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Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97437
https://doi.org/10.1115/IPACK2022-97437
View Paper titled, Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform
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Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models
Proceedings Papers

Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling

Joseph Herring, Peter Smith, Jacob Lamotte-Dawaghreh, Pratik Bansode, Satyam Saini, Rabin Bhandari, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97481
https://doi.org/10.1115/IPACK2022-97481
View Paper titled, Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling
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Topics: Artificial neural networks, Computational fluid dynamics, Cooling, Heat sinks, Machine learning, Machinery, Optimization, Thermal management
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
https://doi.org/10.1115/IPACK2022-97457
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging

Pradeep Lall, Hyesoo Jang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97431
https://doi.org/10.1115/IPACK2022-97431
View Paper titled, ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging
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Topics: Artificial neural networks, Batteries, Lithium-ion batteries, Machine learning, Reliability, Simulation
Proceedings Papers

Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6334
https://doi.org/10.1115/IPACK2019-6334
View Paper titled, Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm
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Topics: Artificial neural networks, Genetic algorithms, Heat
Proceedings Papers

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger

Zhuo Yang, Tariq Amin Khan, Wei Li, Hua Zhu, Zhijian Sun, Zhengjiang Zhang, Jincai Du, Jianxin Zhou
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A022, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8448
https://doi.org/10.1115/IPACK2018-8448
View Paper titled, Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger
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Topics: Heat exchangers, Optimization, Artificial neural networks, Flow (Dynamics), Reynolds number, Friction, Pressure drop, Computational fluid dynamics, Computer simulation, Design
Proceedings Papers

Weather Analysis Using Neural Networks for Modular Data Centers

Feyisola Adejokun, Ashwin Siddarth, Abhishek Guhe, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8253
https://doi.org/10.1115/IPACK2018-8253
View Paper titled, Weather Analysis Using Neural Networks for Modular Data Centers
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Topics: Artificial neural networks, Data centers, Cooling, Evaporative cooling, Cooling systems, Neural network models, Temperature, Algorithms, Computation, Control systems
Proceedings Papers

Neural Network Modeling in Model-Based Control of a Data Center

Nachiket Kansara, Rohit Katti, Kourosh Nemati, Alan P. Bowling, Bahgat Sammakia
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A034, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48684
https://doi.org/10.1115/IPACK2015-48684
View Paper titled, Neural Network Modeling in Model-Based Control of a Data Center
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Topics: Artificial neural networks, Data centers, Modeling, Computational fluid dynamics, Temperature, Neural network models, Sensors, Storage, Transients (Dynamics)
Proceedings Papers

Prediction of Hot Aisle Partition Airflow Boundary Conditions

Zhihang Song, Bruce T. Murray, Bahgat Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73049
https://doi.org/10.1115/IPACK2013-73049
View Paper titled, Prediction of Hot Aisle Partition Airflow Boundary Conditions
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Topics: Air flow, Boundary-value problems, Artificial neural networks, Computational fluid dynamics, Data centers, Computation, Flow (Dynamics), Server racks, Computer software, Design
Proceedings Papers

Multivariate Prediction of Airflow and Temperature Distributions Using Artificial Neural Networks

Zhihang Song, Bruce T. Murray, Bahgat Sammakia
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 595-604, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52167
https://doi.org/10.1115/IPACK2011-52167
View Paper titled, Multivariate Prediction of Airflow and Temperature Distributions Using Artificial Neural Networks
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Topics: Air flow, Artificial neural networks, Temperature distribution, Computational fluid dynamics, Data centers, Design, Flow (Dynamics), Thermal management, Tiles, Computer software
Proceedings Papers

KL Transform and Neural-Net Based Framework for Failure Modes Classification in Electronics Subjected to Mechanical-Shock

Pradeep Lall, Prashant Gupta, Kai Goebel
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 563-578, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52198
https://doi.org/10.1115/IPACK2011-52198
View Paper titled, KL Transform and Neural-Net Based Framework for Failure Modes Classification in Electronics Subjected to Mechanical-Shock
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Topics: Artificial neural networks, Electronics, Failure mechanisms, Shock (Mechanics), Failure, Parity (Physics), Damage, Vibration, Algorithms, Copper
Proceedings Papers

Development of an Automated Solder Inspection System With Neural Network Using Oblique Computed Tomography

Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Tsuzaka, Hiroshi Fujita
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 453-457, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33017
https://doi.org/10.1115/IPACK2007-33017
View Paper titled, Development of an Automated Solder Inspection System With Neural Network Using Oblique Computed Tomography
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Topics: Artificial neural networks, Computerized tomography, Inspection, Solders, Ball-Grid-Array packaging, Density, Electronics, Shapes, Solder joints, X-rays
Proceedings Papers

Data Center Cooling Prediction Using Artificial Neural Network

Saurabh K. Shrivastava, James W. VanGilder, Bahgat G. Sammakia
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 765-771, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33432
https://doi.org/10.1115/IPACK2007-33432
View Paper titled, Data Center Cooling Prediction Using Artificial Neural Network
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Topics: Artificial neural networks, Cooling, Data centers, Computational fluid dynamics, Optimization, Air flow, Artificial intelligence, Errors, Genetic algorithms
Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards Using Artificial Neural Networks

Tohru Suwa, Hamid A. Hadim
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2079-2086, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73178
https://doi.org/10.1115/IPACK2005-73178
View Paper titled, Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards Using Artificial Neural Networks
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Topics: Artificial neural networks, Electronic components, Heat, Optimization, Printed circuit boards, Genetic algorithms, Algorithms, Cascades (Fluid dynamics), Density, Electrical wires
Proceedings Papers

Neural-Genetic Optimization of Temperature Control in a Continuous Flow Polymerase Chain Reaction Microdevice

Hing Wah Lee, Parthiban Arunasalam, Ishak A. Azid, Kankanhally N. Seetharamu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 733-740, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73280
https://doi.org/10.1115/IPACK2005-73280
View Paper titled, Neural-Genetic Optimization of Temperature Control in a Continuous Flow Polymerase Chain Reaction Microdevice
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Topics: Chain, Flow (Dynamics), Optimization, Temperature control, Artificial neural networks, Finite element analysis, Microfluidics, Simulation results, Temperature distribution, Annealing
Proceedings Papers

Artificial Neural Network Trained, Genetic Algorithms Optimized Thermal Energy Storage Heatsinks for Electronics Cooling

Jeevan Kanesan, Parthiban Arunasalam, Kankanhalli N. Seetharamu, Ishak A. Azid
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1389-1395, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73053
https://doi.org/10.1115/IPACK2005-73053
View Paper titled, Artificial Neural Network Trained, Genetic Algorithms Optimized Thermal Energy Storage Heatsinks for Electronics Cooling
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Topics: Artificial neural networks, Computer cooling, Genetic algorithms, Thermal energy storage, Fins, Operating temperature, Optimization, Phase transition temperature, Computer simulation, Aluminum
Proceedings Papers

Modeling the Laser Ablation Process Using Neural Networks

Ronald Setia, Gary S. May
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 161-167, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35188
https://doi.org/10.1115/IPACK2003-35188
View Paper titled, Modeling the Laser Ablation Process Using Neural Networks
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Topics: Artificial neural networks, Laser ablation, Microelectronic packaging, Modeling