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Proceedings Papers

Warpage Prediction Improvements for Thin Package-on-Package Architectures

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Nakul Kothari, Karthikeyan Dhandapani, Sangjae (Brandon) Lee, Manuel Aldrete, Nidheesh Puliyath
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A033, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-144090
https://doi.org/10.1115/IPACK2024-144090
View Paper titled, Warpage Prediction Improvements for Thin Package-on-Package Architectures
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Topics: Architecture, Finite element analysis, Package on package, Warping
Proceedings Papers

Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

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Pradeep Lall, Aathi Raja Ram Pandurangan, Madhu Katsuri
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
https://doi.org/10.1115/IPACK2023-111937
View Paper titled, Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model
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Topics: Architecture, Automobiles, Ball-Grid-Array packaging, Delamination, Electronics, Engines, Failure, Failure mechanisms, Fatigue, Finite element model
Proceedings Papers

Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage

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Michael Shanks, Uduak Inyang-Udoh, Neera Jain
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111816
https://doi.org/10.1115/IPACK2023-111816
View Paper titled, Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage
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Topics: Thermal energy storage, Thermal management, Transients (Dynamics), Control equipment, Heat, Simulation, Architecture, Computer cooling, Feedback, Fluids
Proceedings Papers

Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements

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Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Andy Clark, Xuemei Cheng, Lu An, Ezra Lee, Xiaosong Liu, Gang Feng
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-66842
https://doi.org/10.1115/IPACK2021-66842
View Paper titled, Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements
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Topics: Electrical conductance, Thermoreflectance, Transducers, Thermal resistance, Architecture, Computer simulation, Electronic packaging, Fittings, Flow (Dynamics), Geometry
Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

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Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2613
https://doi.org/10.1115/IPACK2020-2613
View Paper titled, Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials
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Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel
Proceedings Papers

Enabling Packaging Architectures and Interconnect Technologies for Image Sensors

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Mei-Chien Lu
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2526
https://doi.org/10.1115/IPACK2020-2526
View Paper titled, Enabling Packaging Architectures and Interconnect Technologies for Image Sensors
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Topics: Architecture, Bonding, Density, Packaging, Sensors
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

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Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2541
https://doi.org/10.1115/IPACK2020-2541
View Paper titled, Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging

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Laura Spinella, Nick Bosco
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6520
https://doi.org/10.1115/IPACK2019-6520
View Paper titled, Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging
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Topics: Electronic packaging, Fatigue, Packaging, Simulation, Solders, Thermomechanics, Reliability, Climate, Architecture, Electronics
Proceedings Papers

Comparative Study on Power Module Architectures for Modularity and Scalability

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Mei-Chien Lu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A016, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6443
https://doi.org/10.1115/IPACK2019-6443
View Paper titled, Comparative Study on Power Module Architectures for Modularity and Scalability
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Topics: Architecture, Electric vehicles, Silicon, Electronics, Hybrid electric vehicles, Carbon, Cooling, Design, Emissions, Energy gap
Proceedings Papers

Thermal Interface Materials Enhanced by Micro and Nanostructures

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Mei-Chien Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8307
https://doi.org/10.1115/IPACK2018-8307
View Paper titled, Thermal Interface Materials Enhanced by Micro and Nanostructures
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Topics: Architecture, Corners (Structural elements), Design, Electronic packages, Electronics, Energy gap, Failure, Finite element methods, High temperature, Nanostructures
Proceedings Papers

Multi-Physics Driven Co-Design of 3D Multicore Architectures

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He Xiao, Wen Yueh, Saibal Mukhopadhyay, Sudhakar Yalamanchili
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A038, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48533
https://doi.org/10.1115/IPACK2015-48533
View Paper titled, Multi-Physics Driven Co-Design of 3D Multicore Architectures
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Topics: Architecture, Design, Physics, Temperature, Delays, Energy efficiency, Circuits, Cycles, Energy consumption, Heat flux
Proceedings Papers

