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Proceedings Papers

Comparing Wire Bonding Strategies for High Power Applications

Whit Vinson, Frida Torres, David Huitink
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140965
https://doi.org/10.1115/IPACK2024-140965
View Paper titled, Comparing Wire Bonding Strategies for High Power Applications
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Topics: Alloys, Aluminum, Current density, Electrical resistivity, Electrodiffusion, Failure, Heating, Intermetallic compounds, Joules, Nickel
Proceedings Papers

Mechanical Characterization and Aging Behavior of iSAC Lead Free Solder

Golam Rakib Mazumder, Souvik Chakraborty, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A021, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141363
https://doi.org/10.1115/IPACK2024-141363
View Paper titled, Mechanical Characterization and Aging Behavior of iSAC Lead Free Solder
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Topics: Alloys, Creep, Elastic moduli, Lead-free solders, Nanoindentation, Stress
Proceedings Papers

Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, David Locker
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112036
https://doi.org/10.1115/IPACK2023-112036
View Paper titled, Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage
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Topics: Operating temperature, Solders, Storage, Alloys, Constitutive equations, Shock (Mechanics), Temperature, Aerospace industry, Automobiles, Climate
Proceedings Papers

Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates

Matthew Law, Sin Liang Soh, Wei Wang, Poh Seng Lee, Wen Feng Lu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111575
https://doi.org/10.1115/IPACK2023-111575
View Paper titled, Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates
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Topics: Additive manufacturing, Fins, Plates (structures), Printing, Surface roughness, Thermal resistance, Cooling, Graphics processing units, Copper, Machining
Proceedings Papers

Evolution in Lead-Free Solder Alloys Subjected to Both Mechanical Cycling and Aging

Mahbub Alam Maruf, Golam Rakib Mazumder, Souvik Chakraborty, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112023
https://doi.org/10.1115/IPACK2023-112023
View Paper titled, Evolution in Lead-Free Solder Alloys Subjected to Both Mechanical Cycling and Aging
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Topics: Alloys, Lead-free solders, Nanoindentation
Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97452
https://doi.org/10.1115/IPACK2022-97452
View Paper titled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97438
https://doi.org/10.1115/IPACK2022-97438
View Paper titled, High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C
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Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry
Proceedings Papers

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97449
https://doi.org/10.1115/IPACK2022-97449
View Paper titled, Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days
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Topics: Mechanical properties, Solders, Temperature, Alloys, Storage, Aerospace industry, Automotive industry, Constitutive equations, Finite element analysis, Low temperature materials
Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Jingjing Shi, Anusha Krishnan, A. F. M. Anhar Uddin Bhuiyan, Yee Rui Koh, Kenny Huynh, Akhil Mauze, Sai Mu, Brian M. Foley, Habib Ahmad, Takeki Itoh, Yuewei Zhang, Chao Yuan, Samuel Kim, W. Alan Doolittle, Chris Van de Walle, James S. Speck, Mark Goorsky, Patrick Hopkins, Hongping Zhao, Samuel Graham
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74116
https://doi.org/10.1115/IPACK2021-74116
View Paper titled, Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces
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Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium
Proceedings Papers

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73548
https://doi.org/10.1115/IPACK2021-73548
View Paper titled, Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys
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Topics: Alloys, Creep, Lead-free solders, Stress-strain curves, Temperature
Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73456
https://doi.org/10.1115/IPACK2021-73456
View Paper titled, Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q
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Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis
Proceedings Papers

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A022, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74069
https://doi.org/10.1115/IPACK2021-74069
View Paper titled, Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months
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Topics: Low temperature, Mechanical properties, Storage, Temperature, Alloys, Solders, Avionics, Climate, Design, Electronic packages
Proceedings Papers

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74068
https://doi.org/10.1115/IPACK2021-74068
View Paper titled, Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage
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Topics: Alloys, High temperature, Low temperature materials, Solders, Storage
Proceedings Papers

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73348
https://doi.org/10.1115/IPACK2021-73348
View Paper titled, Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints
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Topics: Intermetallic compounds, Lead-free solders, Solder joints, Alloys, Reliability, Copper, Elastic moduli, Electronic packaging, Nanoindentation, Polishing
Proceedings Papers

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A020, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74067
https://doi.org/10.1115/IPACK2021-74067
View Paper titled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
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Topics: Alloys, High temperature, Mechanical properties, Shock (Mechanics), Solders, Temperature, Testing, Vibration, Viscoplasticity
Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2695
https://doi.org/10.1115/IPACK2020-2695
View Paper titled, Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging
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Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2658
https://doi.org/10.1115/IPACK2020-2658
View Paper titled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
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Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines
Proceedings Papers

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2659
https://doi.org/10.1115/IPACK2020-2659
View Paper titled, High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging
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Topics: Alloys, Avionics, Climate, Design, Electronic packages, Electronic packaging, High temperature, Lead-free solders, Low temperature, Low temperature materials
Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2660
https://doi.org/10.1115/IPACK2020-2660
View Paper titled, High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging
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Topics: High temperature, Mechanical properties, Testing, Alloys, Operating temperature, Solders, Stress, Aerospace industry, Biomedicine, Electronic components
Proceedings Papers

Feature Vector Identification and Prognostics of SAC305 PCB’s for Varying Conditions of Temperature and Vibration Loads

Pradeep Lall, Tony Thomas, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2679
https://doi.org/10.1115/IPACK2020-2679
View Paper titled, Feature Vector Identification and Prognostics of SAC305 PCB’s for Varying Conditions of Temperature and Vibration Loads
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Topics: Alloys, Stress, Temperature, Vibration