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Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6416
Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8254
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74279
Proceedings Papers
Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74073
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48712
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48628
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73125
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 35-44, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52124
Proceedings Papers
Philip Westby, Kevin Mattson, Fred Haring, Jacob Baer, Matt Steele, Syed Sajid Ahmad, Aaron Reinholz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 371-378, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89131
Proceedings Papers
Margaret Stern, Bob Melanson, Vadim Gektin, Paul Hundt, Carlos Arroyo, Vikas Gupta, Kazumi Nakayoshi, Lyndon Larson, Jesus Marin, David McDougall, Dorab Bhagwagar
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 309-317, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33629
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 917-922, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33678
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 719-723, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33057
Proceedings Papers
Tae Hyun Kim, Sung Yi, Jae Ky Roh, Chang Mu Jung, Yan Shuang Guo, Jae Chun Do, Jin Gu Kim, Shan Guo, Jupyo Hong
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1-8, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33034
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 687-692, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33262
Proceedings Papers
Harry Schoeller, Aaron Knobloch, Hua Xia, David Shaddock, Chris Kapusta, Kevin Durocher, Jungyun Cho
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 517-524, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33419
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 51-58, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33826
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1237-1252, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73348
Proceedings Papers
Swapan Bhattacharya, Mahesh Varadarajan, Premjeet Chahal, K. J. Lee, Ajanta Bhattacharjee, Rao R. Tummala, Suresh Sitaraman, John Papapolymerou, Manos Tentzeris, Joy Laskar
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1999-2004, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73500
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1881-1887, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73389
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