Abstract
Current electronics packaging is not designed to sustain and operate at high temperatures above 150°C. However, in specialized applications, operation at extreme high and extreme low temperatures can be a requirement. Since the current electronics substrates are not high-temperature qualified, low-temperature co-fired ceramic (LTCC) can be used as a substrate for extreme-high-temp capable electronic circuits. Also, since traditional silicon carbide dies and package architectures would not sustain high temperatures, bare gallium nitride dies can be used. In this study, additively printed electronic circuits capable of operation at high temperatures have been attempted to be designed. Copper-clad LTCC has been used as the substrate of choice for fabricating these circuits. The circuit for this study was fabricated using the LPKF U4 Protolaser machine for laser patterning. Components are then attached to the patterned circuit using a transient liquid phase sintering (TLPS) paste, which sustains up to 600°C. The candidate circuit chosen for this study is a full-wave rectifier circuit. The fabricated circuits have been tested in a high-temperature kiln, and their performance is measured using an oscilloscope.
