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Proceedings Papers

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Dag Andersson, Zsolt Toth-Pal, Mattias Forslund, Samer Shisha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A016, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8385
https://doi.org/10.1115/IPACK2018-8385
View Paper titled, Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices
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Topics: Failure mechanisms, Electronics, Reliability, Acoustics, Automotive industry, Cooling, Elastic moduli, Failure analysis, Heating, High temperature
Proceedings Papers

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74058
https://doi.org/10.1115/IPACK2017-74058
View Paper titled, Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System
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Topics: Electronic systems, Sensors, Silicon, Stress, Algorithms, Delamination, Failure, Vehicles, Accelerated life testing, Acoustics
Proceedings Papers

Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation

Pradeep Lall, Nakul Kothari, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74269
https://doi.org/10.1115/IPACK2017-74269
View Paper titled, Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation
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Topics: Damage, Shock (Mechanics), X-rays, Reliability, Deformation, Failure, Imaging, Manufacturing, Nondestructive evaluation, Service life (Equipment)
Proceedings Papers

Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations

Chin L. Ong, Raffaele L. Amalfi, Jackson B. Marcinichen, Nicolas Lamaison, John R. Thome
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74030
https://doi.org/10.1115/IPACK2017-74030
View Paper titled, Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations
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Topics: Cooling, Modeling, Simulation, Heat, Density, Energy dissipation, Flow (Dynamics), Temperature, Water, Acoustics
Proceedings Papers

Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages

Bahar Öner, Hakan Ertürk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A055, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48333
https://doi.org/10.1115/IPACK2015-48333
View Paper titled, Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages
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Topics: Electronic packages, Nondestructive evaluation, Thermal diffusion, Heat, Acoustics, Algorithms, Contact resistance, Density, Energy dissipation, Flat heat pipes
Proceedings Papers

The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study

Fernan Saiz, Cristina H. Amon
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48114
https://doi.org/10.1115/IPACK2015-48114
View Paper titled, The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study
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Topics: Gallium arsenide, Molecular dynamics, Thermal conductivity, Temperature, Acoustics, Density, Design, Electromagnetic scattering, Equilibrium (Physics), Heat
Proceedings Papers

Measuring Moisture Leakage Out of Water Cooling Hardware

Prabjit Singh, Michael Ellsworth
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48154
https://doi.org/10.1115/IPACK2015-48154
View Paper titled, Measuring Moisture Leakage Out of Water Cooling Hardware
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Topics: Cooling, Hardware, Leakage, Water, Computers, Cooling systems, Electronics, Acoustics, Coolants, Errors
Proceedings Papers

CMUTs in Permanent Contact Operation for High Output Pressure

Min-Chieh Ho, Maik Hoffmann, Alexander Unger, Kwan Kyu Park, Mario Kupnik, Butrus T. Khuri-Yakub
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48733
https://doi.org/10.1115/IPACK2015-48733
View Paper titled, CMUTs in Permanent Contact Operation for High Output Pressure
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Topics: Pressure, Transducers, Acoustics, Cavities, Ultrasonic transducers, Bonding, Cycles, Deflection, Displacement, High temperature
Proceedings Papers

Heat Transfer in Nanoelectronics by Quantum Mechanics

Thomas Prevenslik
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73173
https://doi.org/10.1115/IPACK2013-73173
View Paper titled, Heat Transfer in Nanoelectronics by Quantum Mechanics
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Topics: Heat transfer, Nanoelectronics, Quantum mechanics, Heat, Joules, Quantum electrodynamics, Circuits, Phonons, Radiation (Physics), Temperature
Proceedings Papers

Reliability of Bonded Interfaces for Automotive Power Electronics

Douglas DeVoto, Paul Paret, Sreekant Narumanchi, Mark Mihalic
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73143
https://doi.org/10.1115/IPACK2013-73143
View Paper titled, Reliability of Bonded Interfaces for Automotive Power Electronics
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Topics: Electronics, Reliability, Cycles, Acoustics, Adhesives, Carbon fibers, Silver, Thermal resistance, Copper, Damage
Proceedings Papers

Maximizing Data Center Energy Efficiency by Utilizing New Thermal Management and Acoustic Control Methodology

