, Industrial research, Reliability, Stress, Battery life, Bending (Stress), Biomedical equipment, Cycles, Electronics
Proceedings Papers

Thermal Evaluation Process on Smart Watches

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Angel Qian Han, Nanbo Kang
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A032, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48711
https://doi.org/10.1115/IPACK2015-48711
View Paper titled, Thermal Evaluation Process on Smart Watches
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Topics: Battery life, Computer software, Design, Safety, Security, Simulation
Proceedings Papers

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

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Shawn J. Cunningham, Yvonne Heng, Nabeel Idrisi, Brad Nelson, John McKillop
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73222
https://doi.org/10.1115/IPACK2013-73222
View Paper titled, Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors
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Topics: Capacitors, Flip-chip, Flip-chip devices, Microelectromechanical systems, Packaging, Semiconductor wafers, Solders, Stress, Deflection, Failure