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Proceedings Papers

The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets

Victor Adrian Chiriac, Jorge Luis Rosales
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 357-365, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52262
https://doi.org/10.1115/IPACK2011-52262
View Paper titled, The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets
Open the PDF for The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets in another window
Topics: Air jets, Cooling, Jets, Microelectronic devices
Proceedings Papers

Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics

Yogen Utturkar, Mehmet Arik, Tunc Icoz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 973-984, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89322
https://doi.org/10.1115/InterPACK2009-89322
View Paper titled, Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics
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Topics: Design, Electronics, Heat sinks, Cooling, Air jets, Computer simulation, Condensation, Dynamics (Mechanics), Electronic systems, Energy dissipation
Proceedings Papers

A Numerical Comparison of 2D and 3D Unsteady Confined Impinging Air Jets and Associated Microelectronics Cooling Impact

Victor Adrian Chiriac, Jorge Luis Rosales
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 811-818, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33708
https://doi.org/10.1115/IPACK2007-33708
View Paper titled, A Numerical Comparison of 2D and 3D Unsteady Confined Impinging Air Jets and Associated Microelectronics Cooling Impact
Open the PDF for A Numerical Comparison of 2D and 3D Unsteady Confined Impinging Air Jets and Associated Microelectronics Cooling Impact in another window
Topics: Air jets, Buckling, Cooling, Dimensions, Engineering simulation, Flow (Dynamics), Heat, Heat transfer, Jets, Microelectronic devices
Proceedings Papers

The Cooling Impact of a Pair of Opposed Unsteady Confined Impinging Air Jets

Victor Chiriac, Jorge L. Rosales
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 461-467, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73310
https://doi.org/10.1115/IPACK2005-73310
View Paper titled, The Cooling Impact of a Pair of Opposed Unsteady Confined Impinging Air Jets
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Topics: Air jets, Cooling, Jets, Reynolds number, Flow (Dynamics), Heat transfer, Unsteady flow, Bubbles, Convection, Displacement
Proceedings Papers

A Novel Microelectronics Cooling Technique Using a Pair of Unsteady Confined Impinging Air Jets

Jorge L. Rosales, Victor A. Chiriac
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 381-387, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35183
https://doi.org/10.1115/IPACK2003-35183
View Paper titled, A Novel Microelectronics Cooling Technique Using a Pair of Unsteady Confined Impinging Air Jets
Open the PDF for A Novel Microelectronics Cooling Technique Using a Pair of Unsteady Confined Impinging Air Jets in another window
Topics: Air jets, Cooling, Microelectronic devices, Jets, Reynolds number, Heat transfer, Flow (Dynamics), Heat, Bubbles, Heat transfer coefficients