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Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6424
https://doi.org/10.1115/IPACK2019-6424
View Paper titled, Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74273
https://doi.org/10.1115/IPACK2017-74273
View Paper titled, The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages
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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)
Proceedings Papers

Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver

Ruth H. Reed, Justin Raade, Benjamin Elkin, Van P. Carey
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48532
https://doi.org/10.1115/IPACK2015-48532
View Paper titled, Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver
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Topics: Flow (Dynamics), Glass, Heat, Heat transfer, High temperature, Modeling, Solar energy, Temperature, Viscosity, Fluids
Proceedings Papers

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

Jiaqi Wang, Jeffery C. C. Lo, S. W. Ricky Lee, Feng Yun, Mian Tao
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A046, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48664
https://doi.org/10.1115/IPACK2015-48664
View Paper titled, Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
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Topics: Absorption, Emissions, Light scattering, Light-emitting diodes, Modeling, Phosphors, Wavelength, Excitation, Emission spectra, Plates (structures)
Proceedings Papers

A Hybrid Absorption Cycle for Water Heating, Dehumidification, and Evaporative Cooling

Devesh Chugh, Rasool Nasr Isfahani, Kyle Gluesenkamp, Omar Abdelaziz, Saeed Moghaddam
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48816
https://doi.org/10.1115/IPACK2015-48816
View Paper titled, A Hybrid Absorption Cycle for Water Heating, Dehumidification, and Evaporative Cooling
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Topics: Absorption, Cycles, Dehumidification, Evaporative cooling, Hot water heating, Water, Heat, Heating, Hot water, Water vapor
Proceedings Papers

Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

Sevket Umut Yuruker, Mehmet Arik, Enes Tamdogan, Rustamjon Melikov, Sedat Nizamoglu, Daniel Aaron Press, Ilkem Durak
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48326
https://doi.org/10.1115/IPACK2015-48326
View Paper titled, Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems
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Topics: Cavities, Proteins, Silicones, Biomaterials, Computational fluid dynamics, Light-emitting diodes, Phosphors, Polymers, Thermal conductivity, Absorption
Proceedings Papers

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A040, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48626
https://doi.org/10.1115/IPACK2015-48626
View Paper titled, Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies
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Topics: Flip-chip, Flip-chip devices, Laminates, Simulation, Stress, Flip-chip assemblies, Diffusion (Physics), Storage, Temperature, Absorption
Proceedings Papers

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

Tejeshkumar Bagul, Kanan Pujara, Jimil Shah, Oluwaseun Awe, Dereje Agonafer
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A034, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48049
https://doi.org/10.1115/IPACK2015-48049
View Paper titled, Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination
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Topics: Absorption, Contamination, Corrosion, Data centers, Air conditioning, Gases, Reliability, Wheels, China, Circuits
Proceedings Papers

Heat Transfer in Nanoelectronics by Quantum Mechanics

Thomas Prevenslik
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73173
https://doi.org/10.1115/IPACK2013-73173
View Paper titled, Heat Transfer in Nanoelectronics by Quantum Mechanics
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Topics: Heat transfer, Nanoelectronics, Quantum mechanics, Heat, Joules, Quantum electrodynamics, Circuits, Phonons, Radiation (Physics), Temperature
Proceedings Papers

Assessment of the Energy Performance of Cogeneration Systems for Powering and Cooling Data Centers

Dale C. Ringham, Dan J. Rice, Brian S. Granetz, Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A022, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73268
https://doi.org/10.1115/IPACK2013-73268
View Paper titled, Assessment of the Energy Performance of Cogeneration Systems for Powering and Cooling Data Centers
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Topics: Cogeneration systems, Cooling, Data centers, Electricity (Physics), Exhaust systems, Turbines, Absorption, Combined heat and power, Heat, Heat exchangers
Proceedings Papers

High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

Vibhash Jha, Serguei Dessiatoun, Michael Ohadi, Amir Shooshtari, Ebrahim Al-Hajri
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 277-283, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52179
https://doi.org/10.1115/IPACK2011-52179
View Paper titled, High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications
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Topics: Heat recovery, Heat transfer, Flow (Dynamics), Heat transfer coefficients, Pressure drop, Refrigerants, Thermal management, Absorption, Cooling, Electronic products
Proceedings Papers

