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Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Paper No: IPACK2018-8436
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Paper No: IPACK2018-8305
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017
Paper No: IPACK2017-74108
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, August 29–September 1, 2017
Paper No: IPACK2017-74341
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A034, July 6–9, 2015
Paper No: IPACK2015-48049
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A033, July 6–9, 2015
Paper No: IPACK2015-48593
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A019, July 6–9, 2015
Paper No: IPACK2015-48349
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A020, July 6–9, 2015
Paper No: IPACK2015-48364
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A043, July 6–9, 2015
Paper No: IPACK2015-48377
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A021, July 16–18, 2013
Paper No: IPACK2013-73090
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A008, July 16–18, 2013
Paper No: IPACK2013-73116
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A054, July 16–18, 2013
Paper No: IPACK2013-73302
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A017, July 16–18, 2013
Paper No: IPACK2013-73208
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A025, July 16–18, 2013
Paper No: IPACK2013-73298
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 623-627, July 6–8, 2011
Paper No: IPACK2011-52210
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 489-496, July 6–8, 2011
Paper No: IPACK2011-52114
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 637-644, July 6–8, 2011
Paper No: IPACK2011-52213
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 497-504, July 6–8, 2011
Paper No: IPACK2011-52117
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 645-652, July 6–8, 2011
Paper No: IPACK2011-52234
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 585-593, July 6–8, 2011
Paper No: IPACK2011-52166