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Proceedings Papers
Enhanced Passive Cooling in Thermal Interface Materials via Encapsulated Phase Change Material Additives
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141296
Proceedings Papers
Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140918
Proceedings Papers
Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node
Available to PurchaseShrinath Shrinivas Ramdas, Tushar Chauhan, Mark Patterson, Dwayne R. Shirley, Lijuan Zhang, Roberto Coccioli
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141335
Proceedings Papers
Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures
Available to PurchaseKaiying Jiang, Daeyoung Kong, Sreekant Narumanchi, James Palko, Ercan M. Dede, Chulmin Ahn, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141329
Proceedings Papers
Topology Optimization of Electronic Line Using Computer Aided Engineering Software
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139338
Proceedings Papers
Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141130
Proceedings Papers
Passive Direct Liquid Cooling for High-Power Processors
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
Proceedings Papers
Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141881
Proceedings Papers
Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141879
Proceedings Papers
Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A032, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143310
Proceedings Papers
Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A031, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143308
Proceedings Papers
Comparing Wire Bonding Strategies for High Power Applications
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140965
Proceedings Papers
Effects of Package Position and Constraint Conditions on Fatigue Life of QFP Interconnect Structure Under Random Vibration
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140880
Proceedings Papers
Fundamental Study on Practical Measurement Method of Anisotropic Thermal Conduction Performance Using Zig-Zag Jigs
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139742
Proceedings Papers
Maturation of Pumped Two-Phase Liquid Cooling to Commercial Scale-Up Deployment
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141206
Proceedings Papers
Exploring the Impact of CRAH Unit Partial Failure in Hybrid-Cooled Data Centers
Available to PurchaseAli Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139031
Proceedings Papers
Microvia Geometry Assessment at High-Stress Substrate Locations in Printed Circuit Boards Under Thermomechanical Stresses
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139572
Proceedings Papers
Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology
Available to PurchaseAli Heydari, Omar Al-Zu'bi, Yaman Manaserh, Ahmad R. Gharaibeh, Russ Tipton, Mehdi Mehrabikermani, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141342
Proceedings Papers
Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling
Available to PurchaseYousaf Shah, Alfonso Ortega, Mehdi Mehrabi-kermani, Victor A. Martinez, Yaman Manaserh, Ali Heydari, Jeremy Rodriguez
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140277
Proceedings Papers
Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A028, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142108
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