Fluidic Laser Beam Shaper by Using Thermal Lens Effect

Hong Duc Doan, Yoshihiko Akamine, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 749-755, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52214
https://doi.org/10.1115/IPACK2011-52214
View Paper titled, Fluidic Laser Beam Shaper by Using Thermal Lens Effect
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Topics: Laser beams, Lenses (Optics), Lasers, Pumps, Absorption, Probes, Refractive index, Optics, Temperature distribution
Proceedings Papers

Coupled Electro-Thermal Simulation of MOSFETs

Chunjian Ni, Zlatan Aksamija, Jayathi Y. Murthy, Umberto Ravaioli
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 161-173, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89182
https://doi.org/10.1115/InterPACK2009-89182
View Paper titled, Coupled Electro-Thermal Simulation of MOSFETs
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Topics: Simulation, Phonons, Electrons, Heat, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Acoustics, Anisotropy, Heat conduction
Proceedings Papers

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

Sadakazu Takakuwa, Masaru Ishizuka, Shinji Nakagawa, Kanji Takagi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 471-477, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89218
https://doi.org/10.1115/InterPACK2009-89218
View Paper titled, Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials
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Topics: Phase change materials, Thermal analysis, Fins, Temperature, Transients (Dynamics), Absorption, Cooling, Design, Electronic equipment, Energy dissipation
Proceedings Papers

Thermal Imaging of Two-Phase Coooled Microgap Channel Wall

Jessica Sheehan, Dae Whan Kim, Avram Bar-Cohen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 491-499, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89238
https://doi.org/10.1115/InterPACK2009-89238
View Paper titled, Thermal Imaging of Two-Phase Coooled Microgap Channel Wall
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Topics: Absorption, Coolers, Cooling, Dielectric liquids, Electronic components, Flow (Dynamics), Flux (Metallurgy), Heat, Heat flux, Imaging
Proceedings Papers

Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages

Tetsuya Kugimiya, Kenji Hirohata, Minoru Mukai, Eitaro Miyake, Hiroshi Akiba, Nobutada Ohno, Takashi Kawakami
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 185-190, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89384
https://doi.org/10.1115/InterPACK2009-89384
View Paper titled, Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages
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Topics: Fatigue, Reliability, Solders, Stress analysis (Engineering), Finite element analysis, Deformation, Metals, Molding materials, Absorption, Constitutive equations
Proceedings Papers

Miniaturized Refrigeration System With Absorption: Application to Microelectronics Cooling

Victor Chiriac, Florea Chiriac
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 87-92, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33726
https://doi.org/10.1115/IPACK2007-33726
View Paper titled, Miniaturized Refrigeration System With Absorption: Application to Microelectronics Cooling
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Topics: Absorption, Compressors, Cooling, Heat exchangers, Microelectronic devices, Refrigeration
Proceedings Papers

Thermal Degradation and Mass Transport of Underfill Material

Wen-Hao Lee, D. S. Liang, W. P. Wang, C. S. Hsiao
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 719-723, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33057
https://doi.org/10.1115/IPACK2007-33057
View Paper titled, Thermal Degradation and Mass Transport of Underfill Material
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Topics: Absorption, Adhesion, Bond strength, Bonding, Chain, Cracking (Materials), Diffusion (Physics), Epoxy adhesives, Epoxy resins, Failure
Proceedings Papers

Packaging of an Iron-Gallium Nanowire Acoustic Sensor for Under-Water Applications

Rupal Jain, F. Patrick McCluskey, Alison B. Flatau
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 825-829, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33455
https://doi.org/10.1115/IPACK2007-33455
View Paper titled, Packaging of an Iron-Gallium Nanowire Acoustic Sensor for Under-Water Applications
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Topics: Acoustics, Gallium, Iron, Nanowires, Packaging, Sensors, Water, Waves, Absorption, Ear
Proceedings Papers

Design of an Absorption Based Miniature Heat Pump System for Cooling of High Power Microprocessors

Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 69-77, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33245
https://doi.org/10.1115/IPACK2007-33245
View Paper titled, Design of an Absorption Based Miniature Heat Pump System for Cooling of High Power Microprocessors
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Topics: Absorption, Cooling, Design, Heat pumps, Condensers (steam plant), Microchannels, Fluids, Temperature, Water vapor, Compression