Abstract
Electronic components may be used continuously under high strain-rate loads, high ambient temperatures, and other conditions in the aerospace, military, automobile, space, and offshore oil industries. In addition, these components may be kept in uncontrolled climate enclosures before deployment. A long duration of storage has been found to cause the material characteristics of undoped SAC alloys to change, even at mild temperatures. To reduce the effects of aging, a number of dopants have been added to the compositions of SAC alloys. In this investigation, SAC-R, a doped SAC solder, has been stored at 50°C for a year before being put through high strain rate testing. Uniaxial tensile tests have been performed to determine the mechanical characteristics of SAC-R in samples that have aged for no aging and samples that have aged for up to 360 days. The experiment’s High and Low operating temperatures ranged from −65°C to 200°C. After computing the constants for the Anand Visco-Plasticity model using the experimental material data, the model’s predictions for the uniaxial tensile test were compared to the experimental data. In order to simulate the drop events using the Anand constitutive model, the material constitutive behavior has been implemented in a finite element framework. In order to track the course of damage in the solder interconnects, the plastic work per shock event has also been calculated. The shock event of a ball-grid array package on PCB assembly has been simulated using the constitutive model.
