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Proceedings Papers

Fundamental Study on Practical Measurement Method of Anisotropic Thermal Conduction Performance Using Zig-Zag Jigs

Natsumi Kimura, Takashi Fukue, Haruki Yoshihiro, Koichi Hirasawa
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139742
https://doi.org/10.1115/IPACK2024-139742
View Paper titled, Fundamental Study on Practical Measurement Method of Anisotropic Thermal Conduction Performance Using Zig-Zag Jigs
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Topics: Anisotropy, Heat conduction, Jigs and fixtures, Steady state, Thermal conductivity
Proceedings Papers

Modelling Effect of Isothermal Aging of Anisotropic SaAgCu(SAC) Solder Joint Using Crystal Viscoplasticity

Aniket Bharamgonda, Abhijit Dasgupta, Yaxiong Chen, Torsten Hauck
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141036
https://doi.org/10.1115/IPACK2024-141036
View Paper titled, Modelling Effect of Isothermal Aging of Anisotropic SaAgCu(SAC) Solder Joint Using Crystal Viscoplasticity
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Topics: Anisotropy, Creep, Crystals, Modeling, Solder joints, Solders, Viscoplasticity
Proceedings Papers

Evaluation of Warpage Deformation in Semiconductor Device Packaging Process

Taiju Yagi, Qiang Yu, Haruyuki Shimada, Yuichi Yanaka, Takashi Masuko
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140852
https://doi.org/10.1115/IPACK2024-140852
View Paper titled, Evaluation of Warpage Deformation in Semiconductor Device Packaging Process
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Topics: Deformation, Finite element methods, Resins, Semiconductor device packaging, Semiconductors (Materials), Warping, Packaging, Shrinkage (Materials), Simulation, Anisotropy
Proceedings Papers

Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures

Pradeep Lall, Shriram Kulkarni, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111979
https://doi.org/10.1115/IPACK2023-111979
View Paper titled, Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures
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Topics: Adhesives, Anisotropy, Surface mount devices
Proceedings Papers

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94505
https://doi.org/10.1115/IPACK2022-94505
View Paper titled, Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints
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Topics: Anisotropy, Crystals, Electron backscatter diffraction, Shear (Mechanics), Solder joints
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Deformation Behavior of SAC305 Solder Joints With Multiple Grains

Debabrata Mondal, Abdullah Fahim, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2694
https://doi.org/10.1115/IPACK2020-2694
View Paper titled, Deformation Behavior of SAC305 Solder Joints With Multiple Grains
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Topics: Anisotropy, Deformation, Grain size, Solder joints
Proceedings Papers

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, Jaeho Lee
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6417
https://doi.org/10.1115/IPACK2019-6417
View Paper titled, Thermal Analysis of 3D ICs With TSVs Placement Optimization
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Topics: Algorithms, Anisotropy, Delays, Heat transfer, Integrated circuits, Optimization, Power density, Signals, Silicon, Simulated annealing
Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74133
https://doi.org/10.1115/IPACK2017-74133
View Paper titled, Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?
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Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling
Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74112
https://doi.org/10.1115/IPACK2017-74112
View Paper titled, Thermal Metamaterials for Heat Flow Control in Electronics
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Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design
Proceedings Papers

Mechanistic Modeling of the Anisotropic Steady State Creep Response of SnAgCu Single Crystal

Subhasis Mukherjee, Bite Zhou, Abhijit Dasgupta, Thomas R. Bieler
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48710
https://doi.org/10.1115/IPACK2015-48710
View Paper titled, Mechanistic Modeling of the Anisotropic Steady State Creep Response of SnAgCu Single Crystal
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Topics: Anisotropy, Creep, Crystals, Modeling, Steady state, Tin, Dislocations, Stress, Dislocation density, Nanoscale phenomena
Proceedings Papers

Modeling Thermal Spreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A070, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48422
https://doi.org/10.1115/IPACK2015-48422
View Paper titled, Modeling Thermal Spreading Resistance in Via Arrays
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Topics: Modeling, Boundary-value problems, Anisotropy, Computer simulation, Computer software, Electronic packages, Finite element analysis, Flow (Dynamics), Heat, Heat flux
Proceedings Papers

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic

Soud Farhan Choudhury, Leila Ladani
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73315
https://doi.org/10.1115/IPACK2013-73315
View Paper titled, Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic
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Topics: Crystals, Intermetallic compounds, Mechanical behavior, Tin, Solder joints, Electron backscatter diffraction, Nanoindentation, Anisotropy, Creep, Ductility
Proceedings Papers

A Comparison of Methods to Measure the Thermal Diffusivity of Anisotropic Graphite Heat Spreaders

Rick Beyerle, Martin Smalc, Ryan Wayne, R. A. Reynolds, III
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A022, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73093
https://doi.org/10.1115/IPACK2013-73093
View Paper titled, A Comparison of Methods to Measure the Thermal Diffusivity of Anisotropic Graphite Heat Spreaders
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Topics: Anisotropy, Flat heat pipes, Graphite, Measurement systems, Thermal diffusivity
Proceedings Papers

Cooling of a Many-Core Multiprocessor: Experimental Results for OLTP Workloads

Krishnamachar Sreenivasan
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A048, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73265
https://doi.org/10.1115/IPACK2013-73265
View Paper titled, Cooling of a Many-Core Multiprocessor: Experimental Results for OLTP Workloads
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Topics: Anisotropy, Clocks, Control equipment, Cooling, Differential equations, Flow (Dynamics), Heat, Heat conduction, Slabs, Storage
Proceedings Papers

Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the H -Integral Method

Toru Ikeda, Hiroshi Hirai, Mitsutoshi Abe, Masatsugu Chiba, Noriyuki Miyazaki
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 463-471, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52073
https://doi.org/10.1115/IPACK2011-52073
View Paper titled, Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the H -Integral Method
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Topics: Corners (Structural elements), Stress, Anisotropy, Piezoelectric materials, Eigenvalues, Electronic packages, Finite element methods, Microelectromechanical systems, Eigenfunctions, Failure
Proceedings Papers

A New Methodology for Cold Plate and Heat Sink Optimization

Jeremy Rice, Monem Alyaser
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 831-840, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89197
https://doi.org/10.1115/InterPACK2009-89197
View Paper titled, A New Methodology for Cold Plate and Heat Sink Optimization
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Topics: Heat sinks, Optimization, Computational fluid dynamics, Anisotropy, Convection, Fins, Fluids, Heat conduction, Heat transfer, Prandtl number
Proceedings Papers

Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times

Chunjian Ni, Jayathi Y. Murthy
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 99-109, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89181
https://doi.org/10.1115/InterPACK2009-89181
View Paper titled, Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times
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Topics: Anisotropy, Modeling, Phonons, Relaxation (Physics), Electromagnetic scattering, Radiation scattering, Scattering (Physics), Silicon, Accounting, Equilibrium (Physics)
Proceedings Papers

Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 353-359, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89079
https://doi.org/10.1115/InterPACK2009-89079
View Paper titled, Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection
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Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Fracture (Materials), Fatigue strength, Grain boundaries, Brittle fracture, Ductile fracture, Fatigue testing
Proceedings Papers

Coupled Electro-Thermal Simulation of MOSFETs

Chunjian Ni, Zlatan Aksamija, Jayathi Y. Murthy, Umberto Ravaioli
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 161-173, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89182
https://doi.org/10.1115/InterPACK2009-89182
View Paper titled, Coupled Electro-Thermal Simulation of MOSFETs
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Topics: Simulation, Phonons, Electrons, Heat, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Acoustics, Anisotropy, Heat conduction