Flexible Hybrid Electronics (FHE) have the potential to revolutionize the electronics industry by providing sustainable and efficient devices. However, the reliable interconnectivity between printed traces and surface-mount devices (SMD) remains a critical challenge for FHE. There is a need for more research on the use of printed water-based silver ink traces and bonding materials for component attachment in FHE, as the literature on this subject is limited. This study was conducted to compare the effects of different bonding materials on component attachment. The bonding materials investigated were electrically conductive adhesive (ECA) and low-temperature solder (LTS). The study used the direct write method to print silver pads, which were then used to attach components such as resistors, inductors, and capacitors using the bonding materials. Electrically conducted adhesive (ECA) results were compared to those of Low Temperature Solder (LTS). The interconnectivity of the attached components was evaluated by measuring their rating values before and after attachment. The findings of this study provide insights into the performance of different bonding materials for component attachment in FHE. Such insights can aid in the development of reliable and efficient interconnectivity methods for FHE, which can contribute to the widespread adoption of FHE in various industries.

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