Jason A. Matteson, Aparna Vallury, Billy Medlin
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73134
https://doi.org/10.1115/IPACK2013-73134
View Paper titled, Maximizing Data Center Energy Efficiency by Utilizing New Thermal Management and Acoustic Control Methodology
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Topics: Acoustics, Data centers, Energy efficiency, Thermal management
Proceedings Papers

Experimental Study of the Convective Heat Transfer From a Geometrically Scaled Up 2D Impinging Synthetic Jet

Luis Silva, Alfonso Ortega, Isaac Rose
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A030, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73139
https://doi.org/10.1115/IPACK2013-73139
View Paper titled, Experimental Study of the Convective Heat Transfer From a Geometrically Scaled Up 2D Impinging Synthetic Jet
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Topics: Acoustics, Actuators, Air flow, Computer simulation, Convection, Cooling, Cycles, Flow (Dynamics), Fluids, Geometry
Proceedings Papers

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

Ahmad Jalilvand, Masataka Mochizuki, Yuji Saito, Yoji Kawahara, Vijit Wuttijumnong, Thang Nguyen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 367-375, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52267
https://doi.org/10.1115/IPACK2011-52267
View Paper titled, Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan
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Topics: Diluents, Heat pipes, Cooling, Laptop computers, Packaging, Acoustics, Condensers (steam plant), Density, Flat heat pipes, Heat
Proceedings Papers

Design, Reliability and Manufacturing Readiness for MEMS Microphone

Ganesh Iyer, Wei Li, Lavanya Gopalakrishnan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 369-374, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52002
https://doi.org/10.1115/IPACK2011-52002
View Paper titled, Design, Reliability and Manufacturing Readiness for MEMS Microphone
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Topics: Design, Manufacturing, Microelectromechanical systems, Microphones, Reliability, Signals, Acoustics, Condensers (steam plant)
Proceedings Papers

Frequency Resolved Phonon Transport in Si/Ge Nanocomposites

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 757-768, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52244
https://doi.org/10.1115/IPACK2011-52244
View Paper titled, Frequency Resolved Phonon Transport in Si/Ge Nanocomposites
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Topics: Nanocomposites, Phonons, Thermal conductivity, Mean free path, Acoustics, Approximation, Density, Electromagnetic scattering, Engineering simulation, Equilibrium (Physics)
Proceedings Papers

Thermal Conductivity Reduction in Few-Layer Graphene

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 769-778, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52245
https://doi.org/10.1115/IPACK2011-52245
View Paper titled, Thermal Conductivity Reduction in Few-Layer Graphene
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Topics: Graphene, Thermal conductivity, Phonons, Acoustics, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Accounting, Graphite, Harmonics (Music)
Proceedings Papers

System Level Thermal Design Challenges in Validation Platforms

Rahima K. Mohammed, Ridvan A. Sahan, Ying-Feng Pang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1077-1086, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89412
https://doi.org/10.1115/InterPACK2009-89412
View Paper titled, System Level Thermal Design Challenges in Validation Platforms
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Topics: Design, Cooling, Engineering simulation, Simulation, Computational fluid dynamics, Semiconductor industry, Silicon, Acoustics, Cables, Heating
Proceedings Papers

Numerical Analysis of Mist-Cooled High Power Components in Cabinets

Niru Kumari, Vaibhav Bahadur, Marc Hodes, Todd Salamon, Alan Lyons, Paul Kolodner, Suresh V. Garimella
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 933-944, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89269
https://doi.org/10.1115/InterPACK2009-89269
View Paper titled, Numerical Analysis of Mist-Cooled High Power Components in Cabinets
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Topics: Numerical analysis, Flow (Dynamics), Heat sinks, Drops, Evaporation, Telecommunications, Thermal management, Acoustics, Circuits, Cooling
Proceedings Papers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 985-991, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89340
https://doi.org/10.1115/InterPACK2009-89340
View Paper titled, Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection
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Topics: Mixed convection, Solar energy, Stress, Telecommunications, Construction, Cooling systems, Electronics, Optical instruments, Acoustics, Air conditioning
Proceedings Papers

Coupled Electro-Thermal Simulation of MOSFETs

Chunjian Ni, Zlatan Aksamija, Jayathi Y. Murthy, Umberto Ravaioli
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 161-173, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89182
https://doi.org/10.1115/InterPACK2009-89182
View Paper titled, Coupled Electro-Thermal Simulation of MOSFETs
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Topics: Simulation, Phonons, Electrons, Heat, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Acoustics, Anisotropy, Heat conduction