Abstract
The Integrated Circuit (IC) packaging sector is experiencing heightened demand for compact, and efficient packages, driven by advancements in AI and 5G technologies. This necessitates smaller package component footprints and increased component density. For surface mount technology (SMT), solder volume optimization is crucial for component height control and mechanical performance, to ensure device integrity and longevity. Research indicates that solder volume during SMT integration affects joint quality, standoff height and reliability. For the SMT integration, some of the key current challenges in the industry are reducing the size and footprint of SMT components and simultaneously optimizing the solder volume in relation to the reduced size. The use of SMTs on both the die side and the BGA side of the package are also increasingly common. However, existing studies have not sufficiently tackled these complex issues. Additionally, there is a significant research gap concerning the optimization of solder volume for intricate SMT components, like deep trench capacitors (DTC). These gaps provide a potential area for further exploration and advancement in this domain. This paper presents a simulation-based approach for solder paste optimization that can support IC package design and development. Thus, aiming to cut development costs and shorten the time from development to deployment by using the model for proof-of-concept validation. Authors present an energy-based simulation approach for integrating SMT in IC packages, to address current industry design challenges. This approach was validated using two types of Multilayer ceramic capacitor (MLCC) capacitors and a deep trench capacitor (DTC), promising substantial cost and time reductions in package development.