3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler

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Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73263
https://doi.org/10.1115/IPACK2013-73263
View Paper titled, 3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler
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Topics: Microchannels, Cooling, Manufacturing, Thermohydrodynamics, Architecture, Computers, Density, Design, Electronic components, Engineering simulation
Proceedings Papers

Hybrid Cooling Technology for Large-Scale Computing Systems: From Back to the Future

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Jie Wei
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 107-111, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52045
https://doi.org/10.1115/IPACK2011-52045
View Paper titled, Hybrid Cooling Technology for Large-Scale Computing Systems: From Back to the Future
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Topics: Cooling, Water, Convection, Architecture, Cooling systems, Design, Energy consumption, Flow (Dynamics), Low temperature, Maintainability
Proceedings Papers

An Investigation Into Cooling System Control Strategies for Data Center Airflow Containment Architectures

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Michael K. Patterson, Rainer Weidmann, Markus Leberecht, Manuel Mair, Richard M. Libby
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 479-488, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52090
https://doi.org/10.1115/IPACK2011-52090
View Paper titled, An Investigation Into Cooling System Control Strategies for Data Center Airflow Containment Architectures
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Topics: Air flow, Architecture, Containment, Cooling systems, Data centers, Temperature, Energy consumption, Cooling, Fans, Hardware
Proceedings Papers

The Effect of Under-Floor Obstructions on Data Center Perforated Tile Airflow

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James W. VanGilder, Zachary R. Sheffer, Xuanhang Simon Zhang, Collyn T. O’Kane
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 505-510, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52127
https://doi.org/10.1115/IPACK2011-52127
View Paper titled, The Effect of Under-Floor Obstructions on Data Center Perforated Tile Airflow
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Topics: Air flow, Data centers, Tiles, Cooling, Architecture, Computational fluid dynamics, Design, Flow (Dynamics), Leakage, Modeling
Proceedings Papers

Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM

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Anjali Chauhan, Bahgat Sammakia, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 225-234, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52137
https://doi.org/10.1115/IPACK2011-52137
View Paper titled, Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM
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Topics: Cooling, Microchannels, Heat sinks, Thermal management, Thermal resistance, Architecture, Cooling systems, Energy dissipation, Silicon
Proceedings Papers

Reliability Studies for Package-on-Package Components in Drop and Shock Environments

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Pradeep Lall, Arjun Angral, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 591-602, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52231
https://doi.org/10.1115/IPACK2011-52231
View Paper titled, Reliability Studies for Package-on-Package Components in Drop and Shock Environments
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Topics: Package on package, Reliability, Shock (Mechanics), Architecture, Electronics, Failure, Engineering simulation, Simulation, Warping, Design
Proceedings Papers

Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics

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Pradeep Lall, Dinesh Arunachalam, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 537-547, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52195
https://doi.org/10.1115/IPACK2011-52195
View Paper titled, Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics
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Topics: Alloys, Architecture, Ball-Grid-Array packages, Copper, Cycles, Design, Electronics, Failure data, Lead-free solders, Model development
Proceedings Papers

Optimal Fan Speed Control for Thermal Management of Servers

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Zhikui Wang, Cullen Bash, Niraj Tolia, Manish Marwah, Xiaoyun Zhu, Parthasarathy Ranganathan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 709-719, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89074
https://doi.org/10.1115/InterPACK2009-89074
View Paper titled, Optimal Fan Speed Control for Thermal Management of Servers
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Topics: Air flow, Architecture, Control equipment, Cooling, Data centers, Energy consumption, Fans, Feedback, Temperature, Thermal management
Proceedings Papers

Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration

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Pradeep Lall, Prashant Gupta, Arjun Angral, Jeff Suhling
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 857-871, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89298
https://doi.org/10.1115/InterPACK2009-89298
View Paper titled, Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration
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Topics: Electronics, Shock (Mechanics), Vibration, Failure, Damage, Solders, Principal component analysis, Failure mechanisms, Fracture (Process), Alloys