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Proceedings Papers

Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing

Pradeep Lall, Ved Soni, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 26–28, 2021

Paper No: IPACK2021-74088

DOI: https://doi.org/10.1115/IPACK2021-74088

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Topics: Accelerated life testing, Flexible electronics, Lamination, Lithium-ion batteries

Proceedings Papers

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices

Alex Davila-Frias, Val Marinov, Om Prakash Yadav, Yuriy Atanasov

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 27–29, 2020

Paper No: IPACK2020-2525

DOI: https://doi.org/10.1115/IPACK2020-2525

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Topics: Design, Electronics, Failure analysis, Temperature, Stress, Failure, Testing, Accelerated life testing, Chain, Failure data

Proceedings Papers

Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources

Pradeep Lall, Ved Soni, Amrit Abrol, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 7–9, 2019

Paper No: IPACK2019-6570

DOI: https://doi.org/10.1115/IPACK2019-6570

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Topics: Accelerated life testing, Batteries, Cycles, Electronics, Energy efficiency, Flexible electronics, High temperature, Lithium-ion batteries, Medical devices, Regression models

Proceedings Papers

Double Side System in Package Development Challenge for Heterogeneous Integration

Feng Kao, Yu-Po Wang, Davidlion Wang, Jensen Tsai, Mike Tsai, Ryan Chiu, Eric He

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 7–9, 2019

Paper No: IPACK2019-6354

DOI: https://doi.org/10.1115/IPACK2019-6354

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Topics: System-in-package, Molding, Simulation, Accelerated life testing, Copper, Design, Energy dissipation, Internet of things, Manufacturing, Packaging

Proceedings Papers

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

Cody J. Marbut, Mahsa Montazeri, David Huitink

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 27–30, 2018

Paper No: IPACK2018-8275

DOI: https://doi.org/10.1115/IPACK2018-8275

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Topics: Fatigue failure, Reliability, Stress, Damage, Design, Fatigue, Finite element analysis, Solders, Failure, Flip-chip

Proceedings Papers

Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach

M. Niessner, G. Haubner, W. Hartner, S. Pahlke

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 27–30, 2018

Paper No: IPACK2018-8379

DOI: https://doi.org/10.1115/IPACK2018-8379

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Topics: Design, Radar, Reliability, Solder joints, Simulation, Laminates, Accelerated life testing, Ball-Grid-Array packaging, Materials properties, Mechanical properties

Proceedings Papers

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 29–September 1, 2017

Paper No: IPACK2017-74058

DOI: https://doi.org/10.1115/IPACK2017-74058

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Topics: Electronic systems, Sensors, Silicon, Stress, Algorithms, Delamination, Failure, Vehicles, Accelerated life testing, Acoustics

Proceedings Papers

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal

Paper No: IPACK2017-74264

DOI: https://doi.org/10.1115/IPACK2017-74264

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Topics: Printed circuit boards, Reliability, Solders, X-rays, Deformation, Electronics, Manufacturing, Solder joints, Computerized tomography, Heating

Proceedings Papers

FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, John L. Evans, Pradeep Lall

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A039, July 6–9, 2015

Paper No: IPACK2015-48620

DOI: https://doi.org/10.1115/IPACK2015-48620

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Topics: Finite element analysis, Reliability, Failure, Lead-free solders, Temperature, Accelerated life testing, Ball-Grid-Array packaging, Fracture (Materials), Lumber, Modeling

Proceedings Papers

Highly Manufacturable and Reliable CZT Detectors

Bill Burdick, Jeff Erlbaum, Kaustubh Nagarkar, Brian Yanoff, Liang Yin, Raj Bahadur, Esmaeil Heidari, Donna Sherman, James E. Simpson

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A007, July 16–18, 2013

Paper No: IPACK2013-73314

DOI: https://doi.org/10.1115/IPACK2013-73314

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Topics: Sensors, Reliability, Design, Finite element model, Manufacturing, Packaging, Radiation detectors, Semiconductors (Materials), Accelerated life testing, Ceramics

Proceedings Papers

Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests

Shinichi Fujiwara, Nobuhiko Chiwata, Masaru Fujiyoshi, Motoki Wakano, Hisashi Tanie

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 719-723, July 6–8, 2011

Paper No: IPACK2011-52110

DOI: https://doi.org/10.1115/IPACK2011-52110

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Topics: Copper, Cycles, Electrodiffusion, Solders, Intermetallic compounds, Solder joints, Current density, Joining, Reliability, Accelerated life testing

Proceedings Papers

Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

Bicheng Chen, Cemal Basaran

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 647-654, July 19–23, 2009

Paper No: InterPACK2009-89016

DOI: https://doi.org/10.1115/InterPACK2009-89016

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Topics: Interferometry, Nanoscale phenomena, Wavelet transforms, Resolution (Optics), Tensors, Accelerated life testing, Ball-Grid-Array packaging, Computer software, Design, Dynamic testing (Materials)

