1-20 of 30
Ball-Grid-Array packages
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints

Souvik Chakraborty, Debabrata Mondal, Golam Rakib Mazumder, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112041
https://doi.org/10.1115/IPACK2023-112041
View Paper titled, Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints
Open the PDF for Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints in another window
Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Fatigue life, Finishes, Finite element analysis, Reliability, Solder joints
Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97438
https://doi.org/10.1115/IPACK2022-97438
View Paper titled, High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C
Open the PDF for High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C in another window
Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry
Proceedings Papers

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97349
https://doi.org/10.1115/IPACK2022-97349
View Paper titled, Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods
Open the PDF for Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods in another window
Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Reliability, Thermomechanics, Cycles, Solders, Corners (Structural elements), Bonding, Deformation, Stiffness
Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6561
https://doi.org/10.1115/IPACK2019-6561
View Paper titled, Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties
Open the PDF for Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties in another window
Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8338
https://doi.org/10.1115/IPACK2018-8338
View Paper titled, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
Open the PDF for Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions in another window
Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Proceedings Papers

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Deng Yun Chen, Michael Osterman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74249
https://doi.org/10.1115/IPACK2017-74249
View Paper titled, Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling
Open the PDF for Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling in another window
Topics: Ball-Grid-Array packaging, Corners (Structural elements), Fatigue life, Solder joints, Solders, Adhesives, Failure, Materials properties, Stress, Temperature
Proceedings Papers

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74017
https://doi.org/10.1115/IPACK2017-74017
View Paper titled, An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow
Open the PDF for An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow in another window
Topics: Delamination, Reflow soldering, Fracture (Materials), Stress, Vapor pressure, Ball-Grid-Array packages, Displacement, Finite element analysis, Fracture mechanics, Lead-free solders
Proceedings Papers

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

Takahiro Omori, Kenji Hirohata, Tomoko Monda, Minoru Mukai
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73161
https://doi.org/10.1115/IPACK2013-73161
View Paper titled, Large-Scale Damage Path Simulation for Solder Joints in a BGA Package
Open the PDF for Large-Scale Damage Path Simulation for Solder Joints in a BGA Package in another window
Topics: Ball-Grid-Array packages, Damage, Simulation, Solder joints, Fatigue, Crack propagation, Electronic packages, Fatigue life, Modeling, Printed circuit boards
Proceedings Papers

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

Adam Pearl, Michael Osterman
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73278
https://doi.org/10.1115/IPACK2013-73278
View Paper titled, Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions
Open the PDF for Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions in another window
Topics: Printed circuit boards, Solders, Finishes, Failure mechanisms, Lumber, Reliability, Cracking (Materials), Fracture (Process), Resistors, Shock (Mechanics)
Proceedings Papers

Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics

Pradeep Lall, Dinesh Arunachalam, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 537-547, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52195
https://doi.org/10.1115/IPACK2011-52195
View Paper titled, Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics
Open the PDF for Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics in another window
Topics: Alloys, Architecture, Ball-Grid-Array packages, Copper, Cycles, Design, Electronics, Failure data, Lead-free solders, Model development
Proceedings Papers

SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys

Pradeep Lall, Mandar Kulkarni, Sandeep Shantaram, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 281-297, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52196
https://doi.org/10.1115/IPACK2011-52196
View Paper titled, SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys
Open the PDF for SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys in another window
Topics: Alloys, Springs, Copper, Solders, Fracture (Materials), Shock (Mechanics), Failure, Fracture toughness, Stress, Ball-Grid-Array packages
Proceedings Papers

Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 95-103, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52294
https://doi.org/10.1115/IPACK2011-52294
View Paper titled, Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique
Open the PDF for Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique in another window
Topics: Ball-Grid-Array packages, Lasers, Lead-free solders, Ultrasound, Wetting, Solders, Inspection, Transients (Dynamics), Ball-Grid-Array packaging, Displacement
Proceedings Papers

Larger Array Fine Pitch Wafer Level Package Drop Test Reliability

Tiao Zhou, Robert Derk, Kaysar Rahim, Xuejun Fan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 693-701, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89018
https://doi.org/10.1115/InterPACK2009-89018
View Paper titled, Larger Array Fine Pitch Wafer Level Package Drop Test Reliability
Open the PDF for Larger Array Fine Pitch Wafer Level Package Drop Test Reliability in another window
Topics: Reliability, Semiconductor wafers, Fracture (Materials), Corners (Structural elements), Failure, Alloys, Failure mechanisms, Finite element analysis, Solder joints, Solders
Proceedings Papers

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Takeyuki Itabashi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 797-802, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89232
https://doi.org/10.1115/InterPACK2009-89232
View Paper titled, Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package
Open the PDF for Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package in another window
Topics: Ball-Grid-Array packages, Fracture (Materials), Solder joints, Solders, Crack propagation, Shapes, Finite element analysis, Particulate matter, Stiffness, Deformation
Proceedings Papers

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 729-736, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89098
https://doi.org/10.1115/InterPACK2009-89098
View Paper titled, Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints
Open the PDF for Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints in another window
Topics: Brittleness, Failure, Lead-free solders, Solders, Solder joints, Brittle fracture, Failure mechanisms, Design, Dynamic testing (Materials), Finite element analysis
Proceedings Papers

PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics

Pradeep Lall, Aniket Shirgaokar, Dineshkumar Arunachalam, Jeff Suhling, Mark Strickland, Jim Blanche
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 159-170, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89329
https://doi.org/10.1115/InterPACK2009-89329
View Paper titled, PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics
Open the PDF for PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics in another window
Topics: Electronics, Fatigue, Thermomechanics, Temperature, Ball-Grid-Array packages, Cycles, Reliability, Alloys, Architecture, Copper
Proceedings Papers

A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages

X. Long, I. Dutta, R. Guduru, R. Prasanna, M. Pacheco
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 539-546, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33271
https://doi.org/10.1115/IPACK2007-33271
View Paper titled, A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages
Open the PDF for A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages in another window
Topics: Ball-Grid-Array packages, Reliability, Solders, Solder joints, Ball-Grid-Array packaging, Temperature, Tension, Damage, Design, Engineering simulation
Proceedings Papers

Nodal Topology in Compact Thermal Models

D. H. Greisen, V. P. Manno
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 637-643, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33425
https://doi.org/10.1115/IPACK2007-33425
View Paper titled, Nodal Topology in Compact Thermal Models
Open the PDF for Nodal Topology in Compact Thermal Models in another window
Topics: Ball-Grid-Array packages, Boundary-value problems, Design, Electronic packages, Errors, Heat flux, Heat transfer coefficients, Mechanical admittance, Topology
Proceedings Papers

Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board

Wataru Nakayama, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 645-652, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33605
https://doi.org/10.1115/IPACK2007-33605
View Paper titled, Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board
Open the PDF for Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board in another window
Topics: Heat conduction, Printed circuit boards, Modeling, Temperature, Ball-Grid-Array packages, Composite materials, Computation, Convection, Electronic equipment, Heat transfer
Proceedings Papers

Causes of Degradation of Thermal Performance of Ball Grid Arrays After Thermal Cycling

Roy W. Knight, Yasser Elkady, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 663-670, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33626
https://doi.org/10.1115/IPACK2007-33626
View Paper titled, Causes of Degradation of Thermal Performance of Ball Grid Arrays After Thermal Cycling
Open the PDF for Causes of Degradation of Thermal Performance of Ball Grid Arrays After Thermal Cycling in another window
Topics: Ball-Grid-Array packaging, Thermal resistance, Cracking (Materials), Cycles, Fracture (Process), Lumber, Solders, Delamination, Solder joints, Ball-Grid-Array packages