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Proceedings Papers

A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC

David Geb, Subodh Deodhar, Nitin Netake, Tejas Jeurkar
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140403
https://doi.org/10.1115/IPACK2024-140403
View Paper titled, A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC
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Topics: Simulation, Thermal management, Cooling, Design, Algorithms, Control equipment, Temperature, Heat, Integrated circuits, Sensors
Proceedings Papers

Thermal Property Estimation of Thin Layered Structures by Means of Thermoreflectance Measurement and NID Algorithm

Daiki Higuma, João Vitor Thomsen Silveira, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111269
https://doi.org/10.1115/IPACK2023-111269
View Paper titled, Thermal Property Estimation of Thin Layered Structures by Means of Thermoreflectance Measurement and NID Algorithm
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Topics: Algorithms, Thermal properties, Thermoreflectance
Proceedings Papers

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Youssef Maniar, Alexander Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan, Peter Binkele, Siegfried Schmauder
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73100
https://doi.org/10.1115/IPACK2021-73100
View Paper titled, Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading
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Topics: Damage, Failure, Modeling, Solder joints, Thermomechanics, Finite element analysis, Simulation, Stress, Deformation, Solders
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2581
https://doi.org/10.1115/IPACK2020-2581
View Paper titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, Jaeho Lee
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6417
https://doi.org/10.1115/IPACK2019-6417
View Paper titled, Thermal Analysis of 3D ICs With TSVs Placement Optimization
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Topics: Algorithms, Anisotropy, Delays, Heat transfer, Integrated circuits, Optimization, Power density, Signals, Silicon, Simulated annealing
Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6347
https://doi.org/10.1115/IPACK2019-6347
View Paper titled, Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs
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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits
Proceedings Papers

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L., Huanyu Liao, Ganesh Subbarayan
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6501
https://doi.org/10.1115/IPACK2019-6501
View Paper titled, Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior
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Topics: Algorithms, Particulate matter, Packing (Shipments), Packings (Cushioning), Nonlinear programming, Optimization algorithms, Simulation, Computer programming, Gradient methods, Heat
Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8337
https://doi.org/10.1115/IPACK2018-8337
View Paper titled, On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties
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Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors
Proceedings Papers

Weather Analysis Using Neural Networks for Modular Data Centers

Feyisola Adejokun, Ashwin Siddarth, Abhishek Guhe, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8253
https://doi.org/10.1115/IPACK2018-8253
View Paper titled, Weather Analysis Using Neural Networks for Modular Data Centers
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Topics: Artificial neural networks, Data centers, Cooling, Evaporative cooling, Cooling systems, Neural network models, Temperature, Algorithms, Computation, Control systems
Proceedings Papers

Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling

Chienchih Chen, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8398
https://doi.org/10.1115/IPACK2018-8398
View Paper titled, Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling
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Topics: Finite element analysis, Solder joints, Simulation, Electronic packaging, Stress, Algorithms, Alloys, Ball-Grid-Array packaging, Computers, Density
Proceedings Papers

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74058
https://doi.org/10.1115/IPACK2017-74058
View Paper titled, Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System
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Topics: Electronic systems, Sensors, Silicon, Stress, Algorithms, Delamination, Failure, Vehicles, Accelerated life testing, Acoustics
Proceedings Papers

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74239
https://doi.org/10.1115/IPACK2017-74239
View Paper titled, PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads
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Topics: Stress, Temperature, Vibration, Failure, Signals, Time-frequency analysis, Algorithms, Independent component analysis, Dimensions, Filtration
Proceedings Papers

Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling

Mark E. Steinke, Vinod Kamath, Lynn Parnell
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A030, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48466
https://doi.org/10.1115/IPACK2015-48466
View Paper titled, Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling
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Topics: Cooling, Water, Design, Air flow, Heat, Energy consumption, Energy efficiency, Stress, Algorithms, Boundary-value problems
Proceedings Papers

Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages

Bahar Öner, Hakan Ertürk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A055, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48333
https://doi.org/10.1115/IPACK2015-48333
View Paper titled, Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages
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Topics: Electronic packages, Nondestructive evaluation, Thermal diffusion, Heat, Acoustics, Algorithms, Contact resistance, Density, Energy dissipation, Flat heat pipes
Proceedings Papers

Co-Placement for Pin-Fin Based Micro-Fluidically Cooled 3D ICs

Zhiyuan Yang, Ankur Srivastava
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A036, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48354
https://doi.org/10.1115/IPACK2015-48354
View Paper titled, Co-Placement for Pin-Fin Based Micro-Fluidically Cooled 3D ICs
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Topics: Algorithms, Cooling, Design, Flow (Dynamics), Gates (Closures), Heat, Pins (Engineering), Silicon, Temperature, Temperature uniformity
Proceedings Papers

Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels

Mirco Magnini, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48033
https://doi.org/10.1115/IPACK2015-48033
View Paper titled, Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels
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Topics: Boiling, Computational fluid dynamics, Engineering simulation, Heat transfer, Microchannels, Simulation, Slug flows, Bubbles, Evaporation, Flow (Dynamics)
Proceedings Papers

Reliability of Interconnections Made of Sintered Silver Nano Particles

Przemyslaw K. Matkowski, Tomasz Falat, Andrzej Moscicki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48795
https://doi.org/10.1115/IPACK2015-48795
View Paper titled, Reliability of Interconnections Made of Sintered Silver Nano Particles
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Topics: Nanoparticles, Reliability, Silver, Sensors, Algorithms, Chain, Coating processes, Coatings, Computerized tomography, Failure mechanisms
Proceedings Papers

Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging

Pradeep Lall, Peter Sakalaukus, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73250
https://doi.org/10.1115/IPACK2013-73250
View Paper titled, Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging
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Topics: Algorithms, Aluminum, Capacitance, Capacitors, Climate, Damage, Electrical components, Failure, High temperature, Service life (Equipment)
Proceedings Papers

A Minimal Order Model From Zero to High Frequencies for Finite-Element Based Analysis of General 3-D Electromagnetic Problems

Feng Sheng, Dan Jiao
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73177
https://doi.org/10.1115/IPACK2013-73177
View Paper titled, A Minimal Order Model From Zero to High Frequencies for Finite-Element Based Analysis of General 3-D Electromagnetic Problems
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Topics: Finite element analysis, Design, Finite element methods, Algorithms, Approximation, Errors, Frequency-domain analysis, Integrated circuits, Linear systems, Modeling
Proceedings Papers

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability

Pradeep Lall, Ryan Lowe, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A019, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73252
https://doi.org/10.1115/IPACK2013-73252
View Paper titled, Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability
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Topics: Algorithms, Reliability, Kalman filters, Ball-Grid-Array packaging, Failure, Filters, Particulate matter, Printed circuit boards, Service life (Equipment), Solder joints