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Proceedings Papers

Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure

Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A029, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142109
https://doi.org/10.1115/IPACK2024-142109
View Paper titled, Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure
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Topics: Delamination, Fracture toughness, High temperature, Reliability, Failure mechanisms, Semiconductors (Materials), Automobiles, Ball-Grid-Array packaging, Durability, Electronics
Proceedings Papers

Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects

Souvik Chakraborty, Debabrata Mondal, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141356
https://doi.org/10.1115/IPACK2024-141356
View Paper titled, Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects
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Topics: Dimensions, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Fatigue life, Finite element analysis, Solders, Boundary-value problems, Design, Energy consumption
Proceedings Papers

Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

Pradeep Lall, Aathi Raja Ram Pandurangan, Madhu Katsuri
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
https://doi.org/10.1115/IPACK2023-111937
View Paper titled, Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model
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Topics: Architecture, Automobiles, Ball-Grid-Array packaging, Delamination, Electronics, Engines, Failure, Failure mechanisms, Fatigue, Finite element model
Proceedings Papers

Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints

Souvik Chakraborty, Debabrata Mondal, Golam Rakib Mazumder, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112041
https://doi.org/10.1115/IPACK2023-112041
View Paper titled, Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Fatigue life, Finishes, Finite element analysis, Reliability, Solder joints
Proceedings Papers

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97349
https://doi.org/10.1115/IPACK2022-97349
View Paper titled, Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Reliability, Thermomechanics, Cycles, Solders, Corners (Structural elements), Bonding, Deformation, Stiffness
Proceedings Papers

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97433
https://doi.org/10.1115/IPACK2022-97433
View Paper titled, Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
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Topics: High temperature, Modeling, Reliability, Flip-chip, Solder joints, Ball-Grid-Array packaging, Electronics, Fatigue failure, Fatigue life, Materials degradation
Proceedings Papers

A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

Karthik Arun Deo, Raymond-Noel Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97253
https://doi.org/10.1115/IPACK2022-97253
View Paper titled, A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints
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Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Surface mount devices
Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73456
https://doi.org/10.1115/IPACK2021-73456
View Paper titled, Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q
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Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis
Proceedings Papers

Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application

Ming-Han Zhuang, Teny Shih, David Lai, Yu-Po Wang
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-66660
https://doi.org/10.1115/IPACK2021-66660
View Paper titled, Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application
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Topics: Ball-Grid-Array packaging, Cloud computing, Internet, Signals
Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74044
https://doi.org/10.1115/IPACK2021-74044
View Paper titled, Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2648
https://doi.org/10.1115/IPACK2020-2648
View Paper titled, Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies
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Topics: Electronics, Reliability, Shock (Mechanics), Vehicles, Manufacturing, Solder joints, Aerospace industry, Ball-Grid-Array packaging, Capacitors, Ceramics
Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2676
https://doi.org/10.1115/IPACK2020-2676
View Paper titled, Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging
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Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2547
https://doi.org/10.1115/IPACK2020-2547
View Paper titled, High Performance Computing Package With Chip Module on Substrate Solutions
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging

KM Rafidh Hassan, Mohammad S. Alam, Jing Wu, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2691
https://doi.org/10.1115/IPACK2020-2691
View Paper titled, Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging
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Topics: Ball-Grid-Array packaging, High temperature, Lead-free solders, Particulate matter
Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8410
https://doi.org/10.1115/IPACK2018-8410
View Paper titled, The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders
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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8338
https://doi.org/10.1115/IPACK2018-8338
View Paper titled, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
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Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Proceedings Papers

Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling

Chienchih Chen, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8398
https://doi.org/10.1115/IPACK2018-8398
View Paper titled, Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling
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Topics: Finite element analysis, Solder joints, Simulation, Electronic packaging, Stress, Algorithms, Alloys, Ball-Grid-Array packaging, Computers, Density
Proceedings Papers

Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach

M. Niessner, G. Haubner, W. Hartner, S. Pahlke
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8379
https://doi.org/10.1115/IPACK2018-8379
View Paper titled, Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach
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Topics: Design, Radar, Reliability, Solder joints, Simulation, Laminates, Accelerated life testing, Ball-Grid-Array packaging, Materials properties, Mechanical properties
Proceedings Papers

Large Flip Chip Assembly Challenges and Risk Mitigation Process

Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo, Eric Ouyang
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74026
https://doi.org/10.1115/IPACK2017-74026
View Paper titled, Large Flip Chip Assembly Challenges and Risk Mitigation Process
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Topics: Ball-Grid-Array packaging, Copper, Cracking (Materials), Delamination, Failure, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flip-chip packages, Fracture (Process)
Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74133
https://doi.org/10.1115/IPACK2017-74133
View Paper titled, Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?
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Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling