Topics: Low temperature, Mechanical properties, Storage, Temperature, Alloys, Solders, Avionics, Climate, Design, Electronic packages

Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines

Topics: Alloys, Avionics, Climate, Design, Electronic packages, Electronic packaging, High temperature, Lead-free solders, Low temperature, Low temperature materials

Topics: Alloys, Temperature, Lead-free solders, Solders, Finite element analysis, Avionics, Constitutive equations, Density, Electronic components, Electronics

Topics: Electronics, Reliability, Storage, Damage, Temperature, Avionics, Electronic systems, Failure, High temperature, Intermetallic compounds

Topics: Electronics, Packaging, Reliability, Stress, Thermomechanics, Failure, Damage, Algorithms, Architecture, Automotive safety

Topics: Errors, Vibration analysis, Weight (Mass), Design, Finite element analysis, Computers, Electronics, Modeling, Testing, Avionics

Topics: Avionics, Ball-Grid-Array packaging, Fatigue testing, Solder joints, Temperature

Topics: Avionics, Electronics, Integrated circuit packaging, Lasers, Military systems, Multimedia, Packaging, Printed circuit boards, Reliability, Resins

Topics: Fins, Metals, Thermal management, Warfare, Heat exchangers, Heat transfer, Cooling, Heat transfer coefficients, Aircraft, Electronics

Topics: Avionics, Design, Heat exchangers, Thermal management, Fins, Heat transfer, Electronics, Pressure drop, Aerospace industry, Cooling

Topics: Avionics, Space vehicles, Packaging, Density, Hardware, Design, Flexible systems, Manufacturing, Packaging density (Electronics)

Topics: Avionics, Electronic packaging, Space vehicles, Capacitors, Circuits, Reliability, Resistors, Silicon, Temperature, Thin films