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Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97587
https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow

E. A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, M. Arik
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2569
https://doi.org/10.1115/IPACK2020-2569
View Paper titled, An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow
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Topics: Air flow, Computer cooling, Cooling, Design, Fins, Flow (Dynamics), Forced convection, Heat flux, Heat sinks, Heat transfer
Proceedings Papers

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

Devdatta P. Kulkarni, Priyanka Tunuguntla, Guixiang Tan, Casey Carte
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6530
https://doi.org/10.1115/IPACK2019-6530
View Paper titled, Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink
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Topics: Cooling, Heat sinks, Maintainability, Thermal management, Data centers, Heat pipes, Air flow, Boundary-value problems, Computers, Design
Proceedings Papers

Dynamic Control of Airflow Balance in Data Centers

Stephen Paul Linder, Jim Van Gilder, Yan Zhang, Enda Barrett
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6304
https://doi.org/10.1115/IPACK2019-6304
View Paper titled, Dynamic Control of Airflow Balance in Data Centers
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Topics: Air flow, Containment, Data centers, Flow (Dynamics)
Proceedings Papers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8436
https://doi.org/10.1115/IPACK2018-8436
View Paper titled, Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization
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Topics: Air flow, Data centers, Density, Flow simulation, Particulate matter, Cooling, Contamination, Air conditioning, Carbon, Computer software
Proceedings Papers

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8305
https://doi.org/10.1115/IPACK2018-8305
View Paper titled, Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling
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Topics: Cooling, Data centers, Energy efficiency, Temperature, Stress, Energy consumption, Internet of things, Air conditioning, Air flow, Cloud computing
Proceedings Papers

Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation

Mohammad Tradat, Bahgat Sammakia, Husam Alissa, Kourosh Nemati
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8334
https://doi.org/10.1115/IPACK2018-8334
View Paper titled, Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation
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Topics: Cooling, Data centers, Experimental analysis, Failure, Instrumentation, Cooling systems, Temperature, Containment, Equipment performance, Pressure
Proceedings Papers

A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers

Mullaivendhan Varadharasan, Dereje Agonafer, Ahmed Al Khazraji, Jimil Shah, Ashwin Siddarth, James Hoverson, Mike Kaler
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8378
https://doi.org/10.1115/IPACK2018-8378
View Paper titled, A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers
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Topics: Cooling, Data centers, Thermomechanics, Flow (Dynamics), Incrustations, Temperature, Wetting, Air flow, Evaporative cooling, Water
Proceedings Papers

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8422
https://doi.org/10.1115/IPACK2018-8422
View Paper titled, Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study
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Topics: Containment systems, Design, Air flow, Containment, Cooling, Fans, Leakage, Sensors, Control equipment, Data centers
Proceedings Papers

CFD Optimization of the Cooling of Yosemite Open Compute Server

Aditya Gupta, Ananthavijayan Sridhar, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74254
https://doi.org/10.1115/IPACK2017-74254
View Paper titled, CFD Optimization of the Cooling of Yosemite Open Compute Server
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Topics: Computational fluid dynamics, Cooling, Optimization, Air flow, Data centers, Design, Energy consumption, Flow (Dynamics), Fans, Modeling
Proceedings Papers

Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A021, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74339
https://doi.org/10.1115/IPACK2017-74339
View Paper titled, Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles
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Topics: Design, Tiles, Air flow, Computational fluid dynamics, Containment, Cooling, Data centers, Density, Engineering simulation, Flow (Dynamics)
Proceedings Papers

Design Analysis and Performance Evaluation of a Data Center With Indirect Evaporative Cooling

Fatemeh Tavakkoli, Siavash Ebrahimi, Xiaogang Sun, Yan Cui, Ali Heydari
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74295
https://doi.org/10.1115/IPACK2017-74295
View Paper titled, Design Analysis and Performance Evaluation of a Data Center With Indirect Evaporative Cooling
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Topics: Data centers, Design, Evaporative cooling, Performance evaluation, Cooling, Computational fluid dynamics, Water, Air flow, Air pollution, Cooling systems
Proceedings Papers

Data Center Cooling Efficiency With Simulation-Based Optimization

Laurent M. Billet, Christopher M. Healey, James W. VanGilder, Zachary M. Pardey
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48425
https://doi.org/10.1115/IPACK2015-48425
View Paper titled, Data Center Cooling Efficiency With Simulation-Based Optimization
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Topics: Cooling, Data centers, Optimization, Simulation, Energy consumption, Air flow, Cooling systems, Pressure, Sensors, Temperature
Proceedings Papers

A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System

Chang-Woo Han, You-Lim Moon, Seung-Boong Jeong, Jong-Hee Han
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48085
https://doi.org/10.1115/IPACK2015-48085
View Paper titled, A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System
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Topics: Porous materials, Power conversion systems, Simulation models, Thermofluids, Heat sinks, Air flow, Power semiconductor devices, Temperature, Computation, Computer simulation
Proceedings Papers

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat Sammakia, Mark Seymour
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A041, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48244
https://doi.org/10.1115/IPACK2015-48244
View Paper titled, Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet
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Topics: Computer simulation, Cooling, Data centers, Heat, Air flow, Energy dissipation, Leakage, Water, Boundary-value problems, Computational fluid dynamics
Proceedings Papers

Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption

Hamza Salih Erden, H. Ezzat Khalifa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A026, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48430
https://doi.org/10.1115/IPACK2015-48430
View Paper titled, Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption
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Topics: Capacitance, Modeling, Parameter estimation, Water, Data centers, Transients (Dynamics), Air flow, Computers, Cooling, Failure
Proceedings Papers

Rack Server Solution in Data Center

Sheng Kang, Guofeng Chen, Chun Wang, Ruiquan Ding, Jiajun Zhang, Pinyan Zhu, Chao Liu, Nishi Ahuja
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A042, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48258
https://doi.org/10.1115/IPACK2015-48258
View Paper titled, Rack Server Solution in Data Center
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Topics: Data centers, Cooling, Energy consumption, Design, Fans, Air flow, Energy efficiency, Server racks, Cloud computing, Heat
Proceedings Papers

Energy Efficiency and Air Quality Considerations in Airside Economized Data Centers

Levente J. Klein, Sergio A. Bermudez, Fernando J. Marianno, Hendrik F. Hamann, Prabjit Singh
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48349
https://doi.org/10.1115/IPACK2015-48349
View Paper titled, Energy Efficiency and Air Quality Considerations in Airside Economized Data Centers
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Topics: Air pollution, Data centers, Energy efficiency, Cooling, Corrosion, Temperature, Sensors, Air conditioning, Air flow, Contamination
Proceedings Papers

Development of a Raised-Floor Plenum Design Tool

James W. VanGilder, Xuanhang (Simon) Zhang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A027, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48432
https://doi.org/10.1115/IPACK2015-48432
View Paper titled, Development of a Raised-Floor Plenum Design Tool
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Topics: Design, Air flow, Tiles, Computational fluid dynamics, Cables, Construction, Cooling, Engineering simulation, Flow (Dynamics), Leakage
Proceedings Papers

Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks

Tianyi Gao, James Geer, Russell Tipton, Bruce Murray, Bahgat G. Sammakia, Alfonso Ortega, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48071
https://doi.org/10.1115/IPACK2015-48071
View Paper titled, Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks
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Topics: Cooling, Data centers, Temperature, Heat, Air flow, Computational fluid dynamics, Cooling systems, Stress, Computer simulation, Density