Proceedings Papers

The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading

Kayleen L. E. Helms, Ketan R. Shah, Dan Gerbus, Vasu S. Vasudevan, Jagadeesh Radhakrishnan, Will Berry

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 945-951, July 19–23, 2009

Paper No: InterPACK2009-89347

DOI: https://doi.org/10.1115/InterPACK2009-89347

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Topics: Ball-Grid-Array packaging, Damage, Electronic packages, Flip-chip, Shock (Mechanics), Design, Risk, Solder joints, Accelerated life testing, Alloys

Proceedings Papers

Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys

Yifei Zhang, Zijie Cai, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 959-976, July 19–23, 2009

Paper No: InterPACK2009-89373

DOI: https://doi.org/10.1115/InterPACK2009-89373

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Topics: Alloys, Mechanical behavior, Reliability, Temperature, Creep, Solders, Lead-free solders, Failure, Silver, Accelerated life testing

Proceedings Papers

Die Stress Variation During Thermal Cycling Reliability Tests

M. Kaysar Rahim, Jordan Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 481-492, July 8–12, 2007

Paper No: IPACK2007-33548

DOI: https://doi.org/10.1115/IPACK2007-33548

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Topics: Reliability, Stress, Sensors, Temperature, Cycles, Packaging, Electronic packaging, Solders, Accelerated life testing, Constitutive equations

Proceedings Papers

Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging

Hongtao Ma, Jeffrey C. Suhling, Yifei Zhang, Pradeep Lall, Michael J. Bozack

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 563-579, July 8–12, 2007

Paper No: IPACK2007-33545

DOI: https://doi.org/10.1115/IPACK2007-33545

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Topics: Lead-free solders, Temperature, Solders, Creep, Reliability, Solder joints, Alloys, Failure, Mechanical behavior, Mechanical properties

Proceedings Papers

Phase Change Metallic Alloy TIM2 Performance and Reliability

Chris G. Macris, Robert G. Ebel, Christopher B. Leyerle, John C. McCullough

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 415-422, July 8–12, 2007

Paper No: IPACK2007-33702

DOI: https://doi.org/10.1115/IPACK2007-33702

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Topics: Alloys, Reliability, Vehicles, Accelerated life testing, Contact resistance, Electrical measurement, Junctions, Metals, Performance characterization, Stress

Proceedings Papers

Mechanical Design and Analysis of Land Grid Array (LGA) Sockets

Vinayak Pandey, Sankara Subramanian, Sudarshan Rangaraj, Tod Byquist

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1005-1011, July 17–22, 2005

Paper No: IPACK2005-73360

DOI: https://doi.org/10.1115/IPACK2005-73360

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Topics: Accelerated life testing, Ball-Grid-Array packaging, Computer simulation, Design, Design engineering, Manufacturing, Optimization, Pins (Engineering), Reliability, Shock (Mechanics)

Proceedings Papers

Silicone Gel Thermal Interface Materials for High Heat Dissipation and Thermo-Mechanical Stress Management for Good Reliability Performance

J. C. Matayabas, Jr., Vassou LeBonheur

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1869-1873, July 17–22, 2005

Paper No: IPACK2005-73372

DOI: https://doi.org/10.1115/IPACK2005-73372

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Topics: Energy dissipation, Heat, Reliability, Silicones, Stress, Thermomechanics, Flat heat pipes, Packaging, Accelerated life testing, Clocks

Proceedings Papers

Chip Scale Package for Image Sensor Device

Yung-Ching Chao, John Liu, Yao-Jung Lee, De-Shin Liu, Jeff Wang, Ching-Yang Chen, Sam Huang, Alex Lu

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 993-998, July 17–22, 2005

Paper No: IPACK2005-73329

DOI: https://doi.org/10.1115/IPACK2005-73329

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Topics: Sensors, Bonding, Flip-chip, Flip-chip devices, Manufacturing, Metals, Optical glass, Reliability, Sealing (Process), Semiconductor wafers

NARROW

Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices

Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources

Double Side System in Package Development Challenge for Heterogeneous Integration

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling

Highly Manufacturable and Reliable CZT Detectors

Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests

Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading

Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys

Die Stress Variation During Thermal Cycling Reliability Tests

Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging

Phase Change Metallic Alloy TIM2 Performance and Reliability

Mechanical Design and Analysis of Land Grid Array (LGA) Sockets

Silicone Gel Thermal Interface Materials for High Heat Dissipation and Thermo-Mechanical Stress Management for Good Reliability Performance

Chip Scale Package for Image Sensor Device

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